US4369247A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process of producing relief structures using polyamide ester resins
Assignee: EIDP Inc
•
Filing: 1981-12-24
•
Granted: 1983-01-18
•
Expires: 2001-12-24
Abstract
Abstract An improved process for forming relief structures on electrical devices such as capacitors, integrated circuits, printed circuits and semiconductors; a solution of a composition a polymeric heat resistant photopolymerizable composition of a polyamide ester resin containing photopolymerizable groups is applied to substrate such as a coated silicon wafer, which forms the base an electrical device, and is dried to form a film, the film is exposed to radiation through a pattern and photopolymerized; the unexposed and unpolymerized part of the film is dissolved off and the resulting relief structure is converted to a polyimide structure having a sharp definition and good mechanical, chemical and electrical properties; to reduce radiation exposure time and increase the rate of photopolymerization the following constituents are used in the composition: a radiation sensitive polymerizable polyfunctional acrylate compound and a photopolymerization initiator of an aromatic biimidazole.
Inventors
- 👤 David L. Goff
- 👤 Edward L. Yuan
- 👤 Stephen Proskow
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 15:55
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/60; H10P14/68; H10P14/683; C; C08; C08F; C08F290/00; C08F290/08; C08F290/14; C08F290/145; G; G03; G03F; G03F7/00; G03F7/004; G03F7/027; G03F7/032; G03F7/037; H10P14/63; H10P14/6326; H10P14/6342; H10P14/65; H10P14/6502; H10P14/6506
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
115 words
In a process for the formation of relief structures wherein the relief structure consists of a stable heat resistant polyimide material comprising the steps of applying a solvent soluble radiation sensitive polyamide ester resin composition to a substrate, drying the composition, exposing the composition to radiation through a pattern, dissolving the unradiated portions and converting the resulted relief structure to form a polyimide structure; the improvement used therewith is a radiation polymerizable composition consisting essentially of (a) a polyamide ester resin containing photopolymerizable groups; (b) solvent for the resin; (c) radiation sensitive polymerizable polyfunctional acrylate compound and (d) photopolymerization initiator of an aromatic biimidazole; wherein the polyamide ester resin being convertible to a polyimide resin.
Claim 2
Dependent Claim
115 words
In a process for the formation of relief structures wherein the relief structure consists of a stable heat resistant polyimide material comprising the steps of applying a solvent soluble radiation sensitive polyamide ester resin composition to a substrate, drying the composition, exposing the composition to radiation through a pattern, dissolving the unradiated portions and converting the resulted relief structure to form a polyimide structure; the improvement used therewith is a radiation polymerizable composition consisting essentially of (a) a polyamide ester resin containing photopolymerizable groups; (b) solvent for the resin; (c) radiation sensitive polymerizable polyfunctional acrylate compound and (d) photopolymerization initiator of an aromatic biimidazole; wherein the polyamide ester resin being convertible to a polyimide resin.
Claim 3
Dependent Claim
75 words
The process of claim 1 in which the polyamide ester resin comprises the following structure: ##STR2## wherein → denotes isomerism, R is an aromatic radical, R 1 is an organic radical containing a photo polymerizable olefinic double bond, R 2 is an aromatic, aliphatic or cycloaliphatic radical and n is a positive integer sufficiently large to provide the resin with a weight average molecular weight of about 5,000 to 75,000 determined by gel permeation chromatography.
Claim 4
Dependent Claim
33 words
The process of claim 2 in which the polyamide ester resin comprises R from pyromellitic dianhydride, R 1 from hydroxy alkyl methacrylate or hydroxy alkyl acrylate and R 2 from an aromatic diamine.
Claim 5
Dependent Claim
61 words
The process of claim 2 in which the polymerizable polyfunctional acrylate is selected from the group consisting of trimethylol propane trimethacrylate, trimethylol propane triacrylate, trimethylol propane ethoxylate trimethacrylate, trimethylol propane ethoxylate triacrylate, trimethylol propane polyethoxylate trimethacrylate, trimethylol propane polyethoxylate triacrylate, pentaerythritol triacrylate, polyethylene glycol diacrylate, triethylene glycol diacrylate, polyethylene glycol dimethyacrylate, polymethylene diacrylate, polymethylene dimethyacrylate, trimethylene glycol dimethacrylate and mixtures thereof.
Claim 6
Dependent Claim
25 words
The process of claim 3 in which the composition contains about 0.1-10% by weight, based on the weight of the resin of a leuco dye.
Claim 7
Dependent Claim
15 words
The process of claim 5 in which the leuco dye is an alkyl amino-aromatic alkane.
Claim 8
Dependent Claim
18 words
The process of claim 4 or 5 in which the photopolymerization initiator is bis(2-o-chlorophenyl-4,5-diphenyl imidazolyl) or bis[2-o-chloro-phenyl-4,5-di(m-methoxyphenyl) imidazolyl].
Claim 9
Dependent Claim
28 words
The process of claim 4 or 5 containing in addition to the photopolymerization initiator about 0.1-10% by weight based on the weight of the resin, of a photosensitizer.
Claim 10
Dependent Claim
81 words
The process of claim 2 in which the polyamide ester resin is of pyromellitic dianhydride esterified with hydroxyethyl methacrylate and reacted with oxydianiline, the polyfunctional acrylate compound is trimethylol propane polyethyoxylate having a weight average molecular weight of about 500-1500, the photopolymerization initiator is bis(2-o-chlorophenyl-4,5-diphenyl imidazolyl), and the composition contains about 0.1-10% by weight, based on the weight of the resin, of tris(diethyamino-o-tolyl) methane, and about 0.1-10% by weight, based on the weight of the resin, of a photosensitizer of tetramethyldiaminobenzophenone.
Claim 11
Dependent Claim
76 words
The process of claim 2 in which the polyamide ester is of pyromellitic dianhydride, esterified with hydroxy ethyl methacrylate and reacted with oxydianiline, the polyfunctional acrylate is trimethylol propane trimethacrylate or trimethylol propane triacrylate, the polymerization initiator is bis(2-o-chlorophenyl-4,5-diphenyl imidazolyl) and the composition contains about 0.1-10% by weight, based on the weight of the resin, of tris(diethyl amino-o-tolyl) methane and about 0.1-10% by weight, based on the weight of the resin, of a photosensitizer of tetramethyldiaminobenzophenzophenone.
References Cited (Backward Citations)
US3784557A
Cited
US3594410A
Cited
US3380831A
Cited
US3479185A
Cited
US3552973A
Cited
US3623870A
Cited
US3957512A
Cited
US3953877A
Cited
US4040831A
Cited
US4093461A
Cited
US4188224A
Cited
US4117196A
Cited
US4132812A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-01-17 | 1986-07-19 | 1987-01-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-01-17 | 1990-07-19 | 1991-01-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-01-17 | 1994-07-19 | 1995-01-18 | $7700.00 | Window Closed / Lapsed |