US6813134B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electrostatic chucking device and manufacturing method thereof
Assignee: Creative Technology Corp
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Filing: 2001-08-10
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Granted: 2004-11-02
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Expires: 2021-08-10
Abstract
Abstract An electrostatic chucking device having a laminated structure formed by sequentially laminating a first insulation layer, an electrode layer, and a second insulation layer on a metal substrate. The first and second insulation layers are formed from polyimide films. At least one adhesion layer is provided between the metal substrate and the first insulation layer, and, preferably, between the first insulation layer and the electrode layer, and between the electrode layer and the second insulation layer. The adhesion layer is a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm. The electrostatic chucking device may be manufactured by a low-temperature compression bonding process under pressure at a temperature of 100 to 250° C. between the metal substrate and the first insulation layer, between the first insulation layer and the electrode layer, and between the electrode layer and the second insulation layer using thermoplastic polyimide-based adhesion films.
Inventors
- 👤 Yoshiaki Tatsumi
- 👤 Kinya Miyashita
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 11:30
CPC Classifications
H; H10; H10P; H10P95/00; H10P72/00; H10P72/70; H10P72/72; H10P72/722; Y; Y10; Y10T; Y10T279/00; Y10T279/23; Y10T428/00; Y10T428/26; Y10T428/263; Y10T428/269; Y10T428/31504; Y10T428/31721
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
328 words
An electrostatic chucking device manufacturing method including a step in which a polyimide film which constitutes a first insulation layer, a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm, a metal foil which constitutes an electrode layer, a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm and a film which constitutes a second insulation layer are sequentially superposed, a step in which a low-temperature compression bonding processing is performed at a heating temperature of 100 to 250° C. under pressure so as to form an electrostatic chucking sheet which is constituted by sequentially laminating the first insulation layer, the electrode layer and the second insulation layer, a step in which the electrostatic chucking sheet is superposed on a metal substrate by way of a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm, and a step in which a low-temperature compression bonding processing is performed at a heating temperature of 100 to 250° C. under pressure so as to form a laminated structure which is constituted by sequentially laminating the first insulation layer, the electrode aver and the second insulation aver on the metal substrate, wherein the polyimide film which constitutes the first insulation layer and the thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm are preliminarily integrally laminated to form a first laminated sheet, the polyimide film which constitutes the second insulation layer and the thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm are preliminarily integrally laminated to form a second laminated sheet, and a metal foil is inserted between respective adhesive films of the first laminated sheet and the second laminated sheet, and the first laminated sheet, the second laminated sheet and the metal foil are subjected to a low-temperature compression bonding processing under pressure at a heating temperature of 100 to 250° C. so as to form the electrostatic chucking sheet.
Claim 2
Dependent Claim
328 words
An electrostatic chucking device manufacturing method including a step in which a polyimide film which constitutes a first insulation layer, a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm, a metal foil which constitutes an electrode layer, a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm and a film which constitutes a second insulation layer are sequentially superposed, a step in which a low-temperature compression bonding processing is performed at a heating temperature of 100 to 250° C. under pressure so as to form an electrostatic chucking sheet which is constituted by sequentially laminating the first insulation layer, the electrode layer and the second insulation layer, a step in which the electrostatic chucking sheet is superposed on a metal substrate by way of a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm, and a step in which a low-temperature compression bonding processing is performed at a heating temperature of 100 to 250° C. under pressure so as to form a laminated structure which is constituted by sequentially laminating the first insulation layer, the electrode aver and the second insulation aver on the metal substrate, wherein the polyimide film which constitutes the first insulation layer and the thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm are preliminarily integrally laminated to form a first laminated sheet, the polyimide film which constitutes the second insulation layer and the thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm are preliminarily integrally laminated to form a second laminated sheet, and a metal foil is inserted between respective adhesive films of the first laminated sheet and the second laminated sheet, and the first laminated sheet, the second laminated sheet and the metal foil are subjected to a low-temperature compression bonding processing under pressure at a heating temperature of 100 to 250° C. so as to form the electrostatic chucking sheet.
