Abstract A method of fabricating a "hybrid" multilayer printed circuit board combining two dissimilar plastic layers of polyimide resin/glass and of epoxy resin/glass laminates. The finished hybrid multilayer printed circuit board is for, e.g., the support of and electrical interconnection to a plurality of magnetizable memory cores. The method includes sandwiching a plurality of epoxy-glass printed circuit boards having the desired copper patterns on both sides between two polyimide-glass printed circuit boards, each having the desired copper pattern on only one side. All the printed circuit boards are laminated with epoxy-glass prepreg to form a single hybrid multilayer printed circuit board consisting of the sandwiched epoxy-glass printed circuit boards and the sandwiching polyimide-glass printed circuit boards. Interconnections between patterned layers are formed by copper-plated through-holes.
A hybrid multilayer printed circuit board comprising: two copper-clad polyimide-glass-base boards, each having a circuit-pattern formed in the copper layer thereof; a plurality of copper-clad epoxy-glass-base boards, each having a circuit-pattern formed in the copper layer thereof; said polyimide-glass-base boards sandwiching said plurality of copper-clad epoxy-glass-base boards therebetween and one or more layers of B stage prepreg containing an expoxy resin sandwiched between adjacent ones of said polyimide-glass-base and epoxy-glass-base boards; and, a plurality of copper-plated through-holes formed in said sandwiching and sandwiched polyimide-glass-base and epoxy-glass-base boards for electrically coupling selected portions of the circuit-patterns on said boards.
Claim 2
Dependent Claim
98 words
A hybrid multilayer printed circuit board comprising: two copper-clad polyimide-glass-base boards, each having a circuit-pattern formed in the copper layer thereof; a plurality of copper-clad epoxy-glass-base boards, each having a circuit-pattern formed in the copper layer thereof; said polyimide-glass-base boards sandwiching said plurality of copper-clad epoxy-glass-base boards therebetween and one or more layers of B stage prepreg containing an expoxy resin sandwiched between adjacent ones of said polyimide-glass-base and epoxy-glass-base boards; and, a plurality of copper-plated through-holes formed in said sandwiching and sandwiched polyimide-glass-base and epoxy-glass-base boards for electrically coupling selected portions of the circuit-patterns on said boards.