US4805009A — Hermetically sealed semiconductor package

Claim 1

Independent Claim 251 words

A semiconductor package, comprising: a substrate member of a first alloy; a cover member of a second alloy; a clad lead frame comprising a core layer of a third alloy and a first outer layer of a fourth alloy, said clad lead frame being disposed between said substrate member and said cover member; said third alloy being a thermally stable, glass sealable alloy which maintains or increases in yield strength at temperatures of less than about 475° C. for the time required to glass seal and has a coefficient of thermal expansion of about 140×10 -7 to about 180×10 -7 in/in/°C.; said fourth alloy being oxidation resistant and decreasing in yield strength at temperatures of less than about 475° C. for the time required to glass seal and having a coefficient of thermal expansion compatible with said third alloy; and a sealing glass with a melting temperature of less than about 450° C. comprising a glass matrix selected from the group consisting of borate, lead borate, lead-zinc borate, borosilicate, lead borosilicate and lead-zinc borosilicate glasses, said sealing glass having a paritculate additive having a solubility of less than about 10% in said glass matrix mixed into said glass matrix to increase the coefficient of thermal expansion of said sealing glass to from about 140×10 - to about 180×10 -7 in/in/° C. so as to be compatible with said first, second, third and fourth alloys, said sealing glass being disposed between said substrate member and said cover member for sealing said package.

Claim 2

Dependent Claim 251 words

A semiconductor package, comprising: a substrate member of a first alloy; a cover member of a second alloy; a clad lead frame comprising a core layer of a third alloy and a first outer layer of a fourth alloy, said clad lead frame being disposed between said substrate member and said cover member; said third alloy being a thermally stable, glass sealable alloy which maintains or increases in yield strength at temperatures of less than about 475° C. for the time required to glass seal and has a coefficient of thermal expansion of about 140×10 -7 to about 180×10 -7 in/in/°C.; said fourth alloy being oxidation resistant and decreasing in yield strength at temperatures of less than about 475° C. for the time required to glass seal and having a coefficient of thermal expansion compatible with said third alloy; and a sealing glass with a melting temperature of less than about 450° C. comprising a glass matrix selected from the group consisting of borate, lead borate, lead-zinc borate, borosilicate, lead borosilicate and lead-zinc borosilicate glasses, said sealing glass having a paritculate additive having a solubility of less than about 10% in said glass matrix mixed into said glass matrix to increase the coefficient of thermal expansion of said sealing glass to from about 140×10 - to about 180×10 -7 in/in/° C. so as to be compatible with said first, second, third and fourth alloys, said sealing glass being disposed between said substrate member and said cover member for sealing said package.

Claim 3

Dependent Claim 28 words

The semiconductor package of claim 1 wherein said third alloy is selected from the group consisting of precipitation hardenable alloys; dispersion strengthened copper alloys and austenitic stainless steels.

Claim 4

Dependent Claim 48 words

The semiconductor package as in claim 2 wherein said particulate additive is substantially undissolved in said glass matrix so as to increase the coefficient of thermal expansion of the resulting sealing glass to approximately match the coefficients of thermal expansion of said first, second, third and fourth alloys.

Claim 5

Dependent Claim 23 words

The semiconductor package as in claim 3 wherein said particulate additive is selected from the group consisting of calcium fluoride and barium fluoride.

Claim 6

Dependent Claim 29 words

The semiconductor package as in claim 4 wherein said fourth ally consists essentially from about 1% by weight to about 12% by weight aluminum and the balance essentially copper.

Claim 7

Dependent Claim 40 words

The semiconductor package as in claim 5 wherein said fourth copper alloy consists essentially of about 2.5% by weight to about 3.1% by weight aluminum, about 1.5% by weight to about 2.1% by weight silicon and the balance essentially copper.

Claim 8

Dependent Claim 19 words

The semiconductor package as in claim 4 wherein said first, second and fourth alloys are substantially the same material.

Claim 9

Dependent Claim 34 words

The semiconductor package as in claim 2 wherein said clad lead frame has a second outer layer of said third alloy whereby said core layer is disposed between said first and second outer layers.

