Patent US5654755A successfully refreshed from Google Patents.
Patent US5329385A successfully refreshed from Google Patents.
Patent US6424742B2 successfully refreshed from Google Patents.
Patent US7268418B2 successfully refreshed from Google Patents.
US7268418B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multi-chips stacked package
Assignee: Advanced Semiconductor Engineering Inc
•
Filing: 2003-12-30
•
Granted: 2007-09-11
•
Expires: 2023-12-30
Abstract
Abstract A multi-chips stacked package at least comprises a substrate, a lower chip, an upper chip, an adhesive layer, a supporting body and an encapsulation. The lower chip is disposed on the substrate and the upper chip is attached to the lower chip via the adhesive layer. In addition, the lower chip and the upper chip are electrically connected to the substrate via first electrically conductive wires and second electrically conductive wires respectively. Furthermore, the supporting body is disposed on the lower chip and at the periphery of the upper surface of the lower chip, and covered by the upper chip. The top of the supporting body is apart from the back surface of the upper chip with a distance. Accordingly, when the second electrically conductive wires are bonded the upper chip to the substrate with a larger bonding force to cause the upper chip to be tilted more, the supporting body will support the upper chip and prevent the upper chip from contacting the first electrically conductive wires.
Inventors
- 👤 Sung-Fei Wang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:12
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/30; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W90/00; H10W72/071; H10W72/073; H10W72/07321; H10W72/07327; H10W72/07331; H10W72/07337; H10W72/07351; H10W72/07352; H10W72/075; H10W72/321; H10W72/351; H10W72/353; H10W72/354; H10W72/381; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/951; H10W90/701; H10W90/731; H10W90/732; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
189 words
A multi-chips stacked package, comprising: a substrate having an upper surface; a lower chip having a first active surface and a first back surface, wherein the lower chip is disposed above the upper surface of the substrate and electrically connected to the substrate via a plurality of first electrically conductive wires; an interposer disposed on the first active surface of the lower chip; an upper chip having a second active surface and a second back surface, wherein the upper chip is disposed above the interposer and electrically connected to the substrate via a plurality of second electrically conductive wires; and a supporting body disposed on the upper surface of the substrate and covered by the upper chip, wherein the top of the supporting body is higher than the top of the arc of each of the first electrically conductive wires and lower than the second back surface of the upper chip, and the second back surface of the upper chip is attached to the interposer, and wherein an encapsulation is disposed between one of the top of the supporting body and the second back surface of the upper chip.
Claim 2
Dependent Claim
189 words
A multi-chips stacked package, comprising: a substrate having an upper surface; a lower chip having a first active surface and a first back surface, wherein the lower chip is disposed above the upper surface of the substrate and electrically connected to the substrate via a plurality of first electrically conductive wires; an interposer disposed on the first active surface of the lower chip; an upper chip having a second active surface and a second back surface, wherein the upper chip is disposed above the interposer and electrically connected to the substrate via a plurality of second electrically conductive wires; and a supporting body disposed on the upper surface of the substrate and covered by the upper chip, wherein the top of the supporting body is higher than the top of the arc of each of the first electrically conductive wires and lower than the second back surface of the upper chip, and the second back surface of the upper chip is attached to the interposer, and wherein an encapsulation is disposed between one of the top of the supporting body and the second back surface of the upper chip.
Claim 3
Dependent Claim
34 words
The multi-chips stacked package of claim 1 , wherein the substrate has a first wire-bonding pad formed on the upper surface and the first wire-bonding pad is connected to the first electrically conductive wire.
Claim 4
Dependent Claim
37 words
The multi-chips stacked package of claim 2 , wherein the supporting body is located between the first wire-bonding pad and a second wire-bonding pad formed on the upper surface and connected to the second electrically conductive wire.
Claim 5
Dependent Claim
16 words
The multi-chips stacked package of claim 1 , wherein the supporting body surrounds the lower chip.
Claim 6
Dependent Claim
16 words
The multi-chips stacked package of claim 1 , wherein the supporting body is made of epoxy.
