US4141712A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Manufacturing process for package for electronic devices
Assignee: Diacon Inc
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Filing: 1977-07-18
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Granted: 1979-02-27
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Expires: 1997-07-18
Abstract
Abstract Semiconductor packages are manufactured according to a method which eliminates or greatly reduces the occurrence of short circuited or otherwise badly positioned leads. The method utilizes a leadframe having a bonding tip support connecting the bonding tips of the leads. After the leadframe is affixed to a ceramic element, the connecting element is removed.
Inventors
- 👤 Bryant C. Rogers
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 08:27
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H10W95/00; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49799
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
86 words
A method for manufacturing a framework for a package for an electronic component comprising the steps of: attaching to a package support a leadframe having a plurality of leads extending inwardly from a frame, the inwardmost portion of each lead terminating in a bonding tip, at least some of said bonding tips being interconnected by a bonding tip support which prevents relative motion among the interconnected bonding tips during the attaching step; and then removing said bonding tip support to yield said framework for said package.
Claim 2
Independent Claim
86 words
A method for manufacturing a framework for a package for an electronic component comprising the steps of: attaching to a package support a leadframe having a plurality of leads extending inwardly from a frame, the inwardmost portion of each lead terminating in a bonding tip, at least some of said bonding tips being interconnected by a bonding tip support which prevents relative motion among the interconnected bonding tips during the attaching step; and then removing said bonding tip support to yield said framework for said package.
Claim 3
Dependent Claim
35 words
A method as in claim 1 wherein: said package support comprises a window-frame cap having an opening disposed about said bonding tip support; and said bonding tip support is removed by punching through said opening.
Claim 4
Dependent Claim
41 words
A method for manufacturing a package for an electronic component comprising the method of manufacturing a framework as in claim 2, and further including the step of attaching said framework to a package base configured for mounting of said electronic component.
Claim 5
Dependent Claim
21 words
A method as in claim 1 wherein said package support comprises a package base configured for mounting of said electronic component.
Claim 6
Dependent Claim
43 words
A method as in claim 4 wherein: said bonding tip support comprises at least one tab interconnecting at least some of said bonding tips; and said bonding tip support is removed by snapping off said tabs to yield said framework for said package.
Claim 7
Dependent Claim
66 words
A method as in claim 2 wherein the attaching step comprises the steps of: glazing a surface of said window-frame cap with a material having a temperature coefficient of expansion closely matching that of said window-frame cap; bringing said leadframe into intimate contact with said surface of said window-frame cap; and heating said leadframe and said window-frame cap to a temperature sufficient to melt said material.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1982-02-26 | 1982-08-28 | 1983-02-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1986-02-26 | 1986-08-28 | 1987-02-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1990-02-26 | 1990-08-28 | 1991-02-27 | $7700.00 | Window Closed / Lapsed |