US6099678A
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Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device
Assignee: Resonac Corp
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Filing: 1995-12-26
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Granted: 2000-08-08
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Expires: 2015-12-26
Abstract
Abstract PCT No. PCT/JP95/02691 Sec. 371 Date Jun. 25, 1997 Sec. 102(e) Date Jun. 25, 1997 PCT Filed Dec. 26, 1995 PCT Pub. No. WO96/29730 PCT Pub. Date Sep. 26, 1996A laminating method and a machine are provided for successively heating and compression-bonding a film-shaped organic die-bonding material on a leadframe with good productivity but without voids and further to avoid package cracking upon mounting a chip. A leadframe 7 is placed on a travelling table 8 and is heated there. A film-shaped organic die-bonding material 2 is punched out and the resulting film is tack-bonded to a die pad on the leadframe. The leadframe with the film tack-bonded thereon is then moved to a position b by the travelling table. After the film is pressed by a compression-bonding element at the position B, a chip is mounted on the film-shaped organic die-bonding material 2.
Inventors
- 👤 Akio Kotato
- 👤 Yuusuke Miyamae
- 👤 Tadaji Satou
- 👤 Makoto Saitou
- 👤 Tooru Kikuchi
- 👤 Akira Kageyama
- 👤 Shinji Takeda
- 👤 Takashi Masuko
- 👤 Masami Yusa
- 👤 Yasuo Miyadera
- 👤 Mituo Yamasaki
- 👤 Iwao Maekawa
- 👤 Aizou Kaneda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 16:52
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/013; H10W72/011; H10W72/0113; H10W72/0198; H10W72/071; H10W72/0711; H10W72/07173; H10W72/073; H10W72/07331; H10W72/07336; H10W72/07337; H10W72/075; H10W72/30; H10W72/351; H10W72/353; H10W72/354; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/951; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1062; Y10T156/107; Y10T156/12; Y10T156/1317; Y10T156/1322; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49146; Y10T29/53; Y10T29/5313; Y10T29/53174; Y10T29/53178
Claims Analysis
Total Claims: 38
Claim 1
Independent Claim
118 words
A laminating method for compression bonding a film-shaped organic die-bonding material of a predetermined size on a chip-mounting support member at a predetermined position thereof, which comprises a first step of mounting and tack-bonding said film-shaped organic die-bonding material to the predetermined position of said support member; and a second step of compression-bonding while being degassed by pressing said film-shaped organic die-bonding material against said support member using a compression-bonding device, thereby die-bonding said die-bonding material on said support member, wherein said compression-bonding device is a device selected from a compression-bonding element whose tip comprises an elastic body configured at a surface thereof to define a curved convex surface before compression-bonding; a roller and a planar elastic body.
Claim 2
Dependent Claim
118 words
A laminating method for compression bonding a film-shaped organic die-bonding material of a predetermined size on a chip-mounting support member at a predetermined position thereof, which comprises a first step of mounting and tack-bonding said film-shaped organic die-bonding material to the predetermined position of said support member; and a second step of compression-bonding while being degassed by pressing said film-shaped organic die-bonding material against said support member using a compression-bonding device, thereby die-bonding said die-bonding material on said support member, wherein said compression-bonding device is a device selected from a compression-bonding element whose tip comprises an elastic body configured at a surface thereof to define a curved convex surface before compression-bonding; a roller and a planar elastic body.
Claim 3
Dependent Claim
42 words
A laminating method according to claim 1, wherein said compression-bonding device is the compression-bonding element, said compression-bonding element comprising a main body having a smooth free end face and a plate-shaped elastic body covering a free end portion of said main body.
Claim 4
Dependent Claim
37 words
A laminating method according to claim 2, wherein said smooth free end face of said main body of said compression-bonding element has a profile irregularity not greater than 15 μm in terms of center line average height.
Claim 5
Dependent Claim
27 words
A laminating method according to any one of claims 1, 2 or 3 wherein said elastic body has a Young's modulus of from 0.2 to 50 MPa.