Claim 3
Dependent Claim
224 words
An electrostatic chucking device manufacturing method including a step in which a polyimide film which constitutes a first insulation layer, a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm, a metal foil which constitutes an electrode layer, a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm and a polyimide film which constitutes a second insulation layer are sequentially superposed, a step in which a low-temperature compression bonding processing is performed at a heating temperature of 100 to 250° C. under pressure so as to form an electrostatic chucking sheet which is constituted by sequentially laminating the first insulation layer, the electrode layer and the second insulation layer, a step in which the electrostatic chucking sheet is superposed on a metal substrate by way of a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm, and a step in which a low-temperature compression bonding processing is performed at a heating temperature of 100 to 250° C. under pressure so as to form a laminated structure which is constituted by sequentially laminating the first insulation layer, the electrode layer and the second insulation layer on the metal substrate, wherein the polyimide films which constitute the first insulation layer and the second insulation layer have a film thickness of 20 to 50 μm.
Claim 4
Dependent Claim
224 words
An electrostatic chucking device manufacturing method including a step in which a polyimide film which constitutes a first insulation layer, a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm, a metal foil which constitutes an electrode layer, a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm and a polyimide film which constitutes a second insulation layer are sequentially superposed, a step in which a low-temperature compression bonding processing is performed at a heating temperature of 100 to 250° C. under pressure so as to form an electrostatic chucking sheet which is constituted by sequentially laminating the first insulation layer, the electrode layer and the second insulation layer, a step in which the electrostatic chucking sheet is superposed on a metal substrate by way of a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm, and a step in which a low-temperature compression bonding processing is performed at a heating temperature of 100 to 250° C. under pressure so as to form a laminated structure which is constituted by sequentially laminating the first insulation layer, the electrode layer and the second insulation layer on the metal substrate, wherein the polyimide films which constitute the first insulation layer and the second insulation layer have a film thickness of 20 to 50 μm.
Claim 5
Dependent Claim
224 words
An electrostatic chucking device manufacturing method including a step in which a polyimide film which constitutes a first insulation layer, a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm, a metal foil which constitutes an electrode layer, a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm and a polyimide film which constitutes a second insulation layer are sequentially superposed, a step in which a low-temperature compression bonding processing is performed at a heating temperature of 100 to 250° C. under pressure so as to form an electrostatic chucking sheet which is constituted by sequentially laminating the first insulation layer, the electrode layer and the second insulation layer, a step in which the electrostatic chucking sheet is superposed on a metal substrate by way of a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm, and a step in which a low-temperature compression bonding processing is performed at a heating temperature of 100 to 250° C. under pressure so as to form a laminated structure which is constituted by sequentially laminating the first insulation layer, the electrode layer and the second insulation layer on the metal substrate, wherein the low-temperature compression bonding processing is performed under the compression condition of 2 to 5 MPa in the thicknesswise direction in the atmosphere.
Claim 6
Dependent Claim
224 words
An electrostatic chucking device manufacturing method including a step in which a polyimide film which constitutes a first insulation layer, a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm, a metal foil which constitutes an electrode layer, a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm and a polyimide film which constitutes a second insulation layer are sequentially superposed, a step in which a low-temperature compression bonding processing is performed at a heating temperature of 100 to 250° C. under pressure so as to form an electrostatic chucking sheet which is constituted by sequentially laminating the first insulation layer, the electrode layer and the second insulation layer, a step in which the electrostatic chucking sheet is superposed on a metal substrate by way of a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm, and a step in which a low-temperature compression bonding processing is performed at a heating temperature of 100 to 250° C. under pressure so as to form a laminated structure which is constituted by sequentially laminating the first insulation layer, the electrode layer and the second insulation layer on the metal substrate, wherein the low-temperature compression bonding processing is performed under the compression condition of 2 to 5 MPa in the thicknesswise direction in the atmosphere.
