Patent US6861761B2 successfully refreshed from Google Patents.
US6861761B2
Expired / Lapsed
US
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Multi-chip stack flip-chip package
Assignee: Advanced Semiconductor Engineering Inc
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Filing: 2003-10-31
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Granted: 2005-03-01
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Expires: 2023-10-31
Abstract
Abstract A multi-chip stack flip-chip package comprises a substrate and a chip assembly on the substrate. The chip assembly includes a dummy chip and a flip chip. The dummy chip has a redistribution layer that has a plurality of bump pads for mounting the flip chip, a plurality of peripheral pads for electrically connecting to the substrate, and a plurality of integrated circuit traces connecting the bump pads with the peripheral pads. The dummy chip is disposed between the flip chip and the substrate as an electrically connecting interface between the flip chip and the substrate for multi-chip flip-chip stack and fine pitch flip-chip mounting.
Inventors
- 👤 Chaur-chin Yang
- 👤 Sung-Fei Wang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:06
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W90/00; H10W72/00; H10W72/01; H10W72/851; H10W72/874; H10W72/877; H10W74/15; H10W90/20; H10W90/291; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
77 words
A multi-chip stack flip-chip package comprising: a substrate having a top surface and a bottom surface; at least a first flip chip disposed on the top surface of the substrate; a dummy chip having a redistribution layer (RDL) and attached to the first flip chip; at least a second flip chip mounted on the dummy chip and electrically connected to the redistribution layer; and a plurality of electrically connecting devices connecting the dummy chip with the substrate.
Claim 2
Dependent Claim
77 words
A multi-chip stack flip-chip package comprising: a substrate having a top surface and a bottom surface; at least a first flip chip disposed on the top surface of the substrate; a dummy chip having a redistribution layer (RDL) and attached to the first flip chip; at least a second flip chip mounted on the dummy chip and electrically connected to the redistribution layer; and a plurality of electrically connecting devices connecting the dummy chip with the substrate.
Claim 3
Dependent Claim
19 words
The multi-chip stack flip-chip package as claimed in claim 1 , wherein the substrate is a printed circuit board.
Claim 4
Dependent Claim
24 words
The multi-chip stack flip-chip package as claimed in claim 1 , wherein the dummy chip is larger than the second flip chip in size.
Claim 5
Dependent Claim
39 words
The multi-chip stack flip-chip package as claimed in claim 1 , wherein the redistribution layer of the dummy chip has a plurality of bump pads, peripheral pads and integrated circuit traces connecting the bump pads with the peripheral pads.
Claim 6
Dependent Claim
25 words
The multi-chip stack flip-chip package as claimed in claim 4 , wherein the bump pads have a pitch smaller than that of the peripheral pads.
Claim 7
Dependent Claim
22 words
The multi-chip stack flip-chip package as claimed in claim 5 , wherein the pitch of the bump pads is below 150 μm.
Claim 8
Dependent Claim
19 words
The multi-chip stack flip-chip package as claimed in claim 1 , wherein the electrically connecting devices are bonding wires.
Claim 9
Dependent Claim
29 words
The multi-chip stack flip-chip package as claimed in claim 1 , further comprising another dummy chip on the top surface of the substrate for mounting the first flip chip.
Claim 10
Dependent Claim
25 words
The multi-chip stack flip-chip package as claimed in claim 1 , wherein the first flip chip is mounted on the top surface of the substrate.
Claim 11
Dependent Claim
26 words
The multi-chip stack flip-chip package as claimed in claim 1 , further comprising a plurality of solder balls bonded on the bottom surface of the substrate.
Claim 12
Dependent Claim
24 words
The multi-chip stack flip-chip package as claimed in claim 1 , further comprising an insulation compound formed on the top surface of the substrate.
Claim 13
Dependent Claim
72 words
A multi-chip stack flip-chip package comprising: a substrate having a top surface and a bottom surface; a chip assembly disposed on the top surface of the substrate; and a plurality of electrically connecting devices connecting the chip assembly with the substrate; wherein the chip assembly comprises: a dummy chip having a redistribution layer (RDL); and at least a flip chip mounted on the dummy chip and electrically connected to the redistribution layer.
Claim 14
Dependent Claim
72 words
A multi-chip stack flip-chip package comprising: a substrate having a top surface and a bottom surface; a chip assembly disposed on the top surface of the substrate; and a plurality of electrically connecting devices connecting the chip assembly with the substrate; wherein the chip assembly comprises: a dummy chip having a redistribution layer (RDL); and at least a flip chip mounted on the dummy chip and electrically connected to the redistribution layer.
Claim 15
Dependent Claim
19 words
The multi-chip stack flip-chip package as claimed in claim 12 , wherein the substrate is a printed circuit board.
Claim 16
Dependent Claim
39 words
The multi-chip stack flip-chip package as claimed in claim 12 , wherein the redistribution layer of the dummy chip has a plurality of bump pads, peripheral pads and integrated circuit traces connecting the bump pads with the peripheral pads.
Claim 17
Dependent Claim
21 words
The multi-chip stack flip-chip package as claimed in claim 14 , wherein the bump pads have a pitch below 150 μm.
Claim 18
Dependent Claim
23 words
The multi-chip stack flip-chip package as claimed in claim 12 , wherein the dummy chip is larger than the flip chip in size.
Claim 19
Dependent Claim
24 words
The multi-chip stack flip-chip package as claimed in claim 12 , further comprising an insulation compound formed on the top surface of the substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2008-02-29 | 2008-08-30 | 2009-03-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2012-02-29 | 2012-08-30 | 2013-03-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2016-02-29 | 2016-08-30 | 2017-03-01 | $7700.00 | Window Closed / Lapsed |