US6462420B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor chip and semiconductor device having a chip-on-chip structure
Assignee: ACHLYS TECHNOLOGIES INC.
•
Filing: 2000-02-11
•
Granted: 2002-10-08
•
Expires: 2020-02-11
Abstract
Abstract A semiconductor chip is bonded to the surface of another semiconductor chip with a predetermined gap secured in between. The semiconductor chip has a plurality of bumps formed on the surface thereof facing the other semiconductor chip. The bumps include functional bumps that contribute to electrical connection between the chips and dummy bumps that do not contribute thereto.
Inventors
- 👤 Junichi Hikita
- 👤 Hiroo Mochida
- 👤 Goro Nakatani
- 👤 Kazutaka Shibata
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:26
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/20; H10W90/00; H10W90/811; H10W72/251; H10W72/90; H10W72/921; H10W72/923; H10W72/941; H10W72/9415; H10W72/944; H10W72/9445; H10W74/00; H10W90/701; H10W90/721; H10W90/722; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
106 words
A semiconductor chip designed to be bonded to a surface of a solid body with a predetermined gap secured in between, the semiconductor chip having a plurality of bumps formed on a surface thereof that faces the surface of the solid body, the bumps serving to support the semiconductor chip, wherein the bumps include functional bumps that are configured to contribute to electrical connection between the semiconductor chip and the solid body and, dummy bumps that, although having a substantially identical structure as the functional bumps, do not contribute to the electrical connection, and wherein the semiconductor chip is bonded to the solid body by pressure.
Claim 2
Dependent Claim
106 words
A semiconductor chip designed to be bonded to a surface of a solid body with a predetermined gap secured in between, the semiconductor chip having a plurality of bumps formed on a surface thereof that faces the surface of the solid body, the bumps serving to support the semiconductor chip, wherein the bumps include functional bumps that are configured to contribute to electrical connection between the semiconductor chip and the solid body and, dummy bumps that, although having a substantially identical structure as the functional bumps, do not contribute to the electrical connection, and wherein the semiconductor chip is bonded to the solid body by pressure.
Claim 3
Dependent Claim
39 words
A semiconductor chip as claimed in claim 1 , wherein the dummy bumps include central dummy bumps that are formed in a central portion of the surface of the semiconductor chip that faces the surface of the solid body.
Claim 4
Dependent Claim
39 words
A semiconductor chip as claimed in claim 1 , wherein the dummy bumps include peripheral dummy bumps that are formed in a peripheral portion of the surface of the semiconductor chip that faces the surface of the solid body.
Claim 5
Dependent Claim
38 words
A semiconductor chip as claimed in claim 1 , wherein the dummy bumps include corner dummy bumps that are formed in corner portions of the surface of the semiconductor chip that faces the surface of the solid body.
Claim 6
Dependent Claim
40 words
A semiconductor chip as claimed in claim 1 , wherein the bumps are so arranged as to be substantially symmetric with respect to a center of the surface of the semiconductor chip that faces the surface of the solid body.
Claim 7
Dependent Claim
44 words
A semiconductor chip as claimed in claim 1 , wherein the bumps are so arranged as to be substantially symmetric with respect to a line passing through a center of the surface of the semiconductor chip that faces the surface of the solid body.
Claim 8
Dependent Claim
36 words
A semiconductor chip as claimed in claim 1 , wherein the bumps are so arranged as to be distributed substantially evenly over the surface of the semiconductor chip that faces the surface of the solid body.
Claim 9
Dependent Claim
138 words
A semiconductor device having a chip-on-chip structure, comprising: a first semiconductor chip; and a second semiconductor chip superposed on and bonded to a surface of the first semiconductor chip, the second semiconductor chip having bumps formed on a surface thereof that faces the first semiconductor chip, wherein the bumps include functional bumps that are configured to contribute to electrical connection between the first and the second semiconductor chips and dummy bumps that, although having a substantially identical structure as the functional bumps, do not contribute to the electrical connection, and wherein the first and second semiconductor chips are bonded together by pressure; and between the first semiconductor chip and the bumps formed on the second semiconductor chip, cushion pads are provided that are so formed as to be thinner than the bumps formed on the second semiconductor chip.
Claim 10
Dependent Claim
138 words
A semiconductor device having a chip-on-chip structure, comprising: a first semiconductor chip; and a second semiconductor chip superposed on and bonded to a surface of the first semiconductor chip, the second semiconductor chip having bumps formed on a surface thereof that faces the first semiconductor chip, wherein the bumps include functional bumps that are configured to contribute to electrical connection between the first and the second semiconductor chips and dummy bumps that, although having a substantially identical structure as the functional bumps, do not contribute to the electrical connection, and wherein the first and second semiconductor chips are bonded together by pressure; and between the first semiconductor chip and the bumps formed on the second semiconductor chip, cushion pads are provided that are so formed as to be thinner than the bumps formed on the second semiconductor chip.
Claim 11
Dependent Claim
64 words
A semiconductor chip as claimed in claim 1 , wherein the functional bumps are formed, using an oxidation-resistant metal, on a seed film in an opening formed in a surface protection film of the semiconductor chip, and the dummy bumps are formed, using a same material as the functional bumps, on a seed film laid on the surface protection film of the semiconductor chip.
References Cited (Backward Citations)
US4878611A
Cited
US4865245A
Cited
JPH01238148A
Cited
JPH06310565A
Cited
US5400950A
Cited
JPH0846313A
Cited
US6175157B1
Cited
US5923090A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-10-07 | 2006-04-08 | 2006-10-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-10-07 | 2010-04-08 | 2010-10-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-10-07 | 2014-04-08 | 2014-10-08 | $7700.00 | Window Closed / Lapsed |