Method of making multilayer printed circuits
Abstract
Abstract INCLUDE A VINYL PHENOLIC GLASS CLOTH LAYER WHICH IS LAMINATED ON ONE SIDE. ALSO DURING THE PROCESS AN ACRYLIC RESIN PROTECTIVE COATING IS APPLIED WHICH TOGETHER WITH THE VINYL PHENOLIC LAYER, PROVIDES SELECTIVELY REMOVABLE MASKS WHICH FACILITATE REMOVAL OF ELECTROLESS SURFACE PLATING ON EXPOSED CIRCUIT FACES AND DRILLING HOLES THROUGH THE BOARDS. THEREAFTER, PLATED CONNECTIONS ARE PROVIDED VIA THE HOLES BETWEEN THE CIRCUITS ON THE BOARDS. IMPROVED METHODS OF FABRICATING MULTILAYER PRINTED CIRCUIT BOARDS ARE DESCRIBED WHEREIN AT LEAST ONE EXPOSED CIRCUIT FACE IS PREFABRICATED BEFORE THE BOARDS ARE LAMINATED TOGETHER BY MEANS OF A NON-FLOWING "B" STAGE EPOXY GLASS SHEETS AND IN A FIXTURE HAVING FLOWABLE MATERIAL CONFINED ON OPPOSITE SIDES OF THE PACKAGE (VIZ THE LAYERS TO BE LAMINATED), THEREBY PERMITTING THE USE OF SUCH NONFLOWING MATERIAL WHICH REDUCES SHRINKAGE, IMPROVES LAMINATION QUALITY, MAINTAINS REGISTRATION AMONG THE BOARDS, AND SIMPLIFIES FIXTURING. THE LAMINATION PACKAGES MAY ALSO
Inventors
- 👤 Joseph F Degnan
Bibliographic Details
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