Patent US4408218A successfully refreshed from Google Patents.
US4408218A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Ceramic chip carrier with lead frame having removable rim
Assignee: TE Connectivity Corp
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Filing: 1981-03-27
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Granted: 1983-10-04
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Expires: 2001-03-27
Abstract
Abstract A ceramic chip carrier having a copper lead frame bonded directly to a ceramic substrate has a common rim connecting the tip portions of the leads. The rim is provided with extended portions which permit bending the rim away from the substrate without altering the relative positions of the tip portions. The rim is thus raised above the center region of the substrate and does not bond to the substrate and is thus readily removed after bonding the lead frame to the substrate.
Inventors
- 👤 Dimitry G. Grabbe
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 12:16
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/701; H10W70/00; H10W70/40; H10W70/411; H10W70/479
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
134 words
A semiconductor chip carrier of the type comprising a ceramic substrate with a metallic lead frame attached thereto, said lead frame comprising a plurality of leads having outer portions which extend to the edge of said substrate and tip portions proximate to the interior region of said substrate, said tip portions having integral support means attached thereto, characterized in that said lead frame is bonded directly to said substrate, said support means comprising a common rim overlying said interior region of said substrate and spaced therefrom, said rim having extended portions which connect adjacent tip portions which are substantially non-parallel, said extended portions having a length greater than the shortest straight line distance between said adjacent non-parallel tip portions, said rim being bent to a non-coplanar relationship to the rest of said lead frame.
Claim 2
Dependent Claim
134 words
A semiconductor chip carrier of the type comprising a ceramic substrate with a metallic lead frame attached thereto, said lead frame comprising a plurality of leads having outer portions which extend to the edge of said substrate and tip portions proximate to the interior region of said substrate, said tip portions having integral support means attached thereto, characterized in that said lead frame is bonded directly to said substrate, said support means comprising a common rim overlying said interior region of said substrate and spaced therefrom, said rim having extended portions which connect adjacent tip portions which are substantially non-parallel, said extended portions having a length greater than the shortest straight line distance between said adjacent non-parallel tip portions, said rim being bent to a non-coplanar relationship to the rest of said lead frame.
Claim 3
Dependent Claim
27 words
The chip carrier of claim 1 characterized in that said interior region is coplanar with the surface of the substrate to which the lead frame is bonded.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1986-10-03 | 1987-04-04 | 1987-10-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1990-10-03 | 1991-04-04 | 1991-10-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1994-10-03 | 1995-04-04 | 1995-10-04 | $7700.00 | Window Closed / Lapsed |