Claim 7
Dependent Claim
16 words
The multi-chips stacked package of claim 1 , wherein the supporting body is a metal bump.
Claim 8
Dependent Claim
20 words
The multi-chips stacked package of claim 1 , wherein the upper chip is larger than the lower chip in size.
Claim 9
Dependent Claim
22 words
The multi-chips stacked package of claim 1 , further comprising a first adhesive layer interposed between the lower chip and the interposer.
Claim 10
Dependent Claim
166 words
A multi-chips stacked package, comprising: a substrate having an upper surface; a lower chip having a first active surface and a first back surface, wherein the lower chip is disposed on the upper surface of the substrate and electrically connected to the substrate via a plurality of first electrically conductive wires; an interposer disposed above the first active surface of the lower chip; an upper chip having a second active surface and a second back surface, wherein the upper chip is disposed above the interposer and electrically connected to the substrate via a plurality of second electrically conductive wires; and a supporting body disposed on the lower chip and covered by the upper chip, wherein the top of the supporting body is lower than the second back surface of the upper chip, and the second back surface is attached to the interposer, and wherein an encapsulation is disposed between one of the top of the supporting body and the second back surface of the upper chip.
Claim 11
Dependent Claim
166 words
A multi-chips stacked package, comprising: a substrate having an upper surface; a lower chip having a first active surface and a first back surface, wherein the lower chip is disposed on the upper surface of the substrate and electrically connected to the substrate via a plurality of first electrically conductive wires; an interposer disposed above the first active surface of the lower chip; an upper chip having a second active surface and a second back surface, wherein the upper chip is disposed above the interposer and electrically connected to the substrate via a plurality of second electrically conductive wires; and a supporting body disposed on the lower chip and covered by the upper chip, wherein the top of the supporting body is lower than the second back surface of the upper chip, and the second back surface is attached to the interposer, and wherein an encapsulation is disposed between one of the top of the supporting body and the second back surface of the upper chip.
Claim 12
Dependent Claim
20 words
The multi-chips stacked package of claim 9 , wherein the upper chip is larger than the lower chip in size.
Claim 13
Dependent Claim
21 words
The multi-chips stacked package of claim 9 , wherein the supporting body is located at the periphery of the lower chip.
Claim 14
Dependent Claim
15 words
The multi-chips stacked package of claim 9 , wherein the supporting body surrounds the interposer.
Claim 15
Dependent Claim
16 words
The multi-chips stacked package of claim 9 , wherein the supporting body is made of epoxy.
Claim 16
Dependent Claim
16 words
The multi-chips stacked package of claim 9 , wherein the supporting body is a metal bump.
Claim 17
Dependent Claim
15 words
The multi-chips stacked package of claim 9 , wherein the interposer is a dummy chip.
Claim 18
Dependent Claim
22 words
The multi-chips stacked package of claim 9 , wherein a first adhesive layer is disposed between the lower chip and the interposer.
Claim 19
Dependent Claim
22 words
The multi-chips stacked package of claim 9 , wherein a second adhesive layer is disposed between the upper chip and the interposer.
Claim 20
Dependent Claim
15 words
The multi-chips stacked package of claim 9 , wherein the interposer is an adhesive layer.
Claim 21
Dependent Claim
46 words
The multi-chips stacked package of claim 9 , wherein the lower chip has a bonding pad formed on the first active surface of the lower chip , and connected to the first wire, and the supporting body is located between the interposer and the bonding pad.
Claim 22
Dependent Claim
185 words
A multi-chips stacked package, comprising: a substrate having an upper surface; a lower chip having a first active surface and a first back surface, wherein the lower chip is disposed on the upper surface of the substrate and electrically connected to the substrate via a plurality of first electrically conductive wires; an interposer disposed on the first active surface of the lower chip; an upper chip having a second active surface and a second back surface, wherein the upper chip is disposed above the interposer and electrically connected to the substrate via a plurality of second electrically conductive wires; and a supporting body disposed on the upper surface of the substrate and covered by the upper chip, wherein the top of the supporting body is higher than the top of the are of each of the first electrically conductive wires and lower than the second back surface of the upper chips and the second back surface is attached to the interposer, and wherein an encapsulation is disposed between one of the top of the supporting body and the second back surface of the upper chip.
