EP0366386A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Flagless semiconductor package
Assignee: Motorola Solutions Inc
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Filing: 1989-10-23
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Granted: —
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Expires: 2009-10-23
Abstract
Abstract A molded semiconductor package having a flagless leadframe (22) wherein a semiconductor die (10) is disposed in or above a die opening (20) of a leadframe (22). This allows for thin, symmetrical packages and packages having a minimum number of material interfaces to be manufactured because no leadframe flags and minimal die bond material are employed. The present invention further includes guard rings (34) to protect high stress areas of the semiconductor die (10) from damage and heat spreaders (46) to more effectively spread heat dissipated by the semiconductor die (10).
Inventors
- 👤 Israel Arnold Lesk
- 👤 George Wayne Hawkins
- 👤 Ronald E. Thomas
- 👤 William Leslie Hunter
- 👤 Michael B. Mcshane
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-28 10:05
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/811; H10W70/00; H10W70/40; H10W70/461; H10W40/00; H10W40/10; H10W40/70; H10W40/77; H10W40/778; H10W70/411; H10W70/417; H10W70/421; H10W74/00; H10W74/10; H10W74/111; H10W76/00; H10W76/40; H10W90/701; H10W90/731; H10W90/736
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
98 words
A molded semiconductor package having a flagless leadframe (22) comprising: a semiconductor die (10) having a first surface (12), a second surface (14), sides (16) and corners (14); the invention beng charcterized by: a flagless leadframe (22) including leads (28) and a die opening (20), said leadframe (22) being physically bonded to said semiconductor die (10) and further, said leads (28) of said leadframe being electrically connected to said semiconductor die (10) in a selective manner; and an encapsulation (30) disposed about said semiconductor die (10) and said leadframe (22) except for said leads (28) which protrude therefrom.
Claim 2
Dependent Claim
98 words
A molded semiconductor package having a flagless leadframe (22) comprising: a semiconductor die (10) having a first surface (12), a second surface (14), sides (16) and corners (14); the invention beng charcterized by: a flagless leadframe (22) including leads (28) and a die opening (20), said leadframe (22) being physically bonded to said semiconductor die (10) and further, said leads (28) of said leadframe being electrically connected to said semiconductor die (10) in a selective manner; and an encapsulation (30) disposed about said semiconductor die (10) and said leadframe (22) except for said leads (28) which protrude therefrom.
Claim 3
Dependent Claim
38 words
The molded semiconductor package of claim 1 wherein the die opening (20) is larger than the semiconductor die (10) disposed therein, the leadframe (22) is essentially coplanar with said semiconductor die (10) and said package is substantially symmetrical.
Claim 4
Dependent Claim
34 words
The molded semiconductor package of claim 2 wherein the leadframe (22) is bonded to one or both of the sides (16) and corners (18) of the semiconductor die (10) by an organic adhesive (26).
Claim 5
Dependent Claim
37 words
The molded semiconductor package of claim 2 further comprising a guard ring (34) being disposed about the semiconductor die (10), said guard ring (34) being a part of the leadframe (22) or separate from said leadframe (22).
Claim 6
Dependent Claim
49 words
The molded semiconductor package of claim 4 wherein the guard ring (34) is disposed between the leadframe (22) and the semiconductor die (10) and is bonded to at least one or both of the sides (16) and corners (18) of said semiconductor (10) die by an organic adhesive (26).
Claim 7
Dependent Claim
40 words
The molded semiconductor package of claim 1 wherein the die opening (20) is smaller than the semiconductor die (10) and the second surface (14) of said semiconductor die (10) is bonded to the leadframe (22) above said die opening (20).
Claim 8
Dependent Claim
32 words
The molded semiconductor package of claim 1 further comprising a thermally conductive heat spreader (46) coupled to the second surface (14) of the semiconductor die (10) by an insulating adhesive material (48).
Claim 9
Dependent Claim
30 words
The molded semiconductor package of claim 7 wherein the thermally conductive heat spreader (46) is coupled to the leads (28) of the leadframe (22) by an insulating adhesive material (48).
Claim 10
Dependent Claim
22 words
The molded semiconductor package of claim 7 wherein the thermally conductive heat spreader (46) is not completely encapsulated by the encapsulation (30).
References Cited (Backward Citations)
No citation records indexed.
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