Claim 10

Dependent Claim 283 words

A semiconductor package, comprising: a substrate member of a first alloy; a cover member of a second alloy; a clad lead frame comprising a core layer of a third alloy and a first outer layer of a fourth copper alloy; said third alloy being a thermally stable, glass sealable alloy which maintains or increases in yield strength at temperatures of less than about 475° C. and at times required to glass seal and has a coefficient thermal expansion of from about 140×10 -7 to about 180×10 -7 in/in/° C; said fourth alloy being oxidation resistant and decreasing in yield strength at temperatures of less than about 475° C. during the time required to glass seal and having a coefficient of thermal expansion compatible with said third alloy; a seal ring member of a fifth alloy; said clad lead frame being disposed between said substrate member and said seal ring member; a sealing glass with a melting temperature of less than about 450° C. comprising a glass matrix selected from the group consisting of borate; lead borate, lead-zinc borate, borosilicate, lead borosilicate and lead-zinc borosilicate glass, said sealing glass having a particulate additive having a solubility of less than about 10% in said glass matrix mixed into said glass matrix to increase the coefficient of thermal expansion of said sealing glass to from about 140×10 -7 to about 180×10 -7 in/in/° C. so as to be compatible with said first, third, fourth and fifth alloys, said sealing glass being disposed between said substrate member and said seal ring member for sealing said clad lead frame therebetween; and means bonding said seal ring member to said cover member whereby said package is substantially hermetically sealed.

Claim 11

Dependent Claim 283 words

A semiconductor package, comprising: a substrate member of a first alloy; a cover member of a second alloy; a clad lead frame comprising a core layer of a third alloy and a first outer layer of a fourth copper alloy; said third alloy being a thermally stable, glass sealable alloy which maintains or increases in yield strength at temperatures of less than about 475° C. and at times required to glass seal and has a coefficient thermal expansion of from about 140×10 -7 to about 180×10 -7 in/in/° C; said fourth alloy being oxidation resistant and decreasing in yield strength at temperatures of less than about 475° C. during the time required to glass seal and having a coefficient of thermal expansion compatible with said third alloy; a seal ring member of a fifth alloy; said clad lead frame being disposed between said substrate member and said seal ring member; a sealing glass with a melting temperature of less than about 450° C. comprising a glass matrix selected from the group consisting of borate; lead borate, lead-zinc borate, borosilicate, lead borosilicate and lead-zinc borosilicate glass, said sealing glass having a particulate additive having a solubility of less than about 10% in said glass matrix mixed into said glass matrix to increase the coefficient of thermal expansion of said sealing glass to from about 140×10 -7 to about 180×10 -7 in/in/° C. so as to be compatible with said first, third, fourth and fifth alloys, said sealing glass being disposed between said substrate member and said seal ring member for sealing said clad lead frame therebetween; and means bonding said seal ring member to said cover member whereby said package is substantially hermetically sealed.

Claim 12

Dependent Claim 28 words

The semiconductor package of claim 9 wherein said third alloy is selected from the group consisting of precipitation hardenable alloys; dispersion strengthened copper alloys and austenitic stainless steels.

Claim 13

Dependent Claim 48 words

The semiconductor package as in claim 10 wherein said particulate additive is substantially dissolved in said glass matix so as to increase the coefficient of thermal expansion of the resulting sealing glass to approximately match the coefficients of thermal expansion of said first, third, fourth and fifth alloys.

Claim 14

Dependent Claim 23 words

The semiconductor package as in claim 11 wherein said particulate additive is selected from the group consisting of calcium fluoride and barium fluoride.

Claim 15

Dependent Claim 20 words

The semiconductor package as in claim 11 wherein said first, second, fourth and fifth alloys are substantially the same material.

Claim 16

Dependent Claim 13 words

The semiconductor casing as in claim 12, wherein said bonding means comprises solder.

Claim 17

Dependent Claim 34 words

The semiconductor package as in claim 10 wherein said clad lead frame has a second outer layer of said third alloy whereby said core layer is disposed between said first and second outer layers.

Claim 18

Dependent Claim 172 words

A semiconductor package, comprising: a substrate member of a first alloy, a cover member of a second alloy, a lead frame of a third alloy being disposed between said substrate member and said cover member said third alloy being a thermally stable, glass sealable alloy which maintains or increases in yield strength at temperatures of less than about 475° C. for the time required to glass seal and has a coefficient of thermal expansion of from about 140 to about 180×10 -7 in/in/° C.; and a sealing glass with a melting temperature of less than about 450° C. selected from the group consisting of lead borate, lead-zinc borate, lead borosilicate and lead-zinc boosilicate glass, said sealing glass having an additive to modify the thermal expansion of said sealing glass whereby the resulting sealing glass composite has a coefficient of thermal expansion which is compatible with said first, second and third alloys, said sealing glass composite being disposed between said substrate member and said cover member for sealing said clad lead frame therebetween.

