US5289033A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Packaging of semiconductor chips with resin
Assignee: Sony Corp
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Filing: 1991-04-24
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Granted: 1994-02-22
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Expires: 2011-04-24
Abstract
Abstract A semiconductor device is fabricated by placing a semiconductor chip in a lead frame which has no die pad. Electrodes of the chip are connected by bonding wires to respective lead fingers. Additionally, the lead frame has movement restricting fingers which limit horizontal movement of the chip within the lead frame during injection of resin into a mold surrounding the chip. Furthermore, the mold has horizontal movement restricting projections to limit vertical movement of the chip within the mold cavity. The restriction on horizontal and vertical movement of the chip reduces the risk of the bonding wires being broken or short circuited during the resin injection process.
Inventors
- 👤 Yukio Asami
- 👤 Hiroyuki Fukasawa
- 👤 Akira Kojima
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 16:18
CPC Classifications
B; B29; B29C; B29C45/00; B29C45/14; B29C45/14639; B29C45/14655; H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W70/00; H10W70/40; H10W70/411; H10W72/00; H10W72/01; H10W72/0198; H10W74/00; H10W74/01; H10W74/016; H10W74/10; H10W74/111; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
150 words
A semiconductor device, comprising: a resin package; a semiconductor chip sealed within said package, said chip having upper and lower surfaces lying in upper and lower planes, respectively, and said chip having a plurality of electrodes; a peripheral portion surrounding a region for receiving said chip; a plurality of lead fingers each having an outer end disposed outside said package and each having an inner end disposed within said package and lying between said upper and lower planes and projecting from said peripheral portion towards said region; and a plurality of bonding wires each connecting a respective one of said plurality of electrodes to a respective one of said inner ends of said lead fingers; wherein said chip is disposed in said region without rigid connection to any of said lead fingers before sealing in said resin package such that said resin package directly contacts substantially all of said chip.
Claim 2
Dependent Claim
150 words
A semiconductor device, comprising: a resin package; a semiconductor chip sealed within said package, said chip having upper and lower surfaces lying in upper and lower planes, respectively, and said chip having a plurality of electrodes; a peripheral portion surrounding a region for receiving said chip; a plurality of lead fingers each having an outer end disposed outside said package and each having an inner end disposed within said package and lying between said upper and lower planes and projecting from said peripheral portion towards said region; and a plurality of bonding wires each connecting a respective one of said plurality of electrodes to a respective one of said inner ends of said lead fingers; wherein said chip is disposed in said region without rigid connection to any of said lead fingers before sealing in said resin package such that said resin package directly contacts substantially all of said chip.
Claim 3
Dependent Claim
130 words
A combination comprising a semiconductor chip having a plurality of electrodes, a lead frame and a plurality of bonding wires each connected at first ends thereof to selective ones of said electrodes for use in manufacturing a semiconductor device from said chip, said lead frame comprising; a peripheral portion surrounding a region for receiving said chip; and a plurality of finger portions projecting from said peripheral portion towards said region and terminating outside said region, said plurality of bonding wires connected at second ends thereof to selective ones of said finger portions, said chip disposed in said region without contacting said finger potions such that the lead frame provides a through aperture in said region for receiving said chip, said chip supported in said through aperture by said bonding wires.
Claim 4
Dependent Claim
130 words
A combination comprising a semiconductor chip having a plurality of electrodes, a lead frame and a plurality of bonding wires each connected at first ends thereof to selective ones of said electrodes for use in manufacturing a semiconductor device from said chip, said lead frame comprising; a peripheral portion surrounding a region for receiving said chip; and a plurality of finger portions projecting from said peripheral portion towards said region and terminating outside said region, said plurality of bonding wires connected at second ends thereof to selective ones of said finger portions, said chip disposed in said region without contacting said finger potions such that the lead frame provides a through aperture in said region for receiving said chip, said chip supported in said through aperture by said bonding wires.
Claim 5
Dependent Claim
30 words
A combination as claimed in claim 2, wherein said lead frame comprises a plurality of movement restricting finger portions for restricting movement of said chip during manufacture of said device.
Claim 6
Dependent Claim
82 words
A combination as claimed in claim 2, further comprising: a resin package; said semiconductor chip sealed within said package, said chip having upper and lower surfaces lying in upper and lower planes, respectively; said plurality of finger portions each having an outer end disposed outside said package and each having an inner end disposed within said package and lying between said upper and lower planes; wherein said resin package directly contacts both said upper surface and said lower surface of said chip.
Claim 7
Dependent Claim
18 words
A combination as claimed in claim 4 wherein said resin package directly contacts substantially all of said chip.
References Cited (Backward Citations)
US3802069A
Cited
US4012766A
Cited
US4069924A
Cited
US4255851A
Cited
US4330790A
Cited
US4331740A
Cited
JPS6037754A
Cited
EP0213764A2
Cited
US4756080A
Cited
US4788583A
Cited
US4884124A
Cited
EP0273725A2
Cited
US4806409A
Cited
US4812421A
Cited
JPH01262115A
Cited
EP0350833A2
Cited
US5018003A
Cited
EP0366386A2
Cited
US4924291A
Cited
JPH02134852A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-02-21 | 1997-08-23 | 1998-02-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-02-21 | 2001-08-23 | 2002-02-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-02-21 | 2005-08-23 | 2006-02-22 | $7700.00 | Window Closed / Lapsed |