Liquid encapsulated air cooled module

Claim 1

A liquid encapsulated air-cooled module comprising: a plurality of heat generating components mounted on a substrate; a container attached to said substrate in sealed relationship such that such substrate forms a vertical side wall to the inside of said container; said container having the side wall opposite said substrate sloped outward from bottom to top so that the container is wider at the top than at the bottom; a low boiling point dielectric liquid partially filling said container and completely covering Said heat generating components; a vapor space located above the liquid surface level; internal fins extending into said container from said sloped side wall substantially filling said container, said fins running vertically within said container so that a large fin area is in said vapor space providing a large condenser for said liquid vapors, said internal fins being reduced in surface area as the bottom of said container is approached thereby forming a combination condenser - subcooler below the liquid surface level; and external fins extending outward from said sloped side wall of said container and extending vertically so that air flows therebetween from bottom to top of said container, said sloped side wall acting as a turbulator for the upward flowing air.