Thermode design for tab and method of use

Claim 2

An improved thermode for bonding an interconnect tape to at least one bonding site on an electronic device, comprising: a thermode component having a heated bonding surface substantially extending in a plane; said thermode component having a longitudinal axis extendinq perpendicular to said plane; said thermode component being reciprocally moveable along said longitudinal axis whereby said heated bonding surface moves in a first direction for bonding said interconnect tape to said at least one bonding site on said electronic device; means adjoined to said thermode component for controlling deflection of said interconnect tape away from said plane of said bonding surface at a position outside said bonding site whereby thermal stresses generated in said interconnect tape while bonding are substantially reduced.

Claim 3

The improved thermode of claim 1 wherein said means affixed to said thermode include a skirt-like component affixed to the thermode component, said skirt-like component having a contact surface at an outer end portion for engaging said tape, said contact surface being spaced from the plane of said bonding surface in the first direction whereby said controlled deflection can be formed within said interconnect tape.

Claim 4

The improved thermode of claim 2 wherein said thermode component further includes a side wall extending from the edge of said bonding surface in a second direction substantially parallel to the longitudinal axis; and said skirt-like component extending substantially around said component and being affixed to said side wall along an inner end portion whereby said skirt-like component moves in conjunction with said thermode component.

Claim 5

The improved thermode of claim 3 further including said contact surface having a curved shape to reduce the contact area of the controlling deflection means with said tape.

Claim 6

The improved thermode of claim 1 wherein said means adjoined to said thermode include a deflection element affixed to said bonding surface, said deflection element having a contact surface for engaging said interconnect tape, said contact surface being spaced from the plane of said bonding surface in the first direction whereby said controlled deflection can be formed within said interconnect tape.

Claim 7

The improved thermode of claim 5 wherein said deflection element further includes said contact surface having a curved shape to reduce the contact area with said interconnect tape.

Claim 8

The improved thermode of claim 6 further including said deflection element extending about and being affixed to the outer periphery of said bonding surface.

Claim 9

The improved thermode of claim 7 further including said deflection element being substantially circular in cross section.

Claim 10

The process of bonding an interconnect tape to at least one bonding site on an electronic device, comprising the steps of: providing a thermode component having a heated bonding surface substantially extending in a plane, said thermode component having a longitudinal axis extending perpendicular to said plane; reciprocating said thermode component along said longitudinal axis whereby said heated bonding surface moves in a first direction for bonding said interconnect tape to said at least one bonding site on said electronic device; controlling deflection of said interconnect tape away from said plane of said bonding surface at a position outside said bonding site during the bonding of said interconnect tape wherein the step of controlling deflection includes the step of adjoining a skirt-like component to the thermode component, said skirt-like component having a contact surface at an outer end portion for engaging said interconnect tape, said contact surface being spaced from the plane of said bonding surface in the first direction whereby said controlled deflection can be formed within said interconnect tape whereby thermal stresses generated in said interconnect tape while bonding are substantially reduced.

Claim 11

The process of bonding an interconnect tape to at least one bonding site on an electronic device, comprising the steps of: providing a thermode component having a heated bonding surface substantially extending in a plane, said thermode component having a longitudinal axis extending perpendicular to said plane; reciprocating said thermode component along said longitudinal axis whereby said heated bonding surface moves in a first direction for bonding said interconnect tape to said at least one bonding site on said electronic device; controlling deflection of said interconnect tape away from said plane of said bonding surface at a position outside said bonding site during the bonding of said interconnect tape wherein the step of controlling deflection includes the step of adjoining a skirt-like component to the thermode component, said skirt-like component having a contact surface at an outer end portion for engaging said interconnect tape, said contact surface being spaced from the plane of said bonding surface in the first direction whereby said controlled deflection can be formed within said interconnect tape whereby thermal stresses generated in said interconnect tape while bonding are substantially reduced.

Claim 12

The process of claim 9 further including the steps of: providing said thermode component with a side wall extending from the edge of said bonding surface in a second direction substantially parallel to the longitudinal axis; extending said skirt-like component substantially around said component; and affixing said skirt-like component to said side wall along an inner end portion whereby said skirt-like component moves in conjuction with said thermode component.

Claim 13

The process of claim 10 further including the step of providing said contact surface with a curved shape to reduce the contact area with said tape.

Claim 14

The process of claim 10 further including the steps of: affixing a deflection element to said bonding surface; providing said deflection element with a contact surface for engaging said tape; and spacing said contact surface from the plane of said bonding surface in the first direction whereby said controlled deflection can be formed within said interconnect tape.

Claim 15

The process of claim 12 further including the step of forming said contact surface on said deflection element with a curved shape to reduce the contact area with said tape.

Claim 16

The process of claim 13 further including the step of extending said deflection element about and affixing said deflection element to the outer periphery of said bonding surface.

Claim 17

The process of claim 14 including the step of providing said deflection element substantially circular in cross section.