Semiconductor integrated circuit device having a carrier trapping trench arrangement

Claim 2

A semiconductor integrated circuit device comprising: a semiconductor substrate of a first conductivity type having a first main surface; a memory cell array formed on said semiconductor substrate and including a plurality of memory cells arrayed in rows and columns, wherein each said memory cell comprises a MISFET and a capacitor connected in series with each other, wherein said capacitor is formed by using a first trench formed in the first main surface of said semiconductor substrate, said capacitor having a first insulating film formed on the surface of said first trench and a first electrode formed over said first insulating film; a peripheral circuit formed in said semiconductor substrate in portions other than said memory cell array; and a carrier trapping region formed in said semiconductor substrate between said memory cell array and said peripheral circuit, wherein said carrier trapping region comprises second trenches formed in the main surface of said semiconductor substrate, insulating films which are formed on the surface of said second trenches, and second electrodes made of a conductive material formed over the surface of said insulating films in said second trenches.

Claim 3

A semiconductor integrated circuit device according to claim 1, wherein a plurality of said second trenches are forming at a predetermined spacing from one another which spacing is set such that depletion layers formed in said semiconductor substrate around said trenches can be coupled to each other under a fixed potential applied to said electrode.

Claim 4

A semiconductor integrated circuit device according to claim 2, wherein said conductive material is a polycrystalline silicon.

Claim 5

A semiconductor integrated circuit device according to claim 3, wherein said second electrodes are formed integrally with each other.

Claim 6

A semiconductor integrated circuit device according to claim 4, wherein said first and second electrodes are formed integrally with each other.

Claim 7

A semiconductor integrated circuit device according to claim 1, wherein said second trenches are made to extend continuously with each other.

Claim 8

A semiconductor integrated circuit device according to claim 6, wherein said conductive material is a polycrystalline silicon.

Claim 9

A semiconductor integrated circuit device according to claim 1, wherein said peripheral circuit is comprised of a plurality of MISFETs.

Claim 10

A semiconductor integrated circuit device according to claim 8, wherein said peripheral circuit is a sense amplifier.

Claim 11

A semiconductor integrated circuit device according to claim 9, wherein said carrier trapping region is disposed between said memory cell array and said sense amplifier.

Claim 12

A semiconductor integrated circuit device according to claim 10, wherein said carrier trapping region surrounds said memory cell array.

Claim 13

A semiconductor integrated circuit device according to claim 1, wherein said carrier trapping region has a semiconductor region of second conductivity type which is formed in the surface of said second trenches.

Claim 14

A semiconductor integrated circuit device comprising: a semiconductor substrate of a first conductivity type having a first main surface; a memory cell array formed on said semiconductor substrate and including a plurality of memory cells arrayed in rows and columns and a plurality of data and word lines, wherein each said memory cell comprises a MISFET and a capacitor connected in series with each other and each said memory cell is selected by choosing predetermined data and word lines, wherein said capacitor is formed by using a first trench formed in the first main surface of said semiconductor substrate, said capacitor having a first insulating film formed on the surface of said first trench and a first electrode formed over said first insulating film; a peripheral circuit formed in said semiconductor substrate in portions other than said memory cell array and said peripheral circuit is comprised of a plurality of MISFETs; and a carrier trapping region formed in said semiconductor substrate between a memory cell located at the end of each row or column in said memory cell array and said peripheral circuit, wherein said carrier trapping region comprises second trenches formed in the main surface of said semiconductor substrate, insulating films which are formed on the surface of said second trenches, and second electrodes made of a conductive material formed over the surface of said insulating films in said second trenches.

Claim 15

A semiconductor integrated circuit device comprising: a semiconductor substrate of a first conductivity type having a first main surface; a memory cell array formed on said semiconductor substrate and including a plurality of memory cells arrayed in rows and columns and a plurality of data and word lines, wherein each said memory cell comprises a MISFET and a capacitor connected in series with each other and each said memory cell is selected by choosing predetermined data and word lines, wherein said capacitor is formed by using a first trench formed in the first main surface of said semiconductor substrate, said capacitor having a first insulating film formed on the surface of said first trench and a first electrode formed over said first insulating film; a peripheral circuit formed in said semiconductor substrate in portions other than said memory cell array and said peripheral circuit is comprised of a plurality of MISFETs; and a carrier trapping region formed in said semiconductor substrate between a memory cell located at the end of each row or column in said memory cell array and said peripheral circuit, wherein said carrier trapping region comprises second trenches formed in the main surface of said semiconductor substrate, insulating films which are formed on the surface of said second trenches, and second electrodes made of a conductive material formed over the surface of said insulating films in said second trenches.

Claim 16

A semiconductor integrated circuit device according to claim 13, wherein a plurality of said second trenches are formed at a predetermined spacing from one another which spacing is set such that depletion layers formed in said semiconductor substrate around said second trenches can be coupled to each other under a fixed potential applied to said electrode.

Claim 17

A semiconductor integrated circuit device according to claim 14, wherein said conductive material is a polycrystalline silicon.

Claim 18

A semiconductor integrated circuit device according to claim 15, wherein said second electrodes are formed integrally with each other.

Claim 19

A semiconductor integrated circuit device according to claim 16, wherein said first and second electrodes are formed integrally with each other.

Claim 20

A semiconductor integrated circuit device according to claim 14, wherein said second trenches are made to extend continuously with each other.

Claim 21

A semiconductor integrated circuit device according to claim 18, wherein said conductive material is a polycrystalline silicon.

Claim 22

A semiconductor integrated circuit device according to claim 13, wherein said peripheral circuit is comprised of a plurality of MISFETs.

Claim 23

A semiconductor integrated circuit device according to claim 20, wherein said peripheral circuit is a sense amplifier.

Claim 24

A semiconductor integrated circuit device according to claim 21, wherein said carrier trapping region is disposed between said memory cell array and said sense amplifier.

Claim 25

A semiconductor integrated circuit device according to claim 22, wherein said carrier trapping region surrounds said memory cell array.

Claim 26

A semiconductor integrated circuit device according to claim 13, wherien said carrier trapping region has a semiconductor region of second conductivity type which is formed in the surface of said second trenches.