Patent US4746583A successfully refreshed from Google Patents.
US4746583A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ceramic combined cover
Assignee: WILLIAMS GOLD REFINING COMPANY INCORPORATED 2978 MAIN STREET BUFFALO NY 14214 A CORP OF NY
•
Filing: 1986-11-21
•
Granted: 1988-05-24
•
Expires: 2006-11-21
Abstract
Abstract A combination ceramic sealing cover for a semiconductor package has a flat ceramic lid member with metallization applied as a foundation for a seal ring or frame portion. On the metallized layer is a gold-tin solder layer, in the form of either a solder ring that is tack welded on, or solder paste that is screened onto the base metallization and furnace reflowed.
Inventors
- 👤 Richard J. Falanga
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 14:08
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/60; Y; Y10; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12528; Y10T428/12535; Y10T428/12611; Y10T428/12771; Y10T428/12806; Y10T428/12826; Y10T428/1284; Y10T428/12861; Y10T428/12875; Y10T428/12889; Y10T428/12896
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
74 words
A ceramic sealing cover for a semiconductor package comprising a flat ceramic sealing member having one side facing said package, said one side having a perimeter; and a plural layer sealing ring formed at said perimeter and adhered to said perimeter, said sealing ring including a metallized layer formed on said ceramic sealing member, an electroplated nickel layer followed by an electroplated gold layer, and a solder layer affixed over said electroplated gold layer.
Claim 2
Dependent Claim
74 words
A ceramic sealing cover for a semiconductor package comprising a flat ceramic sealing member having one side facing said package, said one side having a perimeter; and a plural layer sealing ring formed at said perimeter and adhered to said perimeter, said sealing ring including a metallized layer formed on said ceramic sealing member, an electroplated nickel layer followed by an electroplated gold layer, and a solder layer affixed over said electroplated gold layer.
Claim 3
Dependent Claim
17 words
A ceramic sealing cover according to claim 1 in which said metallized layer is a thick-film metallization.
Claim 4
Dependent Claim
81 words
A ceramic sealing cover for a semiconductor package comprising; a flat ceramic sealing member having one side facing said package, said one side having a perimeter; and a plural layer sealing ring formed at said perimeter and adhered to said perimeter, said sealing ring including a metallized layer formed of a titanium alloy at least five microns thick deposited on said ceramic sealing member, and a solder layer over said metallized layer on the side away from said ceramic sealing member.
Claim 5
Dependent Claim
81 words
A ceramic sealing cover for a semiconductor package comprising; a flat ceramic sealing member having one side facing said package, said one side having a perimeter; and a plural layer sealing ring formed at said perimeter and adhered to said perimeter, said sealing ring including a metallized layer formed of a titanium alloy at least five microns thick deposited on said ceramic sealing member, and a solder layer over said metallized layer on the side away from said ceramic sealing member.
Claim 6
Dependent Claim
20 words
A ceramic sealing cover according to claim 3, further comprising, atop said titanium alloy layer, an electroplated noble metal layer.
Claim 7
Dependent Claim
35 words
A ceramic sealing cover according to claim 3, further comprising, atop said titanium alloy layer, an electroplated nickel layer followed by an electroplated gold layer, with said solder layer being affixed onto said gold layer.
Claim 8
Dependent Claim
78 words
A ceramic sealing cover for a semiconductor package comprising a flat ceramic sealing member having one side facing said package, said one side having a perimeter; and a plural layer sealing ring formed at said perimeter and adhered to said perimeter, said sealing ring including a gold thick-film metallized layer at least ten microns thick formed on said ceramic sealing member, and a solder layer over said metallized layer on the side away from said ceramic sealing member.
Claim 9
Dependent Claim
78 words
A ceramic sealing cover for a semiconductor package comprising a flat ceramic sealing member having one side facing said package, said one side having a perimeter; and a plural layer sealing ring formed at said perimeter and adhered to said perimeter, said sealing ring including a gold thick-film metallized layer at least ten microns thick formed on said ceramic sealing member, and a solder layer over said metallized layer on the side away from said ceramic sealing member.
Claim 10
Dependent Claim
23 words
A ceramic sealing cover according to claim 6, in which said gold thick-film is oxide/glass mix bonded gold system sold as Dupont 9110.
Claim 11
Dependent Claim
21 words
A ceramic sealing cover according to claim 6, in which said solder layer is formed directly on said gold thick-film layer.
Claim 12
Dependent Claim
78 words
A ceramic sealing cover for a semiconductor package comprising a flat ceramic sealing member having one side facing said package, said one side having a perimeter; and a plural layer sealing ring formed at said perimeter and adhered to said perimeter, said sealing ring including a palladium-silver thick-film metallized layer at least ten microns thick formed on said ceramic sealing member, and a solder layer over said metallized layer on the side away from said ceramic sealing member.
Claim 13
Dependent Claim
78 words
A ceramic sealing cover for a semiconductor package comprising a flat ceramic sealing member having one side facing said package, said one side having a perimeter; and a plural layer sealing ring formed at said perimeter and adhered to said perimeter, said sealing ring including a palladium-silver thick-film metallized layer at least ten microns thick formed on said ceramic sealing member, and a solder layer over said metallized layer on the side away from said ceramic sealing member.
Claim 14
Dependent Claim
23 words
A ceramic sealing cover according to claim 9, in which said palladium-silver thick-film is oxide/glass mix bonded Pd-Ag system, sold as Dupont 6120.
Claim 15
Dependent Claim
23 words
A ceramic sealing cover according to claim 9, in which said palladium-silver thick-film is oxide/glass mix bonded Pd-Ag system, sold as Dupont 6134.
Claim 16
Dependent Claim
20 words
A ceramic sealing cover according to claim 9, in which said solder layer is affixed directly on said palladium-silver thick-film.
References Cited (Backward Citations)
US3107756A
Cited
US3340602A
Cited
US4513062A
Cited
US4291815A
Cited
US4331253A
Cited
US4356047A
Cited
US4291815B1
Cited
US4331258A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1991-05-24 | 1991-11-23 | 1992-05-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1995-05-24 | 1995-11-23 | 1996-05-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1999-05-24 | 1999-11-23 | 2000-05-24 | $7700.00 | Window Closed / Lapsed |