Claims Analysis
Total Claims: 41
Claim 1
Independent Claim
79 words
A module having at least one optoelectronic device, comprising: at least one electrically and thermally conductive lead frame substrate having an upper surface and being adapted to act as a heat sink; at least one optoelectronic device electrically connected to said upper surface of said lead frame substrate; and at least one connector interconnected with said lead frame substrate that is adapted to interconnect said lead frame substrate with at least one other lead frame substrate of another module.
Claim 2
Dependent Claim
79 words
A module having at least one optoelectronic device, comprising: at least one electrically and thermally conductive lead frame substrate having an upper surface and being adapted to act as a heat sink; at least one optoelectronic device electrically connected to said upper surface of said lead frame substrate; and at least one connector interconnected with said lead frame substrate that is adapted to interconnect said lead frame substrate with at least one other lead frame substrate of another module.
Claim 3
Dependent Claim
28 words
The module of claim 1, wherein said at least one lead frame substrate comprises a plurality of lead frame substrates separated and held together by an insulator material.
Claim 4
Dependent Claim
32 words
The module of claim 2, wherein at least one of said lead frame substrates has an input electrical terminal, and wherein another of said lead frame substrates has an output electrical terminal.
Claim 5
Dependent Claim
37 words
The module of claim 3, wherein said optoelectronic device has a rated forward current associated therewith, and wherein said input electrical terminal receives an amount of current that exceeds the rated forward current of said optoelectronic device.
Claim 6
Dependent Claim
37 words
The module of claim 2, wherein at least some of said lead frame substrates have an optoelectronic device affixed thereto, and wherein each optoelectronic device is also electrically connected to another lead frame substrate in said module.
Claim 7
Dependent Claim
31 words
The module of claim 1, further comprising: a reflector unit, having at least one reflector, affixed to said lead frame substrate such that said reflector is adjacent to said optoelectronic device.
Claim 8
Dependent Claim
25 words
The module of claim 6, wherein said reflector unit includes a plurality of reflectors, each of said reflectors having a coating of a reflective material.
Claim 9
Dependent Claim
17 words
The module of claim 6, wherein said at least one connector is affixed to said reflector unit.
Claim 10
Dependent Claim
32 words
The module of claim 8, wherein said reflector unit has a male connector and a female connector that are adapted to connect said reflector unit with a reflector unit of another module.
Claim 11
Dependent Claim
14 words
The module of claim 1, wherein said optoelectronic device is a light emitting diode.
Claim 12
Dependent Claim
14 words
The module of claim 1, wherein said lead frame substrate is U-shaped in cross-section.
Claim 13
Dependent Claim
27 words
The module of claim 1, wherein at least a portion of the lead frame substrate to which an optoelectronic device is affixed is coated with a metal.
Claim 14
Dependent Claim
105 words
An array of optoelectronic devices, comprising: a plurality of modules of optoelectronic devices, each of said modules including a plurality of electrically and thermally conductive lead frame substrates, each of said substrates being adapted to act as a heat sink, at least one of said substrates having an input electrical terminal and at least one other substrate having an output electrical terminal; an optoelectronic device electrically connected to at least some of said lead frame substrates; means for mechanically connecting two of said modules together; and means for electrically connecting an input terminal of one of said modules to an output terminal of another module.
Claim 15
Dependent Claim
105 words
An array of optoelectronic devices, comprising: a plurality of modules of optoelectronic devices, each of said modules including a plurality of electrically and thermally conductive lead frame substrates, each of said substrates being adapted to act as a heat sink, at least one of said substrates having an input electrical terminal and at least one other substrate having an output electrical terminal; an optoelectronic device electrically connected to at least some of said lead frame substrates; means for mechanically connecting two of said modules together; and means for electrically connecting an input terminal of one of said modules to an output terminal of another module.
Claim 16
Dependent Claim
39 words
The array of claim 13, wherein each of said optoelectronic devices has a rated forward current associated therewith, and wherein said input electrical terminal receives an amount of current that exceeds the rated forward current of said optoelectronic devices.
Claim 17
Dependent Claim
36 words
The array of claim 13, wherein each module also includes: a reflector unit interconnected with said lead frame substrates and having a plurality of reflectors thereon, each of said reflectors being adjacent to an optoelectronic device.
Claim 18
Dependent Claim
24 words
The array of claim 15, wherein each of said modules includes at least two registration members that are used to align said reflector unit.
Claim 19
Dependent Claim
20 words
The array of claim 13, wherein the lead frame substrates in each module are held together by an insulator material.
Claim 20
Dependent Claim
14 words
The array of claim 13, wherein said lead frame substrates are U-shaped in cross-section.
Claim 21
Dependent Claim
19 words
The array of claim 13, wherein each optoelectronic device is also electrically connected to an adjacent lead frame substrate.
