US4337089A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Copper-nickel-tin alloys for lead conductor materials for integrated circuits and a method for producing the same
Assignee: Nihon Telecommunication Engineering Corp
•
Filing: 1980-12-29
•
Granted: 1982-06-29
•
Expires: 2000-12-29
Abstract
Abstract Copper-nickel-tin alloys having high tensile strength and conductivity suitable for lead conductor materials for integrated circuits are produced by melting a starting material containing 0.5-3.0% by weight of Ni, 0.3-0.9% by weight of Sn, 0.01-0.2% by weight of phosphorus and 0-0.35% by weight of at least one of Mn and Si other than Cu, casting the molten metal, rolling conventionally the cast into a sheet having a thickness corresponding to more than 60% of cold reduction rate of the final necessary gauge, annealing such a rolled sheet at a temperature of 300-395 DEG C. for 1 hour, cold rolling the annealed sheet and annealing the cold rolled sheet at a temperature of 150-250 DEG C. for 1 hour.
Inventors
- 👤 Kishio Arita
- 👤 Kiyoshi Murakawa
- 👤 Toshio Takahashi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 14:48
CPC Classifications
C; C22; C22C; C22C9/00; C22C9/02; C22C9/06
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
42 words
Copper-nickel-tin alloys for electrical lead conductor materials for integrated circuits containing 0.5-3.0% by weight of Ni, 0.3-0.9% by weight of Sn, 0.01-0.05% by weight of P and 0-0.35% by weight of at least one of Mn and Si and the remainder copper.
Claim 2
Dependent Claim
42 words
Copper-nickel-tin alloys for electrical lead conductor materials for integrated circuits containing 0.5-3.0% by weight of Ni, 0.3-0.9% by weight of Sn, 0.01-0.05% by weight of P and 0-0.35% by weight of at least one of Mn and Si and the remainder copper.
Claim 3
Independent Claim
114 words
A method for producing copper-nickel-tin alloys for electrical lead conductor materials for integrated circuits comprising as sequential steps melting a starting material containing 0.5-3.0% by weight of Ni, 0.3-0.9% by weight of Sn, 0.01-0.05% by weight of phosphorus and 0-0.35% by weight of at least one of Mn and Si and the remainder Cu; casting the molten metal; rolling the casting into a sheet having a thickness corresponding to more than 60% of cold reduction percent of the final necessary gauge; annealing said rolled sheet at a temperature of 300°-395° C. for 1 hour; cold rolling the annealed sheet; and annealing the cold rolled sheet at a temperature of 150°-250° C. for 1 hour.
Claim 4
Independent Claim
114 words
A method for producing copper-nickel-tin alloys for electrical lead conductor materials for integrated circuits comprising as sequential steps melting a starting material containing 0.5-3.0% by weight of Ni, 0.3-0.9% by weight of Sn, 0.01-0.05% by weight of phosphorus and 0-0.35% by weight of at least one of Mn and Si and the remainder Cu; casting the molten metal; rolling the casting into a sheet having a thickness corresponding to more than 60% of cold reduction percent of the final necessary gauge; annealing said rolled sheet at a temperature of 300°-395° C. for 1 hour; cold rolling the annealed sheet; and annealing the cold rolled sheet at a temperature of 150°-250° C. for 1 hour.
References Cited (Backward Citations)
US2155405A
Cited
US2375285A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1985-06-28 | 1985-12-28 | 1986-06-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1989-06-28 | 1989-12-28 | 1990-06-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1993-06-28 | 1993-12-28 | 1994-06-29 | $7700.00 | Window Closed / Lapsed |