Method of assembling a hermetically sealed semiconductor unit

Claim 2

A single layer metallizing material for bonding an integrated circuit metal oxide semiconductor in a ceramic base comprising a dispersion having the formulation: ______________________________________ Gold 48.5% Silver 2.5% Glass Powder 4.0% Ethyl Cellulose T-200 2.8% Terpineol 318 42.2% 100.0% ______________________________________

Claim 3

A single layer metallizing material for bonding an integrated circuit metal oxide semiconductor in a ceramic base comprising an alloy containing approximately 95% gold and approximately 5% silver.

Claim 4

A single layer metallizing material for bonding an integrated circuit metal oxide semiconductor in a ceramic base comprising an alloy containing approximately 95% gold and approximately 5% silver.

Claim 5

A single layer metallizing material for bonding an integrated circuit metal oxide semiconductor in a ceramic base comprising a gold-silver alloy containing approximately 4.5% to 15% silver.

Claim 6

A single layer metallizing material for bonding an integrated circuit metal oxide semiconductor in a ceramic base comprising a gold-silver alloy containing approximately 4.5% to 15% silver.

Claim 7

A component for an integrated circuit assembly comprising a ceramic base, a recess in said base, a single layer metallizing film bonded in said recess, said film comprising an alloy containing approximately 95% gold and approximately 5% silver.

Claim 8

A component for an integrated circuit assembly comprising a ceramic base, a recess in said base, a single layer metallizing film bonded in said recess, said film comprising an alloy containing approximately 95% gold and approximately 5% silver.

Claim 9

In an integrated circuit assembly comprising a ceramic base having a recess formed therein, and a single layer metallizing film bonded in said recess to the base, said film comprising a gold-silver alloy containing approximately 4.5% to 15% silver.

Claim 10

In an integrated circuit assembly comprising a ceramic base having a recess formed therein, and a single layer metallizing film bonded in said recess to the base, said film comprising a gold-silver alloy containing approximately 4.5% to 15% silver.

Claim 11

The integrated circuit assembly of claim 5 including, a glass glaze on the surface of said base, said glaze being spaced apart from the periphery of said recess.

Claim 12

The integrated circuit assembly of claim 6 including comprising a ceramic base, a recess in said base, a glass glaze on the surface of said base, said glaze being spaced apart from the periphery of said recess, a single layer metallizing film bonded in said recess, said film comprising an alloy containing approximately 95% gold and approximately a lead frame secured firmly in said glass glaze.

Claim 13

A hermetically sealed integrated circuit assembly comprising a ceramic base, a recess in the top surface of said base, a ceramic lid cooperating with said base having a floor and when sealed therewith forming an enclosed cavity about said recess, a semi-conductor chip located in said cavity, a single layer of a gold-silver alloy composed of approximately 95% gold and approximately 5% silver, disposed on the floor of said cavity and in intimate contact therewith, a portion of said chip being in intimate contact with said layer, and an aluminum alloy wire conductor, one end of said conductor being connected to a circuit element in said chip, the other end of said conductor being connected to said layer, said layer having an alloy composition such that when said lid is hermetically bonded by a glass seal to said base by the application of heat to enclose said chip in said cavity, the integrity of the junction between the layer and said other conductor end is preserved against the formation of detrimental intermetallics.

Claim 14

A hermetically sealed integrated circuit assembly comprising a ceramic base, a recess in the top surface of said base, a ceramic lid cooperating with said base having a floor and when sealed therewith forming an enclosed cavity about said recess, a semi-conductor chip located in said cavity, a single layer of a gold-silver alloy composed of approximately 95% gold and approximately 5% silver, disposed on the floor of said cavity and in intimate contact therewith, a portion of said chip being in intimate contact with said layer, and an aluminum alloy wire conductor, one end of said conductor being connected to a circuit element in said chip, the other end of said conductor being connected to said layer, said layer having an alloy composition such that when said lid is hermetically bonded by a glass seal to said base by the application of heat to enclose said chip in said cavity, the integrity of the junction between the layer and said other conductor end is preserved against the formation of detrimental intermetallics.

Claim 15

A hermetically sealed integrated circuit assembly comprising a ceramic base, a recess in the top surface of said base, a ceramic lid cooperating with said base having a floor and when sealed therewith forming an enclosed cavity about said recess, a semi-conductor chip located in said cavity, a single layer of a gold-silver alloy containing approximately 4.5 to 15% silver, disposed on the floor of said cavity and in intimate contact therewith, a portion of said chip being in intimate contact with said layer, and an aluminum alloy wire conductor, one end of said conductor being connected to a circuit element in said chip, the other end of said conductor being connected to said layer, said layer having an alloy composition such that when said lid is hermetically bonded by a glass seal to said base by the application of heat to enclose said chip in said cavity, the integrity of the junction between the layer and said other conductor end is preserved against the formation of detrimental intermetallics.

Claim 16

A hermetically sealed integrated circuit assembly comprising a ceramic base, a recess in the top surface of said base, a ceramic lid cooperating with said base having a floor and when sealed therewith forming an enclosed cavity about said recess, a semi-conductor chip located in said cavity, a single layer of a gold-silver alloy containing approximately 4.5 to 15% silver, disposed on the floor of said cavity and in intimate contact therewith, a portion of said chip being in intimate contact with said layer, and an aluminum alloy wire conductor, one end of said conductor being connected to a circuit element in said chip, the other end of said conductor being connected to said layer, said layer having an alloy composition such that when said lid is hermetically bonded by a glass seal to said base by the application of heat to enclose said chip in said cavity, the integrity of the junction between the layer and said other conductor end is preserved against the formation of detrimental intermetallics.

Claim 17

A hermetically sealed integrated circuit assembly comprising a sealed enclosure having a chamber within said enclosure, a floor, a single layer of a gold-silver alloy applied directly to said floor and in intimate contact therewith, a metal oxide semi-conductor chip in said chamber, in intimate contact with said layer, an aluminum alloy wire conductor connecting said chip to said gold-silver layer, said layer including a predetermined proportion of silver for forming with said conductor a bonding junction which exhibits requisite operational characteristics of bond strength and low resistivity when the assembly has been subjected to heat for hermetically sealing said enclosure, said predetermined proportion of silver in the gold-silver alloy being approximately 4.5 to 15%.

Claim 18

A hermetically sealed integrated circuit assembly comprising a sealed enclosure having a chamber within said enclosure, a floor, a single layer of a gold-silver alloy applied directly to said floor and in intimate contact therewith, a metal oxide semi-conductor chip in said chamber, in intimate contact with said layer, an aluminum alloy wire conductor connecting said chip to said gold-silver layer, said layer including a predetermined proportion of silver for forming with said conductor a bonding junction which exhibits requisite operational characteristics of bond strength and low resistivity when the assembly has been subjected to heat for hermetically sealing said enclosure, said predetermined proportion of silver in the gold-silver alloy being approximately 4.5 to 15%.