Patent US6422464B1 successfully refreshed from Google Patents.
Patent US20050161682A1 successfully refreshed from Google Patents.
US20050161682A1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Light emitting diodes packaged for high temperature operation
Assignee: Lighting Science Group Corp
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Filing: 2005-03-18
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Granted: —
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Expires: 2025-03-18
Abstract
Abstract In accordance with the invention, an LED packaged for high temperature operation comprises a metal base including an underlying thermal connection pad and a pair of electrical connection pads, an overlying ceramic layer, and a LED die mounted overlying the metal base. The LED is thermally coupled through the metal base to the thermal connection pad, and the electrodes are electrically connected to the underlying electrical connection pads. A low thermal resistance insulating layer can electrically insulate other areas of die from the base while permitting heat passage. Heat flow can be enhanced by thermal vias to the thermal connector pad. Ceramic layers formed overlying the base can add circuitry and assist in distributing emitted light. The novel package can operate at temperatures as high as 250° C.
Inventors
- 👤 Joseph Mazzochette
- 👤 Greg Blonder
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 22:17
CPC Classifications
H; H10; H10H; H10H20/00; H10H20/80; H10H20/85; H10H20/858; H10H20/8585; H10H20/8582; H10W; H10W90/00; H10H20/8506; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
5 words
1 - 10 . (canceled)
Claim 2
Dependent Claim
5 words
1 - 10 . (canceled)
Claim 3
Dependent Claim
106 words
11 . A low temperature co-fired on metal (LTCC-M) light emitting diode (LED) assembly for high temperature operation comprising: a metal base, the metal base including a thermal connection surface; at least one LED die, the LED die having a pair of electrodes overlying and electrically insulated from the metal base, the die thermally coupled through the metal base to the thermal connection surface; a layer of ceramic overlying the metal base, the layer of ceramic having at least one opening to house the LED die; and a plurality of conductive traces insulated from the metal base, the LED electrodes electrically connected to the conductive traces.
Claim 4
Dependent Claim
106 words
11 . A low temperature co-fired on metal (LTCC-M) light emitting diode (LED) assembly for high temperature operation comprising: a metal base, the metal base including a thermal connection surface; at least one LED die, the LED die having a pair of electrodes overlying and electrically insulated from the metal base, the die thermally coupled through the metal base to the thermal connection surface; a layer of ceramic overlying the metal base, the layer of ceramic having at least one opening to house the LED die; and a plurality of conductive traces insulated from the metal base, the LED electrodes electrically connected to the conductive traces.
Claim 5
Dependent Claim
25 words
12 . The LED assembly of claim 1 further comprising a plurality of edge connector fingers, wherein the fingers are connected to the LED electrodes.
Claim 6
Dependent Claim
29 words
13 . The LED assembly of claim 1 further comprising a plurality of edge connector fingers, wherein the fingers are connected to decoder/driver electronics that control the LED electrodes.
Claim 7
Dependent Claim
23 words
14 . The LED assembly of claim 0 wherein the decoder/driver electronics that control the LED electrodes is embedded in the LTCC-M package.
Claim 8
Dependent Claim
26 words
15 . The LED assembly of claim 1 further comprising an additional metal block on which the LED assembly is mounted to further improve heat dissipation.
Claim 9
Dependent Claim
15 words
16 . The LED assembly of claim 1 wherein the LED die is a flip-chip.
Claim 10
Dependent Claim
23 words
17 . The LED assembly of claim 0 wherein the flip-chip is bonded to the traces by conductive balls comprising solder or gold.
Claim 11
Dependent Claim
26 words
18 . The LED assembly of claim 1 further comprising isolated terminals formed on the metal base, the isolated terminals electrically connected to the LED electrodes.
Claim 12
Dependent Claim
32 words
19 . The LED assembly of claim 1 further comprising isolated terminals formed on the metal base, the isolated terminals electrically connected to decoder/driver electronics, the electronics mounted within the LTCC-M assembly.
Claim 13
Dependent Claim
26 words
20 . The LED assembly of claims 0 and 0 further comprising vias in the insulating layer, the vias electrically connecting traces to the isolated terminals.
Claim 14
Dependent Claim
73 words
21 . An array of LEDs packaged for high temperature operation comprising: a plurality of LEDs according to claim 1 overlying one or more metal bases; an apertured PC board overlying the LEDs, the light emitting portion of each LED aligned with a corresponding aperture of the PC board; and a heat sink underlying the LEDs, the heat sink secured in thermal contact with the one or more metal bases of the LEDs.
Claim 15
Dependent Claim
19 words
22 . The array of claim 21 wherein the apertured PC board further comprises electrical connections to the LEDs.
Claim 16
Dependent Claim
29 words
23 . The array of claim 21 wherein the apertured PC board is secured to the heat sink to hold the LEDs in thermal contact with the heat sink.
Claim 17
Dependent Claim
30 words
24 . The array of claim 21 wherein thermal grease is disposed between the LEDs and the heat sink to facilitate thermal coupling between the LEDs and the heat sink.
Claim 18
Dependent Claim
28 words
25 . The array of claim 21 wherein the LEDs are surface mounted on the PC board with their light emitting portions aligned with apertures in the boards.
Claim 19
Dependent Claim
21 words
26 . The array of claim 21 wherein the LEDs are connected to contacts on the PC board by solder reflow.
Claim 20
Dependent Claim
13 words
27 . The array of claim 21 wherein the heat sink comprises aluminum.
Claim 21
Dependent Claim
18 words
28 . The array of claim 21 wherein the LEDs are disposed in a closely packed heragonal array.
Claim 22
Dependent Claim
33 words
29 . The array of claim 21 wherein the LEDs are distributed in sectors around the circumference of a circle and in the center of the circle to emulate a concentrated light source.
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