US4828967A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic device and its manufacturing method
Assignee: Semiconductor Energy Laboratory Co Ltd
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Filing: 1986-06-17
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Granted: 1989-05-09
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Expires: 2006-06-17
Abstract
Abstract A method of forming an insulated, non-linear, multi-layered, electronic element on a transparent substrate by surrounding the element with a photocurable resin and exposing the photocurable resin to light from the side of the transparent substrate, the photocurable resin being heat-hardened before and after the light exposure thereof so that the resulting insulating layer prevents electrical short circuits between the layers of the non-linear, multi-layered, electronic element.
Inventors
- 👤 Akira Mase
- 👤 Toshimitsu Konuma
- 👤 Mitsunori Sakama
- 👤 Takashi Inushima
- 👤 Shunpei Yamazaki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 09:51
CPC Classifications
H; H10; H10D; H10D86/00
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
164 words
An electronic device manufacturing method comprising the steps of: providing a transparent substrate; forming at least one non-linear, multi-layered electronic element on a portion of said substrate, the transparence of said non-linear, multi-layered electronic element being substantially less than that of the substrate; coating said transparent substrate with a photocurable resin over at least the upper edge of said non-linear,layered electronic element; curing the part of said photocurable resin other than that on the upper surface of the non-linear multi-layered electronic element by exposure to illumination through said transparent substrate with said non-linear, mult-layered electronic element functioning as a mask; and removing uncured photocurable resin with a solvent so the cured part of the photocurable resin remains as an insulating film in close contact with all sides of the multi-layered electronic element, the contact between the insulating film and the sides of the non-linear, multi-layered electronic element being such that electrical shorts circuits between the layers of the non-linear multi-layered electronic element are prevented.
Claim 2
Dependent Claim
164 words
An electronic device manufacturing method comprising the steps of: providing a transparent substrate; forming at least one non-linear, multi-layered electronic element on a portion of said substrate, the transparence of said non-linear, multi-layered electronic element being substantially less than that of the substrate; coating said transparent substrate with a photocurable resin over at least the upper edge of said non-linear,layered electronic element; curing the part of said photocurable resin other than that on the upper surface of the non-linear multi-layered electronic element by exposure to illumination through said transparent substrate with said non-linear, mult-layered electronic element functioning as a mask; and removing uncured photocurable resin with a solvent so the cured part of the photocurable resin remains as an insulating film in close contact with all sides of the multi-layered electronic element, the contact between the insulating film and the sides of the non-linear, multi-layered electronic element being such that electrical shorts circuits between the layers of the non-linear multi-layered electronic element are prevented.
Claim 3
Dependent Claim
42 words
The manufacturing method according to claim 1 wherein the insulating film forming step further includes heat-hardening of the photocurable resin prior to the exposure of the resin and heat-hardening of the insulating film resulting from the removal of the uncured photocurable resin.
Claim 4
Dependent Claim
24 words
The manufacturing method according to claim 1 wherein the insulating film is formed thicker than the non-linear, multi-layered electronic element formed on the substrate.
Claim 5
Dependent Claim
36 words
The manufacturing method according to claim 1 wherein the insulating film is formed to a thickness on the substrate that is substantially the same as that of the non-linear, multi-layered electronic element formed on the substrate.
Claim 6
Dependent Claim
38 words
The manufacturing method according to claim 1 where said mult-layered electronic element has three layers where the first layer is an electrode adjacent the substrate, the second layer is a semiconductor, and the third layer is an electrode.
Claim 7
Dependent Claim
18 words
The manufacturing method according to claim 1 including forming a conductive electrode overlying said non-linear, multi-layer electronic element.
Claim 8
Dependent Claim
18 words
The manufacturing method according to claim 4 including forming a conductive electrode overlying said non-linear, multi-layer electronic element.
Claim 9
Dependent Claim
18 words
The manufacturing method according to claim 5 including forming a conductive electrode overlying said non-linear, multi-layer electronic element.
Claim 10
Dependent Claim
36 words
The manufacturing method as in claim 8 wherein the insulating film is formed to a thickness on the substrate that is substantially the same as that of the non-linear, multi-layered electronic element formed on the substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-05-08 | 1992-11-07 | 1993-05-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-05-08 | 1996-11-07 | 1997-05-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-05-08 | 2000-11-07 | 2001-05-09 | $7700.00 | Window Closed / Lapsed |