US3593412A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Bonding system for semiconductor device
Assignee: Motorola Solutions Inc
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Filing: 1969-07-22
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Granted: 1971-07-20
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Expires: 1989-07-22
Abstract
Abstract A method of bonding a semiconductor device to a metal substrate involving depositing a gold solder preform onto the device and coating the metal substrate with a first layer of gold, a second layer of silver and a third layer of gold. The device is bonded to the metal substrate by heating the substrate to an elevated temperature and placing the gold preform on top of the third gold layer of the substrate.
Inventors
- 👤 Robert S Foote
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 21:57
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/30; H10W72/071; H10W72/073; H10W72/07331; H10W72/07336
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
21 words
The method as described in claim 1 wherein said gold solder preform has a thickness of about 100 to 400 mils.
Claim 2
Dependent Claim
22 words
The method as described in claim 1 wherein said first layer of gold has a thickness of about 0.5 to 3 microinches.
Claim 3
Dependent Claim
31 words
A method as described in claim 1 wherein said first and said second layer of gold and said layer of silver have a combined thickness of about 21 to 50 microinches.
Claim 4
Dependent Claim
19 words
A method as described in claim 1 wherein said heating step is between about 425* C. and 475* C.
Claim 5
Independent Claim
115 words
The method of bonding a semiconductor device onto a header comprising the steps of: coating a surface of said semiconductor device with a first layer of gold, depositing a gold solder preform on said first layer of gold, coating a portion of said header with a first layer of gold, coating said first gold layer with a layer of silver about 8 to10 microinches thick, coating said silver layer with a second layer of gold about 12 to 50 microinches thick, placing said semiconductor device on said header whereby said gold preform is in contact with said second gold layer, and heating said header to a temperature sufficient to bond said header to said device.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-07-19 | 1975-01-18 | 1975-07-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-07-19 | 1979-01-18 | 1979-07-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-07-19 | 1983-01-18 | 1983-07-20 | $7700.00 | Window Closed / Lapsed |