US3691289A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Packaging of semiconductor devices
Assignee: 3M Co
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Filing: 1970-10-22
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Granted: 1972-09-12
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Expires: 1990-10-22
Abstract
Abstract A packaging device is provided for the housing of semiconductor devices to facilitate handling, testing and later attachment thereof to further electrical circuitry. The packaging device comprises a self-supporting dielectric substrate in the form of a channel and a plurality of conductive land areas on the inner surfaces of the channel. The land areas define at least one site within the channel which is adapted to electrically receive a semiconductor device. The land areas extend outward from said site in the form of fingers, the fingers extending upwardly along the side walls of the channel so as to be exposed for later attachment thereof to further electrical circuitry.
Inventors
- 👤 Robert R Rohloff
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 08:16
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/688; H05; H05K; H05K1/00; H05K1/18; H05K1/189; H10W74/00; H10W74/10; H10W74/111; H10W74/114; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
122 words
A packaging device for the housing of semiconductor devices to facilitate handling, testing and later attachment thereof to further electrical circuitry, the packaging device comprising a self-supporting, resilient, deformable dielectric substrate in the form of a channel having a base and side walls, said channel having a predetermined pattern of a plurality of conductive land areas therewithin, said land areas defining at least one site within said channel, said site being adapted to electrically receive a semiconductor device, and said land areas extending outward from said site in the form of a plurality of fingers, said fingers being continuous and extending upwardly along the side walls of said channel, wherein said fingers are exposed for later attachment thereof to further electrical circuitry.
Claim 2
Dependent Claim
122 words
A packaging device for the housing of semiconductor devices to facilitate handling, testing and later attachment thereof to further electrical circuitry, the packaging device comprising a self-supporting, resilient, deformable dielectric substrate in the form of a channel having a base and side walls, said channel having a predetermined pattern of a plurality of conductive land areas therewithin, said land areas defining at least one site within said channel, said site being adapted to electrically receive a semiconductor device, and said land areas extending outward from said site in the form of a plurality of fingers, said fingers being continuous and extending upwardly along the side walls of said channel, wherein said fingers are exposed for later attachment thereof to further electrical circuitry.
Claim 3
Dependent Claim
23 words
A packaging device in accordance with claim 1, wherein said fingers extend upwardly beyond the edges of the side walls of said channel.
Claim 4
Dependent Claim
125 words
A plurality of packaging devices in continuous strip form for the housing of semiconductor devices to facilitate handling, testing, and later attachment thereof to further electrical circuitry, comprising a continuous self-supporting, resilient, deformable dielectric substrate in the form of a channel having a base and sidewalls, said channel having longitudinally-spaced therewithin predetermined repeating patterns of a plurality of conductive land areas, the land areas of each said pattern defining at least one site within said channel, said site being adapted to electrically receive a semiconductor device and said land areas extending outward from said site in the form of a plurality of fingers, said fingers being continuous and extending upwardly along the sidewalls of said channel and adapted for attachment thereof to further electrical circuitry.
Claim 5
Dependent Claim
125 words
A plurality of packaging devices in continuous strip form for the housing of semiconductor devices to facilitate handling, testing, and later attachment thereof to further electrical circuitry, comprising a continuous self-supporting, resilient, deformable dielectric substrate in the form of a channel having a base and sidewalls, said channel having longitudinally-spaced therewithin predetermined repeating patterns of a plurality of conductive land areas, the land areas of each said pattern defining at least one site within said channel, said site being adapted to electrically receive a semiconductor device and said land areas extending outward from said site in the form of a plurality of fingers, said fingers being continuous and extending upwardly along the sidewalls of said channel and adapted for attachment thereof to further electrical circuitry.
Claim 6
Dependent Claim
16 words
A convolutely wound roll comprising the plurality of packaging devices in strip form of claim 3.
Claim 7
Dependent Claim
152 words
A packaging device for the housing of semiconductor devices to facilitate handling, testing and later attachment thereof to further electrical circuitry, the packaging device comprising a self-supporting, resilient, deformable, dielectric substrate in the form of a channel having a base and side walls, the top edges of said side walls having a plurality of notches therein defining tabs therebetween, said channel having a predetermined pattern of a plurality of conductive land areas therewithin, said land areas defining at least one site within said channel, said site being adapted to electrically receive a semiconductor device, and said land areas extending outward from said site in the form of a plurality of fingers, said fingers being continuous and extending upwardly along the side walls of said channel forming leads, wherein the spaces between adjacent leads coincide with the notches in the top edges of said side walls and said leads extend onto said tabs.
Claim 8
Dependent Claim
152 words
A packaging device for the housing of semiconductor devices to facilitate handling, testing and later attachment thereof to further electrical circuitry, the packaging device comprising a self-supporting, resilient, deformable, dielectric substrate in the form of a channel having a base and side walls, the top edges of said side walls having a plurality of notches therein defining tabs therebetween, said channel having a predetermined pattern of a plurality of conductive land areas therewithin, said land areas defining at least one site within said channel, said site being adapted to electrically receive a semiconductor device, and said land areas extending outward from said site in the form of a plurality of fingers, said fingers being continuous and extending upwardly along the side walls of said channel forming leads, wherein the spaces between adjacent leads coincide with the notches in the top edges of said side walls and said leads extend onto said tabs.
Claim 9
Dependent Claim
22 words
A packaging device in accordance with claim 5, wherein a semiconductor device is electrically connected to said plurality of conductive land areas.
Claim 10
Dependent Claim
17 words
A packaging device in accordance with claim 6, wherein said channel contains encapsulant covering said semiconductor device.
Claim 11
Dependent Claim
161 words
A plurality of packaging devices in continuous strip form for the housing of semiconductor devices to facilitate handling, testing, and later attachment thereof to further electrical circuitry, comprising a continuous self-supporting, resilient, deformable dielectric substrate in the form of a channel having a base and side walls, the top edges of said side walls having a plurality of notches therein defining tabs therebetween, said channel having longitudinally spaced therewithin predetermined repeating patterns of a plurality of conductive land areas, the land areas of each said pattern defining at least one site within said channel, said site being adapted to electrically receive a semiconductor device and said land areas extending outward from said site in the form of a plurality of fingers, said fingers being continuous and extending upwardly along the sidewalls of said channel forming leads, wherein the spaces between adjacent leads coincide with the notches in the top edges of said side walls and said leads extend onto said tabs.
Claim 12
Dependent Claim
161 words
A plurality of packaging devices in continuous strip form for the housing of semiconductor devices to facilitate handling, testing, and later attachment thereof to further electrical circuitry, comprising a continuous self-supporting, resilient, deformable dielectric substrate in the form of a channel having a base and side walls, the top edges of said side walls having a plurality of notches therein defining tabs therebetween, said channel having longitudinally spaced therewithin predetermined repeating patterns of a plurality of conductive land areas, the land areas of each said pattern defining at least one site within said channel, said site being adapted to electrically receive a semiconductor device and said land areas extending outward from said site in the form of a plurality of fingers, said fingers being continuous and extending upwardly along the sidewalls of said channel forming leads, wherein the spaces between adjacent leads coincide with the notches in the top edges of said side walls and said leads extend onto said tabs.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-09-12 | 1976-03-13 | 1976-09-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-09-12 | 1980-03-13 | 1980-09-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-09-12 | 1984-03-13 | 1984-09-12 | $7700.00 | Window Closed / Lapsed |