Claim 7
Dependent Claim
231 words
An electrostatic chucking device manufacturing method including a step in which a polyimide film which constitutes a first insulation layer, a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm, a metal foil which constitutes an electrode layer, a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm and a polyimide film which constitutes a second insulation layer are sequentially superposed, a step in which a low-temperature compression bonding processing is performed at a heating temperature of 100 to 250° C. under pressure so as to form an electrostatic chucking sheet which is constituted by sequentially laminating the first insulation layer, the electrode aver and the second insulation layer, a step in which the electrostatic chucking sheet is superposed on a metal substrate by way of a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm, and a step in which a low-temperature compression bonding processing is performed at a heating temperature of 100 to 250° C. under pressure so as to form a laminated structure which is constituted by sequentially laminating the first insulation layer, the electrode layer and the second insulation layer on the metal substrate, wherein the low-temperature compression bonding processing is performed under the compression condition of 0.1 to 5 MPa in the thicknesswise direction in the reduced-pressure atmosphere of not more than 133 Pa.
Claim 8
Dependent Claim
231 words
An electrostatic chucking device manufacturing method including a step in which a polyimide film which constitutes a first insulation layer, a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm, a metal foil which constitutes an electrode layer, a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm and a polyimide film which constitutes a second insulation layer are sequentially superposed, a step in which a low-temperature compression bonding processing is performed at a heating temperature of 100 to 250° C. under pressure so as to form an electrostatic chucking sheet which is constituted by sequentially laminating the first insulation layer, the electrode aver and the second insulation layer, a step in which the electrostatic chucking sheet is superposed on a metal substrate by way of a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm, and a step in which a low-temperature compression bonding processing is performed at a heating temperature of 100 to 250° C. under pressure so as to form a laminated structure which is constituted by sequentially laminating the first insulation layer, the electrode layer and the second insulation layer on the metal substrate, wherein the low-temperature compression bonding processing is performed under the compression condition of 0.1 to 5 MPa in the thicknesswise direction in the reduced-pressure atmosphere of not more than 133 Pa.
Claim 9
Dependent Claim
226 words
An electrostatic chucking device manufacturing method including a step in which a polyimide film which constitutes a first insulation layer, a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm, a metal foil which constitutes an electrode layer, a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm and a polyimide film which constitutes a second insulation layer are sequentially superposed, a step in which a low-temperature compression bonding processing is performed at a heating temperature of 100 to 250° C. under pressure so as to form an electrostatic chucking sheet which is constituted by sequentially laminating the first insulation layer, the electrode layer and the second insulation layer, a step in which the electrostatic chucking sheet is superposed on a metal substrate by way of a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm, and a step in which a low-temperature compression bonding processing is performed at a heating temperature of 100 to 250° C. under pressure so as to form a laminated structure which is constituted by sequentially laminating the first insulation layer, the electrode layer and the second insulation layer on the metal substrate, wherein the polyimide films of the first and second insulation layers have a film thickness in a range of 20 μm and less than 50 μm.
Claim 10
Dependent Claim
226 words
An electrostatic chucking device manufacturing method including a step in which a polyimide film which constitutes a first insulation layer, a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm, a metal foil which constitutes an electrode layer, a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm and a polyimide film which constitutes a second insulation layer are sequentially superposed, a step in which a low-temperature compression bonding processing is performed at a heating temperature of 100 to 250° C. under pressure so as to form an electrostatic chucking sheet which is constituted by sequentially laminating the first insulation layer, the electrode layer and the second insulation layer, a step in which the electrostatic chucking sheet is superposed on a metal substrate by way of a thermoplastic polyimide-based adhesive film having a film thickness of 5 to 50 μm, and a step in which a low-temperature compression bonding processing is performed at a heating temperature of 100 to 250° C. under pressure so as to form a laminated structure which is constituted by sequentially laminating the first insulation layer, the electrode layer and the second insulation layer on the metal substrate, wherein the polyimide films of the first and second insulation layers have a film thickness in a range of 20 μm and less than 50 μm.
Claim 11
Dependent Claim
28 words
An electrostatic chucking device manufacturing method according to any one of claims 1 - 5 , wherein the metal substrate is made of an aluminum alloy metal substrate.
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