Method for the preparation of relief structures

Claim 1

In a method for the preparation of relief structures consisting of highly heat resistant polymers comprising the steps of applying a soluble, photo or radiation-sensitive prepolymer in the form of a film or foil to a substrate, said prepolymer being a poly-addition or polycondensation prepolymer having repeating units of the formula: ##STR9## wherein, X and D each comprise a carbocyclic and/or heterocyclic nucleus; G is selected from the group consisting of amide, urea or urethane linkages; R* is an organic radical containing a photo- or radiation induced di- or polymerizable olefinic double bond; and is a component of ester group CO 2 R*, said group bound to said nucleus in ortho or peri-position to G; F is a group capable of reacting with the carbonyl group of CO 2 R* to form a cyclic structure upon heating of the prepolymer to liberate R*OH; and wherein F is arranged in ortho- or peri-position to G; x is 1 or 2; and y is 0 or 2; exposing or irradiating the photo or radiation active layer through a negative pattern, dissolving or stripping the unexposed or unirradiated portions and annealing the relief structure obtained; the improvement which comprises using as said R*, a radical represented by the formula: ##STR10## wherein R is hydrogen or methyl and R is an alkylene group.