← Back to Patent Explorer
US3954486A Expired / Lapsed US ⏱️ 0.0 years remaining

Solder glass with refractory filler

Assignee: OI Glass Inc
•
Filing: 1974-07-30
•
Granted: 1976-05-04
•
Expires: 1994-07-30
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract Disclosed is a physical blend of particulate lead borate sealing glass and particulate refractory filler for use in forming thermal fusion seals for workpieces having a lower coefficient of thermal expansion than the sealing glass. The particulate refractory filler has a particle size diameter in excess of about 37 microns (i.e. plus 400 U.S. Sieve) to lower the expansion while maintaining adequate flow during fusion. The blend is especially useful as a package sealant for electronic components.

Inventors

  • 👤 Josef Francel
  • 👤 Robert F. Palermo

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-04 21:19
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/22; B23K35/24; C; C03; C03C; C03C27/00; C03C3/00; C03C3/04; C03C3/062; C03C3/07; C03C3/072; C03C3/074; C03C3/0745; C03C3/12; C03C3/14; C03C3/142; C03C8/00; C03C8/24; C03C8/245

Claims Analysis

Total Claims: 10
Claim 1
Independent Claim 124 words
In a physical blend of particulate lead-borate solder glass and particulate low expansion refractory filler said filler having a coefficient of thermal expansion of less than about 65 × 10.sup. -7 /°C (0-300°C), for use in thermal fusion sealing to a workpiece having a lower coefficient of thermal expansion than said solder glass, the improvement wherein said refractory filler has a particle size diameter in excess of about 37 microns and not substantially in excess of 150 microns whereby the flow is increased and the coefficient of thermal contraction is decreased upon fusion sealing when compared to the flow and thermal contraction properties of a blend of the same composition which has a refractory filler particle size substantially less than 37 microns in diameter.
Claim 2
Dependent Claim 124 words
In a physical blend of particulate lead-borate solder glass and particulate low expansion refractory filler said filler having a coefficient of thermal expansion of less than about 65 × 10.sup. -7 /°C (0-300°C), for use in thermal fusion sealing to a workpiece having a lower coefficient of thermal expansion than said solder glass, the improvement wherein said refractory filler has a particle size diameter in excess of about 37 microns and not substantially in excess of 150 microns whereby the flow is increased and the coefficient of thermal contraction is decreased upon fusion sealing when compared to the flow and thermal contraction properties of a blend of the same composition which has a refractory filler particle size substantially less than 37 microns in diameter.
Claim 3
Dependent Claim 16 words
The blend of claim 1 wherein said refractory filler is a lithium aluminosilicate, aluminosilicate, or zircon.
Claim 4
Dependent Claim 25 words
The blend of claim 1 wherein said particulate refractory filler is present in the proportion of about 1 to 25% by weight of said blend.
Claim 5
Dependent Claim 25 words
The blend of claim 1 wherein said particulate refractory filler is present in the proportion of about 5 to 20% by weight of said blend.
Claim 6
Dependent Claim 35 words
The blend of claim 1 wherein said solder glass has the composition consisting essentially of: Oxide % by Weight ______________________________________ PbO 70-85 ZnO 0-20 B.sub.2 O.sub.3 5-15 SiO.sub.2 0-10 BaO 0-3 SnO.sub.2 0-5 . ______________________________________
Claim 7
Dependent Claim 35 words
The blend of claim 1 wherein said solder glass has the composition consisting essentially of: Oxide % by Weight ______________________________________ PbO 75-85 ZnO 2-16 B.sub.2 O.sub.3 8-15 SiO.sub.2 0-15 BaO 0-2 SnO 0-2 . ______________________________________
Claim 8
Dependent Claim 85 words
The method of forming a fusion seal on a workpiece comprising applying the blend of the solder glass and particulate refractory filler of claim 1 to said workpiece and thermally fusing said blend at temperature in the range of 350° to 500°C and for a time period in the range of about 1 minute to about 1 hour to flow and fuse said blend into a strong, hermetic seal having a coefficient of thermal contraction less than the solder glass initially present in said blend.
Claim 9
Dependent Claim 32 words
The method of claim 7 wherein said temperature is in the range of about 350° to 450°C and said time is in the range of about 5 minutes to about 30 minutes.
Claim 10
Dependent Claim 85 words
The method for forming a fusion seal on a workpiece comprising applying the blend of the solder glass and particulate refractory filler of claim 2 to said workpiece and thermally fusing said blend at temperature in the range of 350° to 500°C and for a time period in the range of about 1 minute to about 1 hour to flow and fuse said blend into a strong, hermetic seal having a coefficient of thermal contraction less than the solder glass initially present in said blend.

References Cited (Backward Citations)

US2863782A Cited
US3250631A Cited
US3275358A Cited
US3454408A Cited
US3425817A Cited
US3258350A Cited
US3778242A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1979-05-04 1979-11-03 1980-05-04 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1983-05-04 1983-11-03 1984-05-04 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1987-05-04 1987-11-03 1988-05-04 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag