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US4466939A Expired / Lapsed US ⏱️ 0.0 years remaining

Process of producing copper-alloy and copper alloy plate used for making electrical or electronic parts

Assignee: Poong San Metal Corp
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Filing: 1983-09-22
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Granted: 1984-08-21
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Expires: 2003-09-22
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Abstract

Abstract This invention provides an economic copper-nickel alloy having high strength and high conductivity for lead conductor materials and/or lead frames for transistors, integrated circuits, and the like. The copper alloy comprises a composite of copper and inexpensive elements comprising 3.0% by weight nickel; from 0.01 to 1.0% by weight silicon; and from 0.01 to 0.1% by weight phosphorus. In one preferred embodiment a specific weight % of iron is also added. Still further, an improved method is provided for fabricating the alloy according to a specific series and sequence of steps, including steps at specific conditions and for specific times, for providing precipitation hardening. Other advantageous properties comprise desirable elongation.

Inventors

  • 👤 Young G. Kim
  • 👤 Dong K. Park

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-26 07:31
CPC Classifications
C; C22; C22C; C22C9/00; C22C9/06; C22F; C22F1/00; C22F1/08

Claims Analysis

Total Claims: 19
Claim 1
Independent Claim 40 words
Copper-nickel alloys for electrical lead conductor materials for integrated circuits consisting essentially of copper and from about 0.05 to 3.0% by weight nickel, from about 0.01 to 1.0% by weight silicon, and from about 0.01 to 0.1% by weight phosphorus.
Claim 2
Dependent Claim 40 words
Copper-nickel alloys for electrical lead conductor materials for integrated circuits consisting essentially of copper and from about 0.05 to 3.0% by weight nickel, from about 0.01 to 1.0% by weight silicon, and from about 0.01 to 0.1% by weight phosphorus.
Claim 3
Dependent Claim 34 words
Copper-nickel alloys for electrical lead conductor materials for integrated circuits consisting essentially of copper and additives according to claim 1, wherein 0.01 to 3.0% iron is added to said alloys and then alloyed therewith.
Claim 4
Independent Claim 201 words
A method for producing an alloy consisting essentially of copper and from about 0.05 to about 3.0% by weight nickel, from about 0.01 to about 1.0% by weight silicon, from about 0.01 to about 0.1% by weight phosphorus, and optionally 0.01 to 3.0% iron for electrical lead conductor materials integrated circuits comprising as sequential steps: (a) casting the composites of claims 1 or 2; (b) hot rolling the casting at a temperature of between about 750° to 950° C.; (c) rapidly cooling the rolled casting; (d) cold rolling the casting with a reduction in size of about 60 to 80%; (e) annealing the casting at a temperature of between about 400° C. to 520° C. for about two hours; (f) rapidly cooling the resulting product; (g) again cold rolling the resulting product with a reduction in size of about 50 to 70%; (h) annealing the resulting product at a temperature of between about 400° C., to 520° C. for about two hours; (i) rapidly cooling the resulting product; (j) finally cold rolling the casting with a size reduction of about 50 to 70%; (k) low temperature annealing the resulting product at a temperature of between about 250° C. to 400° C.
Claim 5
Independent Claim 232 words
