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US3930908A Expired / Lapsed US ⏱️ 0.0 years remaining

Accurate control during vapor phase epitaxy

Assignee: RCA Corp
•
Filing: 1974-09-30
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Granted: 1976-01-06
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Expires: 1994-09-30
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Abstract

Abstract A small quantity or low flow rate of a gaseous component is accurately and quickly introduced into the reaction chamber during the process of vapor phase epitaxy. The gaseous component is selectively communicated directly into a primary gaseous flow which passes into the reaction chamber. By maintaining a continuous flow of the gaseous component, the gaseous component can be accurately introduced into the reaction chamber without initially entering the reaction chamber with a large surge of concentration.

Inventors

  • 👤 Stuart Talbot Jolly

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-25 01:13
CPC Classifications
C; C30; C30B; C30B25/00; C30B25/02; C30B25/14; Y; Y10; Y10S; Y10S148/00; Y10S148/007; Y10S148/056; Y10S148/057; Y10S148/067; Y10S148/072; Y10S438/00; Y10S438/935

Claims Analysis

Total Claims: 11
Claim 1
Independent Claim 102 words
In the process of vapor phase epitaxy, a method for quickly and accurately varying the rate of flow of a gaseous component into the reaction chamber, comprising the steps of: a. establishing at least one primary gaseous flow into said reaction chamber, b. establishing a desired flow of said gaseous component, and c. communicating with gaseous component directly into said primary gaseous flow with said gaseous component passing through substantially no intervening space before reaching said primary gaseous flow such that said gaseous component is swept into said reaction chamber whenever said gaseous component is communicated directly into said primary gaseous flow.
Claim 2
Dependent Claim 102 words
In the process of vapor phase epitaxy, a method for quickly and accurately varying the rate of flow of a gaseous component into the reaction chamber, comprising the steps of: a. establishing at least one primary gaseous flow into said reaction chamber, b. establishing a desired flow of said gaseous component, and c. communicating with gaseous component directly into said primary gaseous flow with said gaseous component passing through substantially no intervening space before reaching said primary gaseous flow such that said gaseous component is swept into said reaction chamber whenever said gaseous component is communicated directly into said primary gaseous flow.
Claim 3
Dependent Claim 31 words
A method in accordance with claim 1 in which said gaseous component is communicated away from the primary gaseous flow when said gaseous component is not required in said reaction chamber.
Claim 4
Dependent Claim 18 words
A method in accordance with claim 2 in which said flow of gaseous component is kept continuously flowing.
Claim 5
Dependent Claim 37 words
A method in accordance with claim 3 in which said flow of gaseous component introduced into said primary gaseous flow is small as compared to the flow of said primary gaseous flow introduced into said reaction chamber.
Claim 6
Dependent Claim 28 words
A method in accordance with claim 4 in which said flow of gaseous component introduced into said reaction chamber is varied without appreciably altering said primary gaseous flow.
Claim 7
Dependent Claim 128 words
In the process of vapor phase epitaxy in which more than one gaseous component is communicated into a reaction chamber for deposition onto a substrate, a method for quickly and accurately varying the rate of flow of at least one of said gaseous components into said reaction chamber, comprising the steps of: a. establishing at least one primary gaseous flow into said reaction chamber, b. establishing a desired flow of said one gaseous component, and c. communicating with one gaseous component directly into said primary gaseous flow with said gaseous component passing through substantially no intervening space before reaching said primary gaseous flow such that said one gaseous component is swept into said reaction chamber whenever said one gaseous component is communicated directly into said primary gaseous flow.
Claim 8
Dependent Claim 128 words
In the process of vapor phase epitaxy in which more than one gaseous component is communicated into a reaction chamber for deposition onto a substrate, a method for quickly and accurately varying the rate of flow of at least one of said gaseous components into said reaction chamber, comprising the steps of: a. establishing at least one primary gaseous flow into said reaction chamber, b. establishing a desired flow of said one gaseous component, and c. communicating with one gaseous component directly into said primary gaseous flow with said gaseous component passing through substantially no intervening space before reaching said primary gaseous flow such that said one gaseous component is swept into said reaction chamber whenever said one gaseous component is communicated directly into said primary gaseous flow.
Claim 9
Dependent Claim 28 words
A method in accordance with claim 6 in which said primary gaseous flow has a maximized velocity such that the overall growth rate on said substrate is maintained.
Claim 10
Dependent Claim 140 words
In the process of vapor phase epitaxy in which more than one gaseous component is communicated into a reaction chamber for deposition onto a substrate, a method for quickly and accurately varying the rate of flow of at least one of said gaseous components into said reaction chamber, comprising the steps of: a. establishing at least one primary gaseous flow through a control member and into said reaction chamber, b. establishing a desired flow of said one gaseous component through said control member, and c. communicating said one gaseous component directly into said primary gaseous flow in said control member with said gaseous component passing through substantially no intervening space before reaching said primary gaseous flow such that one gaseous component is swept into said reaction chamber whenever said one gaseous component is communicated directly into said primary gaseous flow.
Claim 11
Dependent Claim 140 words
In the process of vapor phase epitaxy in which more than one gaseous component is communicated into a reaction chamber for deposition onto a substrate, a method for quickly and accurately varying the rate of flow of at least one of said gaseous components into said reaction chamber, comprising the steps of: a. establishing at least one primary gaseous flow through a control member and into said reaction chamber, b. establishing a desired flow of said one gaseous component through said control member, and c. communicating said one gaseous component directly into said primary gaseous flow in said control member with said gaseous component passing through substantially no intervening space before reaching said primary gaseous flow such that one gaseous component is swept into said reaction chamber whenever said one gaseous component is communicated directly into said primary gaseous flow.

References Cited (Backward Citations)

US3366516A Cited
US3321278A Cited
US3173814A Cited
US3243323A Cited
US3522118A Cited
US3511702A Cited
US3413145A Cited
US3721583A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1979-01-05 1979-07-07 1980-01-06 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1983-01-05 1983-07-07 1984-01-06 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1987-01-05 1987-07-07 1988-01-06 $7700.00 Window Closed / Lapsed

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