US4356047A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of making ceramic lid assembly for hermetic sealing of a semiconductor chip
Assignee: Semx Corp
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Filing: 1981-02-17
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Granted: 1982-10-26
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Expires: 2001-02-17
Abstract
Abstract A ceramic lid assembly includes an integral heat fusible layer defining a hermetic sealing area provided around the periphery of a ceramic lid for hermetic sealing semiconductor chips in a flat pack. The integral heat fusible layer includes a metallized layer, an oxidation inhibiting layer, and a preflowed solderable layer in registration with each other in the hermetic sealing area.
Inventors
- 👤 Richard Gordon
- 👤 John G. Ciallella
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 15:57
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W76/60; Y; Y10; Y10S; Y10S228/00; Y10S228/903
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
61 words
A method of fabricating a lid assembly for hermetic sealing of a package containing a semiconductor chip comprising the steps of depositing a metallized layer on the surface of said lid at the periphery thereof, depositing a printed heat fusible solderable layer over said metallized layer at the periphery of said lid, and preflowing said integral heat fusible solderable layer thereto.
Claim 2
Independent Claim
61 words
A method of fabricating a lid assembly for hermetic sealing of a package containing a semiconductor chip comprising the steps of depositing a metallized layer on the surface of said lid at the periphery thereof, depositing a printed heat fusible solderable layer over said metallized layer at the periphery of said lid, and preflowing said integral heat fusible solderable layer thereto.
Claim 3
Independent Claim
60 words
A method of fabricating a lid assembly for hermetic sealing of a package containing a semiconductor chip comprising the steps of depositing a metallized layer on the surface of said lid at the periphery thereof, depositing a heat fusible preform of a solderable alloy over said metallized layer at the periphery of said lid and preflowing said heat fusible preform.
Claim 4
Independent Claim
60 words
A method of fabricating a lid assembly for hermetic sealing of a package containing a semiconductor chip comprising the steps of depositing a metallized layer on the surface of said lid at the periphery thereof, depositing a heat fusible preform of a solderable alloy over said metallized layer at the periphery of said lid and preflowing said heat fusible preform.
Claim 5
Dependent Claim
38 words
The method as set forth in claim 2 further including placing a forging weight on top of said lid to enhance the wetting of said metallized layer by said heat fusible preform when said preform begins to melt.
Claim 6
Dependent Claim
24 words
The method as set forth in claim 2 further including depositing an oxidation inhibiting layer between said metallized layer and said heat fusible preform.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1985-10-25 | 1986-04-26 | 1986-10-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1989-10-25 | 1990-04-26 | 1990-10-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1993-10-25 | 1994-04-26 | 1994-10-26 | $7700.00 | Window Closed / Lapsed |