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US4366117A Expired / Lapsed US ⏱️ 0.0 years remaining

Copper alloy for use as lead material for semiconductor devices

Assignee: NIKON KOGYO KK
•
Filing: 1981-06-03
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Granted: 1982-12-28
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Expires: 2001-06-03
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Abstract

Abstract A copper alloy for use as a lead material for semiconductor devices, which comprises 0.04-1.0% Ni, 0.01-0.3% Si, and 0.05-15% Zn, all by weight, and the remainder Cu and inevitable impurities. The alloy may contain, in addition to these, a total amount of 0.001-1.0% by weight of one or two or more elements as an accessory ingredient or ingredients selected from the group consisting of 0.001-0.1% by weight each of P and As and 0.01-0.5% by weight each of Ti, Cr, Sn, Mn, and Mg.

Inventors

  • 👤 Masahiro Tsuji

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-26 11:28
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/20; H10W70/24; C; C22; C22C; C22C9/00; C22C9/04

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 51 words
A copper alloy for use as a lead material for semi-conductor devices consisting of: between about 0.04 and about 1.0 weight percent of Ni, between about 0.01 and about 0.3 weight percent of Si, between about 0.05 and about 15 weight percent of Zn, and the remainder Cu and inevitable impurities.
Claim 2
Dependent Claim 51 words
A copper alloy for use as a lead material for semi-conductor devices consisting of: between about 0.04 and about 1.0 weight percent of Ni, between about 0.01 and about 0.3 weight percent of Si, between about 0.05 and about 15 weight percent of Zn, and the remainder Cu and inevitable impurities.
Claim 3
Dependent Claim 160 words
A copper alloy for use as a lead material for semiconductor devices consisting essentially of: (a) between about 0.04 and about 1.0 weight percent of Ni, (b) between about 0.01 and about 0.3 weight percent of Si, (c) between about 0.05 and about 15 weight percent of Zn, (d) an accessory ingredient or ingredients selected from the group consisting of between about 0.001 and about 0.1 weight percent of P, between about 0.001 and about 0.1 weight percent of As, between about 0.01 and about 0.5 weight percent of Ti, between about 0.01 and about 0.5 weight percent of Cr, between about 0.01 and about 0.05 weight percent of Sn, between about 0.01 and about 0.5 weight percent of Mn, between about 0.01 and about 0.5 weight percent of Mg, the total weight of said accessory ingredient or ingredients being between about 0.001 and about 1.0 weight percent of the alloy, and (e) the remainder of the alloy being Cu.
Claim 4
Dependent Claim 160 words
A copper alloy for use as a lead material for semiconductor devices consisting essentially of: (a) between about 0.04 and about 1.0 weight percent of Ni, (b) between about 0.01 and about 0.3 weight percent of Si, (c) between about 0.05 and about 15 weight percent of Zn, (d) an accessory ingredient or ingredients selected from the group consisting of between about 0.001 and about 0.1 weight percent of P, between about 0.001 and about 0.1 weight percent of As, between about 0.01 and about 0.5 weight percent of Ti, between about 0.01 and about 0.5 weight percent of Cr, between about 0.01 and about 0.05 weight percent of Sn, between about 0.01 and about 0.5 weight percent of Mn, between about 0.01 and about 0.5 weight percent of Mg, the total weight of said accessory ingredient or ingredients being between about 0.001 and about 1.0 weight percent of the alloy, and (e) the remainder of the alloy being Cu.
Claim 5
Dependent Claim 48 words
A copper alloy according to claim 1 or 2 wherein said Ni comprises between about 0.08 and about 1.0 weight percent, said Si comprises between about 0.02 and about 0.24 weight percent and said Zn comprises between about 0.1 and about 12.0 weight percent, respectively, of the alloy.

References Cited (Backward Citations)

US2028317A Cited
US2027330A Cited
US2137282A Cited
US2309100A Cited
US3072508A Cited
US4015982A Cited
US3926681A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1985-12-27 1986-06-28 1986-12-28 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1989-12-27 1990-06-28 1990-12-28 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1993-12-27 1994-06-28 1994-12-28 $7700.00 Window Closed / Lapsed

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