Claim 19

Dependent Claim 172 words

A semiconductor package, comprising: a substrate member of a first alloy, a cover member of a second alloy, a lead frame of a third alloy being disposed between said substrate member and said cover member said third alloy being a thermally stable, glass sealable alloy which maintains or increases in yield strength at temperatures of less than about 475° C. for the time required to glass seal and has a coefficient of thermal expansion of from about 140 to about 180×10 -7 in/in/° C.; and a sealing glass with a melting temperature of less than about 450° C. selected from the group consisting of lead borate, lead-zinc borate, lead borosilicate and lead-zinc boosilicate glass, said sealing glass having an additive to modify the thermal expansion of said sealing glass whereby the resulting sealing glass composite has a coefficient of thermal expansion which is compatible with said first, second and third alloys, said sealing glass composite being disposed between said substrate member and said cover member for sealing said clad lead frame therebetween.

Claim 20

Dependent Claim 47 words

The semiconductor package of claim 16 wherein said third alloy is selected from the group consisting of precipitation hardenable copper alloys including beryllium containing copper alloys, magnesium-zirconium-chromium containing copper alloys, nickel-phosphorous containing copper alloys, copper-nickel-tin precipitation hardenable spinodol alloys; dispersion strengthened copper alloys and austenitic stainless steels.

Claim 21

Dependent Claim 40 words

The semiconductor package of claim 17 wherein said third alloy is a precipitation hardenable copper alloy consisting essentially of about 10% to about 15% by weight nickel, from about 1% to about 3% by weight aluminum and the remainder copper.

Claim 22

Dependent Claim 41 words

The semiconductor package as in claim 18 wherein said third alloy further consists essentially of up to about 1% by weight manganese, from about 0.05% to less than about 0.5% by weight magnesium and less than about 0.05% by weight silicon.

Claim 23

Dependent Claim 59 words

The semiconductor package as in claim 19 wherein said third alloy consists essentially of nickel from about 11.5% by weight to about 12.5% by weight, aluminum from about 1.8% by weight to about 2.3% by weight, magnesium from about 0.1% by weight to about 0.3% by weight and manganese from about 0.2% by weight to about 0.5% by weight.

Claim 24

Dependent Claim 47 words

The semiconductor package as in claim 17 wherein said sealing glass composite further comprises a substantially undissolved particulate additive to increase the coefficients of thermal expansion of the resulting sealing glass composite to approximately match the coefficients of thermal expansion of said first, second and third alloys.

Claim 25

Dependent Claim 28 words

The semiconductor package as in claim 21 wherein said additive of the sealing glass composite is selected from the group consisting essentially of calcium fluoride and barium fluoride.

Claim 26

Dependent Claim 31 words

The semiconductor package as in claim 22 wherein said first and second alloy consist essentially from about 1% by weight to about 12% by weight aluminum and the balance essentially copper.

Claim 27

Dependent Claim 41 words

The semiconductor package as in claim 23 wherein said first and second alloy consist essentially of about 2.5% by weight to about 3.1% by weight aluminum, about 1.5% by weight to about 2.1% by weight silicon and the balance essentially copper.

Claim 28

Dependent Claim 19 words

The semiconductor package as in claim 22 wherein said first, second and third alloys are substantially the same material.

Claim 29

Dependent Claim 201 words

A semiconductor package, comprising: a substrate member of a first alloy; a cover member of a second alloy; a lead frame of a third alloy, said third alloy being a thermally stable, glass sealable alloy which maintains or increases in yield strength at temperatures less about 475° C. for the time required to glass seal and has a coefficient of thermal expansion of from about 140 to about 180×10 -7 in/in/° C.; a seal ring member of a fourth alloy; said clad lead frame being disposed between said substrate member and said seal ring member; a sealing glass with a melting temperature of less than about 450° C. selected from the group consisting of a lead borate, lead-zinc borate, lead borosilicate and lead-zinc borosilicate glass, said sealing glass having an additive to modify the thermal expansion of said sealing glass whereby the resulting sealing glass composite has a coefficient of thermal expansion which is compatible with said first, third and fourth alloys, said sealing glass composite being disposed between said substrate member and said seal ring member for sealing said lead frame therebetween; and means bonding said seal ring member to said cover member whereby said package is substantially hermetically sealed.

Claim 30

Dependent Claim 201 words

A semiconductor package, comprising: a substrate member of a first alloy; a cover member of a second alloy; a lead frame of a third alloy, said third alloy being a thermally stable, glass sealable alloy which maintains or increases in yield strength at temperatures less about 475° C. for the time required to glass seal and has a coefficient of thermal expansion of from about 140 to about 180×10 -7 in/in/° C.; a seal ring member of a fourth alloy; said clad lead frame being disposed between said substrate member and said seal ring member; a sealing glass with a melting temperature of less than about 450° C. selected from the group consisting of a lead borate, lead-zinc borate, lead borosilicate and lead-zinc borosilicate glass, said sealing glass having an additive to modify the thermal expansion of said sealing glass whereby the resulting sealing glass composite has a coefficient of thermal expansion which is compatible with said first, third and fourth alloys, said sealing glass composite being disposed between said substrate member and said seal ring member for sealing said lead frame therebetween; and means bonding said seal ring member to said cover member whereby said package is substantially hermetically sealed.

Claim 31

Dependent Claim 47 words

The semiconductor package of claim 26 wherein said third alloy is selected from the group consisting of precipitation hardenable copper alloys including beryllium containing copper alloys, magnesium-zirconium-chromium containing copper alloys, nickel-phosphorous containing copper alloys, copper-nickel-tin precipitation hardenable spinodol alloys, dispersion strengthened copper alloys and austenitic stainless steels.

Claim 32

Dependent Claim 40 words

The semiconductor package of claim 27 wherein said third alloy is a precipitation hardenable copper alloy consisting essentially of about 10% to about 15% by weight nickel, from about 1% to about 3% by weight aluminum and the remainder copper.

Claim 33

Dependent Claim 41 words

The semiconductor package as in claim 28 wherein said third alloy further consists essentially of up to about 1% by weight manganese, from about 0.05% to less than about 0.5% by weight magnesium and less than about 0.05% by weight silicon.

Claim 34

Dependent Claim 59 words

The semiconductor package as in claim 29 wherein said third alloy consists essentially of nickel from about 11.5% by weight to about 12.5% by weight, aluminum from about 1.8% by weight to about 2.3% by weight, magnesium from about 0.1% by weight to about 0.3% by weight and manganese from about 0.2% by weight to about 0.5% by weight.

Claim 35

Dependent Claim 47 words

The semiconductor package as in claim 30 wherein said sealing glass composite further comprises a substantially undissolved particulate additive to increase the coefficient of thermal expansion of the resulting sealing glass composite to approximately match the coefficients of thermal expansion of said first, third and fourth alloys.

Claim 36

Dependent Claim 28 words

The semiconductor package as in claim 31 wherein said additive of the sealing glass composite is selected from the group consisting essentially of calcium fluoride and barium fluoride.

Claim 37

Dependent Claim 20 words

The semiconductor package as in claim 32 wherein said first, second, third and fourth alloys are substantially the same material.

Claim 38

Dependent Claim 36 words

The semiconductor casing as in claim 32 including the step of bonding said cover to said seal ring with a material selected from the group consisting of an adhesive, a glass and an oxygen stable solder.

Claim 39

Dependent Claim 32 words

The semiconductor package of claim 2 wherein said precipitation hardenable alloy comprises copper alloys, beryllium containing copper alloys, magnesium-zirconium-chromium containing copper alloys, nickel-phosphorous containing copper alloys and copper-nickel-tin precipitation hardenable spinodal alloys.

Claim 40

Dependent Claim 40 words

The semiconductor package of claim 35 wherein said third alloy is a precipitation hardenable copper alloy consisting essentially of about 10% to about 15% by weight nickel, from about 1% to about 3% by weight aluminum and the remainder copper.