A method for producing an alloy consisting essentially of copper and from about 0.05 to about 3.0% by weight nickel, from about 0.01 to about 1.0% by weight silicon, from about 0.01 to about 0.1% by weight phosphorus, and optionally 0.01 to 3.0% iron for electrical lead conductor materials for integrated circuits comprising as sequential steps: (a) casting the alloys of claims 1 or 2; (b) the alloy is hot rolled at a temperature of between 750° to 950° C. and rapidly cooled; (c) wherein said alloy is first cold rolled with a size reduction of about 60 to 80%; (d) said alloy is then annealed at a temperature of between about 400° C. to 520° C. for about two hours and rapidly cooled; (e) said alloy is secondly cold rolled with a size reduction of about 50 to 70%; (f) said alloy is annealed at a temperature of between about 400° C. to 520° C. for about two hours and rapidly cooled; (g) said alloy is cold rolled with a reduction of about 30 to 50%; (h) said alloy is annealed at a temperature of between about 350° C. to 500° C. for about two hours; (i) said alloy is finally rolled with a reduction in size of between about 10 to 25%; (j) said alloy is low temperature annealed at a temperature of between about 250° C. to 400° C.
Claim 6
Dependent Claim 31 words
The copper-nickel alloys of claim 1 in which the alloys were made by adding elements to form an alloy having the following weight percents: nickel=1%, phosphorus=0.03% silicon=0.2% and the balance copper.
Claim 7
Dependent Claim 32 words
The copper-nickel alloys of claim 2 in which the alloys were made by adding elements to form an alloy having the following weight percents: iron=0.7%, nickel=0.5%, phosphorus=0.03%, silicon=0.1% and the balance copper.
Claim 8
Dependent Claim 60 words
Copper-nickel alloys for electrical lead conductor materials for integrated circuits consisting essentially of copper and from about 0.05 to about 3.0% by weight nickel, from about 0.01 to about 1.0% by weight silicon, from about 0.01 to about 0.1% by weight phosphorus, and optionally 0.01 to 3.0% iron having a tensile strength of greater than about 40 kg/mm 2 .
Claim 9
Dependent Claim 60 words
Copper-nickel alloys for electrical lead conductor materials for integrated circuits consisting essentially of copper and from about 0.05 to about 3.0% by weight nickel, from about 0.01 to about 1.0% by weight silicon, from about 0.01 to about 0.1% by weight phosphorus, and optionally 0.01 to 3.0% iron having a tensile strength of greater than about 40 kg/mm 2 .
Claim 10
Dependent Claim 20 words
The copper-nickel alloys of claim 7 having a conductivity of at least about 60% of the conductivity of pure copper.
Claim 11
Dependent Claim 19 words
The copper-nickel alloys of claim 8 in which the alloy has an elongation of between about 3.2% and 13.5%.
Claim 12
Dependent Claim 20 words
The copper-nickel alloys of claim 9 in which the alloy has a hardness of between about 16 to 175 HV.
Claim 13
Dependent Claim 22 words
The copper-nickel alloys of claim 10 in which the tensile strength is at least between about 40.1 and 62.7 kg/mm 2 .
Claim 14
Dependent Claim 24 words
The copper-nickel alloys of claim 11 in which the conductivity is at least between about 60% and 70% of the conductivity of pure copper.
Claim 15
Dependent Claim 42 words
The copper-nickel alloys of claim 12 in which the alloy consists essentially of copper and from about 0.05 to about 3.0% by weight nickel, from about 0.1 to about 1.0% by weight silicon, and from about 0.01 to 0.1% by weight phosphorus.
Claim 16
Dependent Claim 24 words
The copper-nickel alloys of claim 13 in which about 0.01 to about 3.0% by weight iron is added to the alloy and alloyed therewith.
Claim 17
Dependent Claim 37 words
The copper-nickel alloys of claim 14 in which the alloy consists essentially of about 0.5% by weight nickel, about 0.1% by weight silicon, about 0.03% by weight phosphorus, about 0.7% by weight iron, and the balance copper.
Claim 18
Dependent Claim 18 words
The copper-nickel alloys of claim 15 in which the alloy has an elongation of at least about 4.0%.
Claim 19
Dependent Claim 17 words
The copper-nickel base alloys of claim 13 in which the alloy has a hardness of 143 HV.

References Cited (Backward Citations)

US3522112A Cited
US4249941A Cited
JPS55104449A Cited
JPS5677354A Cited
US4362579A Cited
JPS572850A Cited
US4337089A Cited
JPS57109357A Cited
JPS57109356A Cited
JPS57116738A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1987-08-21 1988-02-20 1988-08-21 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1991-08-21 1992-02-20 1992-08-21 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1995-08-21 1996-02-20 1996-08-21 $7700.00 Window Closed / Lapsed

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