Press-packed semiconductor device with lateral fixing member

Claim 1

A press-packed semiconductor device comprising: a semiconductor element including a semiconductor substrate with first and second main surfaces; first and second electrodes formed on said first and second main surfaces of said semiconductor substrate, respectively, said first electrode providing an exposed portion at the peripheral portion of said first main surface; first and second heat buffer plates contacting said first and second electrodes, respectively said first heat buffer plate and said first electrode having substantially the same peripheral shape; first and second electrode disk members clamping therebetween said semiconductor element via said first and second heat buffer plates respectively in a pressing manner, said first electrode disk member fixing said first heat buffer plate; and a fixing member made of electrical insulating material and fixed on said exposed peripheral portion of said first main surface of said semiconductor substrate, said member being in abutting relation with the periphery of said first electrode, the inner portion of the surface of said fixing member being substantially in contact with the other peripheral surface of said first heat buffer plate and the portion of said fixing member surface facing said first electrode disk member being rounded to facilitate the seating of said first heat buffer plate against said first electrode during assembly of said semiconductor device whereupon said first heat buffer plate and said first electrode are fixed in peripheral alignment.