Claim 41

Dependent Claim 41 words

The semiconductor package as in claim 36 wherein said third alloy further consists essentially of up to about 1% by weight manganese, from about 0.05% to less than about 0.5% by weight magnesium, and less than about 0.05% by weight silicon.

Claim 42

Dependent Claim 59 words

The semiconductor package as in claim 37 wherein said third alloy consists essentially of nickel from about 11.5% by weight to about 12.5% by weight, aluminum from about 1.8% by weight to about 2.3% by weight, magnesium from about 0.1% by weight to about 0.3% by weight and manganese from about 0.2% by weight to about 0.5% by weight.

Claim 43

Dependent Claim 32 words

The semiconductor package of claim 10 wherein said precipitation hardenable alloy comprises copper alloys, beryllium containing copper alloys, magnesium-zirconium-chromium containing copper alloys, nickel-phosphorous containing copper alloys and copper-nickel-tin precipitation hardenable spinodal alloys.

Claim 44

Dependent Claim 40 words

The semiconductor package of claim 39 wherein said third alloy is a precipitation hardenable copper alloy consisting essentially of about 10% to about 15% by weight nickel, from about 1% to about 3% by weight aluminum and the remainder copper.

Claim 45

Dependent Claim 41 words

The semiconductor package as in claim 40 wherein said third alloy further consists essentially of up to about 1% by weight manganese, from about 0.05% to less than about 0.5% by weight magnesium and less than about 0.05% by weight silicon.

Claim 46

Dependent Claim 59 words

The semiconductor package as in claim 41 wherein said third alloy consists essentially of nickel from about 11.5% by weight to about 12.5% by weight, aluminum from about 1.8% by weight to about 2.3% by weight, magnesium from about 0.1% by weight to about 0.3% by weight and manganese from about 0.2% by weight to about 0.5% by weight.

Claim 47

Dependent Claim 91 words

A semiconductor package, comprising: a substrate member of a first metal alloy; a cover member of a second metal alloy; a leadframe comprising a third metal alloy, said third metal alloy comprising a precipitation hardenable metal alloy consisting essentially of about 10% to about 15% by weight nickel, from about 1% by about 3% by weight aluminum and the remainder copper, said leadframe being disposed between said substrate member and said cover member; and a sealing glass being disposed between said substrate member and said cover member for sealing said package.

Claim 48

Dependent Claim 91 words

A semiconductor package, comprising: a substrate member of a first metal alloy; a cover member of a second metal alloy; a leadframe comprising a third metal alloy, said third metal alloy comprising a precipitation hardenable metal alloy consisting essentially of about 10% to about 15% by weight nickel, from about 1% by about 3% by weight aluminum and the remainder copper, said leadframe being disposed between said substrate member and said cover member; and a sealing glass being disposed between said substrate member and said cover member for sealing said package.

Claim 49

Dependent Claim 81 words

The semiconductor package of claim 43 wherein said sealing glass comprises: a glass matrix having a firing temperature of less than about 450° C.; and a particulate additive having limited solubility in said glass matrix mixed into said glass matrix to increase the effective coefficient of thermal expansion of the resulting sealing glass to about 140×10 -7 to about 180×10 -7 in/in/° C. so as to be compatible with the coefficient of thermal expansion of the first, second and third alloys.

Claim 50

Dependent Claim 29 words

The semiconductor package of claim 44 wherein said glass matrix is selected from the group consisting of borate, lead borate, lead-zinc borate, borosilicate, lead borosilicate and lead-zinc borosilicate glasses.

Claim 51

Dependent Claim 22 words

The semiconductor package of claim 45 wherein at least one of said first and second alloys is a precipitation hardenable copper alloy.

Claim 52

Dependent Claim 22 words

The semiconductor package of claim 46 wherein said particulate additive is selected from the group consisting of calcium fluoride and barium fluoride.

Claim 53

Dependent Claim 20 words

The semiconductor package of claim 47 wherein said first, second and third alloys are formed of precipitation hardenable copper alloys.

Claim 54

Dependent Claim 121 words

A semiconductor package comprising: a substrate member of a first metal alloy; a cover member of a second metal alloy; a leadframe comprising a third metal alloy, said third metal alloy comprising a precipitation hardenable metal alloy consisting essentially of from about 10% to about 15% by weight nickel, from about 1% to about 3% by weight aluminum and the remainder copper; a seal ring member of a fourth metal alloy, said leadframe being disposed between said substrate member and said seal ring member; a sealing glass being disposed between said substrate member and said seal ring member for sealing said leadframe therebetween; and means bonding said seal ring member to said cover member whereby said package is substantially hermetically sealed.