Claim 22
Dependent Claim
30 words
The array of claim 13, wherein said mechanically connecting means comprises: at least one male connector interconnected with each module; and at least one female connector interconnected with each module.
Claim 23
Dependent Claim
29 words
The array of claim 13, wherein said electrical connecting means comprises a lead wire connected between an input terminal of a module and an output terminal of another module.
Claim 24
Independent Claim
63 words
A method of manufacturing a module having at least one optoelectronic device, comprising; forming at least one lead frame substrate; applying an insulator material onto portions of said lead frame substrate to create a lead frame unit; affixing said at least one optoelectronic device onto said lead frame unit; and forming at least one connector that connects said module to an adjacent module.
Claim 25
Independent Claim
63 words
A method of manufacturing a module having at least one optoelectronic device, comprising; forming at least one lead frame substrate; applying an insulator material onto portions of said lead frame substrate to create a lead frame unit; affixing said at least one optoelectronic device onto said lead frame unit; and forming at least one connector that connects said module to an adjacent module.
Claim 26
Dependent Claim
26 words
The method of claim 22, wherein said lead frame forming step includes: creating a lead frame substrate; and bending said lead frame substrate into a U-shape.
Claim 27
Dependent Claim
35 words
The method of claim 22, wherein said insulator applying step includes: placing said at least one lead frame substrate into a mold; and molding a thermoplastic insulator material onto portions of said lead frame substrate.
Claim 28
Dependent Claim
35 words
The method of claim 22, wherein said device affixing step includes: bonding an optoelectronic device onto said lead frame substrate; and affixing a lead wire between said bonded optoelectronic device and another lead frame substrate.
Claim 29
Dependent Claim
16 words
The method of claim 22, further comprising: coating said optoelectronic device with a transparent protective layer.
Claim 30
Dependent Claim
22 words
The method of claim 22, wherein lead frame forming step includes: forming at least one electrical terminal on said lead frame substrate.
Claim 31
Dependent Claim
43 words
The method of claim 22, further comprising: forming a reflector unit having at least one reflector; and affixing said reflector unit to said lead frame unit such that said at least one reflector is disposed adjacent to said at least one optoelectronic device.
Claim 32
Dependent Claim
22 words
The method of claim 28, wherein said reflector unit forming step includes: applying a layer of a reflective material onto said reflector.
Claim 33
Dependent Claim
35 words
The method of claim 28, wherein said reflector unit forming step includes: forming a plurality of connectors on said reflector unit such that each of said connectors may be connected with an adjacent reflector unit.
Claim 34
Dependent Claim
25 words
The method of claim 28, wherein said reflector unit affixing step includes: bonding said reflector unit onto an upper surface of said lead frame unit.
Claim 35
Dependent Claim
31 words
The method of claim 28, further comprising: forming at least two registration members on said lead frame unit that are used to align said reflector unit with said lead frame unit.
Claim 36
Independent Claim
130 words
A method of manufacturing an array of optoelectronic devices, comprising: creating a plurality of modules of optoelectronic devices, each of said modules being created by forming a plurality of lead frame substrates such that at least one of said substrates has an input electrical terminal and at least one of said lead frame substrates has an output electrical terminal; applying an insulator material onto portions of said lead frame substrates to create a unit of spaced lead frame substrates; forming at least one connector that is interconnected with said lead frame unit; mechanically connecting said at least one connector on each module with a connector of another module; and electrically connecting the output electrical terminal of at least one of said modules with the input electrical terminal of another module.
Claim 37
Independent Claim
130 words
A method of manufacturing an array of optoelectronic devices, comprising: creating a plurality of modules of optoelectronic devices, each of said modules being created by forming a plurality of lead frame substrates such that at least one of said substrates has an input electrical terminal and at least one of said lead frame substrates has an output electrical terminal; applying an insulator material onto portions of said lead frame substrates to create a unit of spaced lead frame substrates; forming at least one connector that is interconnected with said lead frame unit; mechanically connecting said at least one connector on each module with a connector of another module; and electrically connecting the output electrical terminal of at least one of said modules with the input electrical terminal of another module.
Claim 38
Dependent Claim
23 words
The method of claim 33, further comprising: electrically connecting the input terminal of at least one of said modules with a power supply.
Claim 39
Dependent Claim
47 words
The method of claim 33, wherein said module creating step further comprises: forming a reflector unit having a plurality of reflectors; and affixing said reflector unit to said unit of spaced lead frame substrates such that a reflector is disposed adjacent to each of said optoelectronic devices.
Claim 40
Dependent Claim
33 words
The method of claim 35, wherein said reflector unit forming step includes: forming at least one male connector on each reflector unit; and forming at least one female connector on each reflector unit.
Claim 41
Dependent Claim
35 words
The method of claim 33, wherein said electrically connecting step includes: affixing a lead wire between the output electrical terminal of at least one of said modules and the input electrical terminal on another module.