US3765590A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Structure for simultaneously attaching a plurality of semiconductor dice to their respective package leads
Assignee: Fairchild Semiconductor Corp
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Filing: 1972-05-08
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Granted: 1973-10-16
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Expires: 1992-05-08
Abstract
Abstract Semiconductor devices containing integrated circuits are attached directly to external package leads by pressing simultaneously a plurality of groups of leads against bonding pads on a plurality of face-up semiconductor dice and heating the composite structures. Solder bumps on the bonding pads contain hard pedestals which prevent the overlying leads from being pushed into the faces of the semiconductor devices while the solder on the solder bumps melts to form the bonds between the leads and the underlying semiconductor dice. The process for carrying out this operation lowers significantly the cost of each packaged semiconductor device and the resulting structure is more reliable than structures of the prior art.
Inventors
- 👤 E Duffek
- 👤 J Lane
- 👤 W Lehner
- 👤 E Funk
- 👤 A Jankowski
- 👤 F Oliver
- 👤 M Schneider
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 08:29
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0446; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W70/427; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/53; Y10T29/5313; Y10T29/53174; Y10T29/53183
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
160 words
Structure which comprises: a jig containing a plurality of receptables in one surface thereof, said receptables being capable of holding a corresponding plurality of semiconductor dice, each of said dice having bonding pads on its exposed surface; means for pressing the leads in each group of leads in a lead set containing a plurality of groups of leads against the bonding pads on an underlying semiconductor die contained in said jig, said plurality of groups of leads being arranged in said lead set so that the leads in each group of leads are capable of being located directly above the bonding pads on the semiconductor die in the underlying receptacle in said jigs; and means for aligning said lead set with respect to said plurality of semiconductor dice placed in said plurality of receptacles in said jig so as to align the leads in each group of leads over the bonding pads on the die beneath that group of leads.
Claim 2
Dependent Claim
160 words
Structure which comprises: a jig containing a plurality of receptables in one surface thereof, said receptables being capable of holding a corresponding plurality of semiconductor dice, each of said dice having bonding pads on its exposed surface; means for pressing the leads in each group of leads in a lead set containing a plurality of groups of leads against the bonding pads on an underlying semiconductor die contained in said jig, said plurality of groups of leads being arranged in said lead set so that the leads in each group of leads are capable of being located directly above the bonding pads on the semiconductor die in the underlying receptacle in said jigs; and means for aligning said lead set with respect to said plurality of semiconductor dice placed in said plurality of receptacles in said jig so as to align the leads in each group of leads over the bonding pads on the die beneath that group of leads.
Claim 3
Dependent Claim
41 words
Structure as in claim 1 including means for heating said jig containing said dice, said lead set and said means for pressing, thereby to bond the leads in each group of leads to the bonding pads on the underlying semiconductor die.
Claim 4
Dependent Claim
45 words
Structure as in claim 1 wherein said bonding pads comprise solder bumps consisting of a hard pedestal of electrically-conducting material overlaid with a selected solder, said pedestal preventing the lead being bonded above it from coming into contact with the surface of the semiconductor die.
References Cited (Backward Citations)
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US3561107A
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US3517279A
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US3516155A
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US3486223A
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US3617682A
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US3576969A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1976-10-15 | 1977-04-16 | 1977-10-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1980-10-15 | 1981-04-16 | 1981-10-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1984-10-15 | 1985-04-16 | 1985-10-16 | $7700.00 | Window Closed / Lapsed |