US7317256B2 — Electronic packaging including die with through s…

Claim 1

Independent Claim 128 words

An electronic package, comprising: a mount having a lead; a first die having an active surface and a back surface, the active surface facing the mount, the first die further having a first through-silicon via landed on the lead; a silicon spacer landed on the first through-silicon via; a second die having an active surface and a back surface, the active surface of the second die facing the silicon spacer, the second die further having a second through-silicon via and landed on the silicon spacer; and a redirect path located in the silicon spacer, the redirect path adapted to route a signal between the first through-silicon via and the second through-silicon via, where the first through-silicon via and the second through-silicon via are not directly adjacent one another.

Claim 2

Dependent Claim 128 words

An electronic package, comprising: a mount having a lead; a first die having an active surface and a back surface, the active surface facing the mount, the first die further having a first through-silicon via landed on the lead; a silicon spacer landed on the first through-silicon via; a second die having an active surface and a back surface, the active surface of the second die facing the silicon spacer, the second die further having a second through-silicon via and landed on the silicon spacer; and a redirect path located in the silicon spacer, the redirect path adapted to route a signal between the first through-silicon via and the second through-silicon via, where the first through-silicon via and the second through-silicon via are not directly adjacent one another.

Claim 3

Dependent Claim 23 words

The electronic package of claim 1 , wherein at least one of the first die and the second die is Flip Chip memory.

Claim 4

Dependent Claim 41 words

The electronic package of claim 1 , wherein the mount is selected from the group consisting of a leadless quad flat-pack, a leadless small outline integrated circuit, a leadless TSOP, a leaded SOIC, a leaded quad flat-pack, and a leaded TSOP.

Claim 5

Dependent Claim 46 words

The electronic package of claim 1 , further comprising a solder joint coupled to the first through-silicon via and physically coupled to the lead of the mount, and wherein the solder joint is selected from the group consisting of controlled collapse chip connection and eutectic solder.

Claim 6

Dependent Claim 43 words

The electronic package of claim 1 , further comprising a solder joint coupled to the first through-silicon via and coupled to the silicon spacer, and wherein the solder joint is selected from the group consisting of controlled collapse chip connection and eutectic solder.

Claim 7

Dependent Claim 47 words

The electronic package of claim 1 , wherein the redirect path includes one or more functional units adapted to modify the signal, wherein at least one of the one or more functional units is selected from the group consisting of a logic device; and an analog device.

Claim 8

Dependent Claim 22 words

The electronic package of claim 1 , wherein the lead is physically coupled to the first through-silicon via by a solder joint.

Claim 9

Dependent Claim 49 words

The electronic package of claim 1 , further comprising: a dielectric layer formed on a surface of the first through-silicon via; an adhesion layer formed on the dielectric layer; an interconnect contact material formed on the adhesion layer; and a cavity fill material formed on the interconnect contact material.

Claim 10

Dependent Claim 36 words

The electronic package of claim 1 , wherein the redirect path includes one or more functional units adapted to modify the signal, the one or more functional units having a logic device and an analog device.

Claim 11

Dependent Claim 43 words

The electronic package of claim 1 , further comprising a solder joint coupled to the silicon spacer and coupled to the second through-silicon via, and wherein the solder joint is selected from the group consisting of controlled collapse chip connection and eutectic solder.

Claim 12

Independent Claim 146 words

A system comprising: an electronic package, comprising: a mount having a lead; a first die having an active surface and a back surface, the active surface facing the mount, the first die further having a first through-silicon via landed on the lead: a silicon spacer landed on the first through-silicon via; a second die having an active surface and a back surface, the active surface of the second die facing the silicon spacer, the second die further having a second through-silicon via and landed on the silicon spacer; and a redirect path located in the silicon spacer, the redirect path adapted to route a signal between the first through-silicon via and the second through-silicon via, where the first through-silicon via and the second through-silicon via are not directly adjacent one another; a bus coupled to the electronic package; and a mass storage coupled to the bus.

Claim 13

Independent Claim 146 words

A system comprising: an electronic package, comprising: a mount having a lead; a first die having an active surface and a back surface, the active surface facing the mount, the first die further having a first through-silicon via landed on the lead: a silicon spacer landed on the first through-silicon via; a second die having an active surface and a back surface, the active surface of the second die facing the silicon spacer, the second die further having a second through-silicon via and landed on the silicon spacer; and a redirect path located in the silicon spacer, the redirect path adapted to route a signal between the first through-silicon via and the second through-silicon via, where the first through-silicon via and the second through-silicon via are not directly adjacent one another; a bus coupled to the electronic package; and a mass storage coupled to the bus.

Claim 14

Dependent Claim 41 words

The system of claim 11 , wherein the system is selected from the group consisting of a set-top box, a digital camera, a CD player, a DVD player, a wireless mobile phone, a tablet computing device, and a laptop computing device.

Claim 15

Dependent Claim 41 words

The system of claim 11 , further comprising a solder joint coupled to the first through-silicon via and coupled to the silicon, and wherein the solder joint is selected from the group consisting of controlled collapse chip connection and eutectic solder.

Claim 16

Dependent Claim 46 words

The system of claim 11 , wherein the redirect path includes one or more functional units adapted to modify the signal, wherein at least one of the one or more functional units is selected from the group consisting of a logic device and an analog device.

Claim 17

Dependent Claim 35 words

The system of claim 11 , wherein the redirect path includes one or more functional units adapted to modify the signal, the one or more functional units having a logic device and an analog device.

Claim 18

Dependent Claim 42 words

The system of claim 11 , further comprising a solder joint coupled to the silicon spacer and coupled to the second through-silicon via, and wherein the solder joint is selected from the group consisting of controlled collapse chip connection and eutectic solder.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	2011-01-07	2011-07-09	2012-01-08	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2015-01-07	2015-07-09	2016-01-08	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2019-01-07	2019-07-09	2020-01-08	$7700.00	Window Closed / Lapsed

Electronic packaging including die with through silicon via

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