Claim 55

Dependent Claim 121 words

A semiconductor package comprising: a substrate member of a first metal alloy; a cover member of a second metal alloy; a leadframe comprising a third metal alloy, said third metal alloy comprising a precipitation hardenable metal alloy consisting essentially of from about 10% to about 15% by weight nickel, from about 1% to about 3% by weight aluminum and the remainder copper; a seal ring member of a fourth metal alloy, said leadframe being disposed between said substrate member and said seal ring member; a sealing glass being disposed between said substrate member and said seal ring member for sealing said leadframe therebetween; and means bonding said seal ring member to said cover member whereby said package is substantially hermetically sealed.

Claim 56

Dependent Claim 81 words

The semiconductor package of claim 48 wherein said sealing glass comprises: a glass matrix having a firing temperature of less than about 450° C.; and a particulate additive having limited solubility in said glass matrix mixed into said glass matrix to increase the effective coefficient of thermal expansion of the resulting sealing glass to about 140×10 -7 to about 180×10 -7 in./in./° C. so as to be compatible with the coefficient of thermal expansion of the first, second and third alloys.

Claim 57

Dependent Claim 29 words

The semiconductor package of claim 50 wherein said glass matrix is selected from the group consisting of borate, lead borate, lead-zinc borate, borosilicate, lead borosilicate and lead-zinc borosilicate glasses.

Claim 58

Dependent Claim 25 words

The semiconductor casing of claim 51 wherein the bonding means is selected from the group consisting of an adhesive, a glass and oxygen stable solder.

Claim 59

Dependent Claim 89 words

A semiconductor package, comprising: a substrate member of a first alloy; a cover member of a second alloy; at least one of said first and second alloys comprising a precipitation hardenable alloy; a leadframe comprising a third metal alloy, said third metal alloy comprising a precipitation hardenable metal alloy consisting essentially of from about 10% to about 15% by weight nickel, from about 1to about 3% by weight aluminum and the remainder copper; and a sealing glass bonding said substrate member to said cover member for sealing said package.

Claim 60

Dependent Claim 89 words

A semiconductor package, comprising: a substrate member of a first alloy; a cover member of a second alloy; at least one of said first and second alloys comprising a precipitation hardenable alloy; a leadframe comprising a third metal alloy, said third metal alloy comprising a precipitation hardenable metal alloy consisting essentially of from about 10% to about 15% by weight nickel, from about 1to about 3% by weight aluminum and the remainder copper; and a sealing glass bonding said substrate member to said cover member for sealing said package.

Claim 61

Dependent Claim 81 words

The semiconductor package of claim 53 wherein said sealing glass comprises: a glass matrix fired at a temperature of less than about 450° C.; and a particulate additive having limited solubility in said glass matrix mixed into such glass matrix to increase the effective coefficient of thermal expansion of the resulting sealing glass to about 140×10 -7 to about 180>10 -7 in/in/° C. so as to be compatible with the coefficient of thermal expansion of the first, second and third alloys.

Claim 62

Dependent Claim 22 words

The semiconductor package of claim 3 wherein said particulate additive is uncoated; and said glass matrix is formed of a vitreous glass.

Claim 63

Dependent Claim 22 words

The semiconductor package of claim 11 wherein said particulate additive is uncoated; and said glass matrix is formed of a vitreous glass.

Claim 64

Dependent Claim 22 words

The semiconductor package of claim 44 wherein said particulate additive is uncoated; and said glass matrix is formed of a vitreous glass.

Claim 65

Dependent Claim 21 words

The semiconductor package of claim 50 wherein said particulate additive is uncoated; and said glass matrix is formed of vitreous glass.

Claim 66

Dependent Claim 21 words

The semiconductor package of claim 54 wherein said particulate additive is uncoated; and said glass matrix is formed of vitreous glass.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	1992-02-14	1992-08-15	1993-02-14	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	1996-02-14	1996-08-15	1997-02-14	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2000-02-14	2000-08-15	2001-02-14	$7700.00	Window Closed / Lapsed

Hermetically sealed semiconductor package

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