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US6480389B1 Expired / Lapsed US ⏱️ 0.0 years remaining

Heat dissipation structure for solid-state light emitting device package

Assignee: Opto Tech Corp
•
Filing: 2002-03-19
•
Granted: 2002-11-12
•
Expires: 2022-03-19
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Abstract

Abstract A light emitting diode (LED) includes a heat dissipation structure characterized by having a heat dissipating fluidic coolant filled in a hermetically sealed housing where at least one LED chip mounted on a metallic substrate is dwelled inside. The heat dissipation structure is configured with a metallic wall erected from the metallic substrate, which is used to hold a transparent cap of the sealed housing in correct position. Furthermore, the erected wall surrounds in proximity with the at least one LED chip, so that the joule heat generated therefrom can be quickly spread out, through the heat dissipating fluidic coolant, to the erected wall, and then diffused along the wall down to the metallic substrate which adjoins with a larger external heat sink for draining the heat, thus preventing the at least one LED from overheating. The other characteristic of the invention resides in that the transparent cap of the sealed housing is made of transparent materials, wherein a convex portion contacted with the heat dissipating fluidic coolant is formed on the inner surface of the transparent cap. Hence if there is any air bubble existing inside the housing due to insufficient filling, it will not dwell in the field of line-of-sight due to buoyancy. The possibility of scattering the LED light due to existing of the bubbles therefore is avoided.

Inventors

  • 👤 Jin-Shown Shie
  • 👤 Chih-Yuan Yen
  • 👤 Chien-Chen Hung
  • 👤 Mei-hsueh Peng

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-09 18:08
CPC Classifications
H; H10; H10H; H10H20/00; H10H20/80; H10H20/85; H10H20/858; H10H20/8586; H10H20/855; H10K; H10K50/00; H10K50/80; H10K50/87; H10W; H10W74/00; H10W74/10

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 190 words
A heat dissipation structure for a light emitting device comprising: a metallic substrate having a top surface and a bottom surface, the top surface configured with a cup-shaped portion for the light emitting device being mounted therein and the bottom surface opposite to the top surface including a metallic solder layer deposited thereon, wherein the cup-shaped portion has an upper surface, an inner surface, and an outer surface, an electrically insulating layer deposited on the upper surface and on the outer surface, an electrically conductive electrode layer deposited on the electrically insulating layer and on the inner surface of the cup-shaped portion, and the electrically conductive electrode layer includes two divided electrodes, the one electrode formed on the inner surface of the cup-shaped portion and the other electrode formed on the upper surface and the outer surface thereof; an electrically insulating fluidic coolant filled in the cup-shaped portion; and a light transparent housing hermetically attached to the metallic substrate to seal the electrically insulating fluidic coolant filled in the cup-shaped portion, the light transparent housing having an inner surface configured with a convex portion opposite to the light emitting device.
Claim 2
Dependent Claim 190 words
A heat dissipation structure for a light emitting device comprising: a metallic substrate having a top surface and a bottom surface, the top surface configured with a cup-shaped portion for the light emitting device being mounted therein and the bottom surface opposite to the top surface including a metallic solder layer deposited thereon, wherein the cup-shaped portion has an upper surface, an inner surface, and an outer surface, an electrically insulating layer deposited on the upper surface and on the outer surface, an electrically conductive electrode layer deposited on the electrically insulating layer and on the inner surface of the cup-shaped portion, and the electrically conductive electrode layer includes two divided electrodes, the one electrode formed on the inner surface of the cup-shaped portion and the other electrode formed on the upper surface and the outer surface thereof; an electrically insulating fluidic coolant filled in the cup-shaped portion; and a light transparent housing hermetically attached to the metallic substrate to seal the electrically insulating fluidic coolant filled in the cup-shaped portion, the light transparent housing having an inner surface configured with a convex portion opposite to the light emitting device.
Claim 3
Dependent Claim 21 words
The heat dissipation structure as recited in claim 1 , wherein the metallic substrate is made of a thermally conductive material.
Claim 4
Dependent Claim 25 words
The heat dissipation structure as recited in claim 2 , wherein the electrically insulating layer is made of an oxide of the thermally conductive material.
Claim 5
Dependent Claim 85 words
The heat dissipation structure as recited in claim 2 , further comprising a printed circuit board including the thermally conductive material, wherein the printed circuit board has a surface with at least one electrode formed thereon, and the printed circuit board is electrically connected to the metallic substrate by joining the at least one electrode to the metallic solder layer and joining the other than at least one electrode to the electrode formed on the upper surface and the outer surface of the cup-shaped portion.
Claim 6
Dependent Claim 22 words
The heat dissipation structure as recited in claim 1 , wherein the electrically conductive electrode layer is made of a light-reflective metal.
Claim 7
Dependent Claim 36 words
The heat dissipation structure as recited in claim 1 , wherein the light transparent housing has an outer surface configured with a convex portion opposite to the convex portion of the inner surface of the housing.

References Cited (Backward Citations)

US4729076A Cited
US4935665A Cited
US5119174A Cited
US5857767A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2005-11-11 2006-05-13 2006-11-12 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2009-11-11 2010-05-13 2010-11-12 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2013-11-11 2014-05-13 2014-11-12 $7700.00 Window Closed / Lapsed

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