Claim 23
Dependent Claim
185 words
A multi-chips stacked package, comprising: a substrate having an upper surface; a lower chip having a first active surface and a first back surface, wherein the lower chip is disposed on the upper surface of the substrate and electrically connected to the substrate via a plurality of first electrically conductive wires; an interposer disposed on the first active surface of the lower chip; an upper chip having a second active surface and a second back surface, wherein the upper chip is disposed above the interposer and electrically connected to the substrate via a plurality of second electrically conductive wires; and a supporting body disposed on the upper surface of the substrate and covered by the upper chip, wherein the top of the supporting body is higher than the top of the are of each of the first electrically conductive wires and lower than the second back surface of the upper chips and the second back surface is attached to the interposer, and wherein an encapsulation is disposed between one of the top of the supporting body and the second back surface of the upper chip.
Claim 24
Dependent Claim
182 words
A multi-chips stacked package, comprising: a substrate having an upper surface; a lower chip having a first active surface, a first back surface, and a bonding pad, wherein the lower chip is disposed on the upper surface of the substrate and electrically connected to the substrate via a plurality of first electrically conductive wires, and the bonding pad is formed on the first active surface of the lower chip and connected to the first electrically conductive wire; an interposer disposed above the first active surface of the lower chip; an upper chip having a second active surface and a second back surface, wherein the upper chip is disposed above the interposer and electrically connected to the substrate via a plurality of second electrically conductive wires; and a supporting body disposed on the lower chip and covered by the upper chip, wherein the supporting body is located between the interposer and the bonding pad, and wherein the top of the supporting body is lower than the second back surface of the upper chip, and the second back surface is attached to the interposer.
Claim 25
Dependent Claim
182 words
A multi-chips stacked package, comprising: a substrate having an upper surface; a lower chip having a first active surface, a first back surface, and a bonding pad, wherein the lower chip is disposed on the upper surface of the substrate and electrically connected to the substrate via a plurality of first electrically conductive wires, and the bonding pad is formed on the first active surface of the lower chip and connected to the first electrically conductive wire; an interposer disposed above the first active surface of the lower chip; an upper chip having a second active surface and a second back surface, wherein the upper chip is disposed above the interposer and electrically connected to the substrate via a plurality of second electrically conductive wires; and a supporting body disposed on the lower chip and covered by the upper chip, wherein the supporting body is located between the interposer and the bonding pad, and wherein the top of the supporting body is lower than the second back surface of the upper chip, and the second back surface is attached to the interposer.
Claim 26
Dependent Claim
20 words
The multi-chips stacked package of claim 21 , wherein the upper chip is larger than the lower chip in size.
Claim 27
Dependent Claim
21 words
The multi-chips stacked package of claim 21 , wherein the supporting body is located at the periphery of the lower chip.
Claim 28
Dependent Claim
15 words
The multi-chips stacked package of claim 21 , wherein the supporting body surrounds the interposer.
Claim 29
Dependent Claim
16 words
The multi-chips stacked package of claim 21 , wherein the supporting body is made of epoxy.
Claim 30
Dependent Claim
16 words
The multi-chips stacked package of claim 21 , wherein the supporting body is a metal bump.
References Cited (Backward Citations)
US5323060A
Cited
US6407456B1
Cited
US6549421B2
Cited
US6642080B1
Cited
US6762078B2
Cited
US6803254B2
Cited
US6759737B2
Cited
US6607937B1
Cited
US6503776B2
Cited
US20030038374A1
Cited
US6569709B2
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2010-09-10 | 2011-03-12 | 2011-09-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2014-09-10 | 2015-03-12 | 2015-09-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2018-09-10 | 2019-03-12 | 2019-09-11 | $7700.00 | Window Closed / Lapsed |