← Back to Patent Explorer
EP0213764A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Preparation of fragile sheet-like devices, such as lead frames

Assignee: The General Electric Company PLC
•
Filing: 1986-08-01
•
Granted: —
•
Expires: 2006-08-01
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract It is possible to prepare fragile devices by the removal of part of a suitable body of material (by an etching or similar removal process), and this technique is particularly applicable to the formation of lead-frames useful in connection with the packaging of micro-electronic devices such as integrated circuits (chips); starting with a foil or sheet blank of relatively thick, robust material, this material is removed, usually by etching, where it is not required at all (the empty spaces between the leads). Unfortunately, it is very difficult to start with a thich and robust foil and end with a lead-frame the inner parts of which are sufficiently narrow and delicate for use with a device having a lead count as high as 50 connections per side, when the width of the individual leads at their "fine" end must be as little as 0.05mm (50 microns). The invention suggests a technique whereby most of the thickness of the material over the whole of the lead-frame foil blank's inner area (where the inner connections to the chip will eventually be) is removed from one face to make a generally robust foil with a centrally-located recess defining a much thinner inner section, the recess is filled with some "fixing" material that will both provide support for and hold in position the thin inner section, and further material is then removed from the other face of the blank so as to form the fine inner parts (25) of the lead-frame, these being firmly supported, and held in place, by the "fixing" material (23) filling what was the recess in the foil.

Inventors

  • 👤 Nicholas Chandler

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-10-23 22:10
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/01; H10W70/04; H10W70/042; H10W70/435; H10W90/00; H10W90/701; H10W90/751; H10W90/756

Claims Analysis

Total Claims: 13
Claim 1
Independent Claim 172 words
A method of fabricating a generally planar, sheet-­like, device having a first, robust, area and, contiguous therewith, a second, fragile, area to be constructed by removal of some of the material of which the device consists, in which method: a) starting with a corresponding generally planar, sheet-like blank, in which both first and second areas are robust, some of the material to be removed from the blank to make the second, fragile, area is so removed from one major face of the blank, to form a recess in the blank; b) the thus-formed recess is filled with a fixing material, so as to support and fix in place the thin area of blank material constituting the base of the recess; and thereafter c) the remainder of the material to be removed from the blank to make the second, fragile, area is so removed from the other major face of the blank, so forming the required second, fragile, area supported and fixed by the fixing material and contiguous with the first, robust, area.
Claim 2
Independent Claim 172 words
A method of fabricating a generally planar, sheet-­like, device having a first, robust, area and, contiguous therewith, a second, fragile, area to be constructed by removal of some of the material of which the device consists, in which method: a) starting with a corresponding generally planar, sheet-like blank, in which both first and second areas are robust, some of the material to be removed from the blank to make the second, fragile, area is so removed from one major face of the blank, to form a recess in the blank; b) the thus-formed recess is filled with a fixing material, so as to support and fix in place the thin area of blank material constituting the base of the recess; and thereafter c) the remainder of the material to be removed from the blank to make the second, fragile, area is so removed from the other major face of the blank, so forming the required second, fragile, area supported and fixed by the fixing material and contiguous with the first, robust, area.
Claim 3
Independent Claim 14 words
A method as claimed in Claim l, applied in the fabrication of a lead-frame.
Claim 4
Independent Claim 36 words
A method as claimed in either of the preceding Claims, in which, where the device is a lead-frame, the material of which the blank is constituted is a nickel-­iron alloy, or copper or a copper-based alloy.
Claim 5
Independent Claim 52 words
A method as claimed in any of the preceding Claims, in which, where the device is a lead-frame, the "robust" area ends up as the "legs" of the final package, tough enough to withstand handling, while the "fragile" area ends up as extremely fine conductors a hundred or so microns in width.
Claim 6
Independent Claim 116 words
A method as claimed in any of the preceding Claims, in which, where the device is a lead-frame, material is removed both simply to "thin" the sheet over the whole of the defined, second area, so that it becomes more suitable for forming into the inner leads of the lead-frame, and from between those portions that are to be the leads, so separating each lead from its neighbours; in the first stage the blank is thinned, from one of its major faces, to roughly half its original thickness, while in the second stage the remaining between-lead blank material is removed from the other major face, so leaving the formed leads flush with this other major face.
Claim 7
Independent Claim 26 words
A method as claimed in any of the preceding Claims, in which the removal of material from the blank is accomplished by a chemical etching technique.
Claim 8
Independent Claim 67 words
A method as claimed in any of the preceding Claims, in which, in the first stage, material is removed both from all over the whole of the second area of the blank (that area destined to become the fragile area of the device), so thinning that area, and at the same time from the first area (the area destined to become the robust area of the device).
Claim 9
Dependent Claim 43 words
A method as claimed in Claim 7, in which, where the device is a lead-frame, the robust area material between those portions destined to be the outer part of the leads is removed at the same time as the second area is thinned.
Claim 10
Independent Claim 30 words
A method as claimed in any of the preceding Claims, in which, where the device is a lead-frame, the fixing material is a silica-filled epoxy or a glass or glass-ceramic.
Claim 11
Dependent Claim 44 words
l0. A method as claimed in any of the preceding Claims, wherein, where the device is a lead-frame, a central area of the recess, big enough to take the chip to which the lead-frame will be connected, is left completely free of fixing material.
Claim 12
Independent Claim 52 words
A method as claimed in any of the preceding Claims, in which, where the device is a lead-frame, the material removed from the other major face is both that material lying between the portions defining the inner leads and the remainder of the thickness of first area material in the between-leg portions.
Claim 13
Dependent Claim 15 words
A lead-frame wherever fabricated by a method as claimed in any of the preceding claims.

References Cited (Backward Citations)

No citation records indexed.

USPTO Annuity & Maintenance Windows

Maintenance schedule is calculated for granted US utility patents.

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag