Semiconductor memory device with buried layer under groove capacitor

Claim 1

A semiconductor memory device comprising: (a) a semiconductor body comprising (i) a semiconductor substrate of a first conductivity type, (ii) a semiconductor layer of said first conductivity type formed on said semiconductor substrate, and (iii) a buried layer of a second conductivity type formed at an interface between said semiconductor substrate and said semiconductor layer; (b) a plurality of transfer transistors each comprising (i) source and drain regions which are formed in a surface region of said semiconductor layer so as to be electrically isolated from each other and (ii) a gate electrode which is formed on a portion of said semiconductor layer between said source and drain regions; and (c) a plurality of trenched capacitors each comprising (i) a groove formed so as to extend from said surface region of said semiconductor layer to a depth at least as deep as the upper surface of said buried layer, (ii) an impurity diffusion region of said second conductivity type acting as one electrode of said trenched capacitor and formed to be fully surrounded by the portion of said semiconductor layer and said buried layer which define said groove, (iii) an insulation film formed on said groove and acting as a dielectric of said trenched capacitor, and (iv) a conductive layer acting as the other electrode of said trenched capacitor formed on said insulation film and extending from a bottom portion of said groove to at least a level above an opening of said groove, said impurity diffusion region being applied with an electric potential by said buried layer, one of said source and drain regions of each transfer transistor being in buried contact with said other electrode of one of said trenched capacitors and the other of said source and drain regions of each transfer transistor being connected to a bit line.