Claim 6
Dependent Claim
26 words
A laminating method according to claim 1, wherein said elastic body has surface smoothness not greater than 10 μm in terms of center line average height.
Claim 7
Dependent Claim
20 words
A laminating method according to claim 1, wherein said compression-bonding element exerts a pressure of from 0.03 to 2 MPa.
Claim 8
Dependent Claim
30 words
A laminating method according to claim 1, wherein said compression-bonding device comprises a compression surface having surface smoothness not greater than 10 μm in terms of center line average height.
Claim 9
Dependent Claim
31 words
A laminating method according to claim 1, wherein said film-shaped organic die-bonding material is pressed against said support member and compression-bonded thereon under a load of from 50 to 3000 g.
Claim 10
Dependent Claim
62 words
A laminating method according to claims 1 or 2, wherein said film-shaped organic die-bonding material is pressed against said support member, which has been heated to a temperature not lower than a glass transition temperature Tg of said die-bonding material but not higher than a thermal decomposition temperature of said die-bonding material, whereby said die-bonding material is compression-bonded on said support member.
Claim 11
Dependent Claim
40 words
A laminating method according to claims 1 or 2, wherein said film-shaped organic die-bonding material is pressed against said support member, which has been heated to 80 to 300° C., whereby said die-bonding material is compression-bonded on said support member.
Claim 12
Dependent Claim
26 words
A laminating method according to claim 1, wherein said film-shaped organic die-bonding material of said predetermined size has been punched out by a film punch device.
Claim 13
Dependent Claim
31 words
A laminating method according to claim 11, wherein tension of said film-shaped organic die-bonding material prior to said punching-out by said film punching device is adjusted to 0.05 to 10 MPa.
Claim 14
Dependent Claim
24 words
A laminating method according to claim 11, wherein said film-shaped organic die-bonding material of said predetermined size has a machining accuracy of ±200 μm.
Claim 15
Dependent Claim
25 words
A laminating method according to claim 1, wherein said film-shaped organic die-bonding material of said predetermined size has been cut out by a film cutter.
Claim 16
Dependent Claim
24 words
A laminating method according to claim 14, wherein said film-shaped organic die-bonding material of said predetermined size has a machining accuracy of ±200 μm.
Claim 17
Dependent Claim
45 words
A laminating method according to claim 1, wherein said film-shaped organic die-bonding material machined into said predetermined size is held and mounted on said support member at said predetermined position thereof by a holding member which is provided with at least two vacuum suction ports.
Claim 18
Dependent Claim
90 words
A laminating method according to claim 1, wherein said film-shaped organic die-bonding material has been formed by coating a carrier film with a varnish, causing a solvent to evaporate to form a layer and then peeling off the layer from said carrier film; and said film-shaped organic die-bonding material is mounted on said support member so that said film-shaped organic die-bonding material is brought into contact with said support member at a side opposite to a side where said film-shaped organic die-bonding material was in contact with said carrier film.
Claim 19
Dependent Claim
25 words
A laminating method according to claim 1, where said film-shaped organic die-bonding material which has a water absorption rate not greater than 1.5 vol. %.
Claim 20
Dependent Claim
26 words
A laminating method according to claim 1, wherein said film-shaped organic die-bonding material which has a saturation moisture absorption rate not greater than 1.0 vol. %.
Claim 21
Dependent Claim
25 words
A laminating method according to claim 1, wherein said film-shaped organic die-bonding material which has a residual volatile content not greater than 3.0 wt. %.
Claim 22
Dependent Claim
24 words
A laminating method according to claim 1, wherein said film-shaped organic die-bonding material which has surface energy of at least 40 erg/cm 2 .
Claim 23
Dependent Claim
45 words
A laminating method according to claim 1, wherein voids existing in said die-bonding material and an interface between said die-bonding material and said support member in a stage of bonding a chip on said support member which have a void volume not greater than 10%.
Claim 24
Dependent Claim
37 words
A laminating method according to claim 1, wherein the film-shaped organic die-bonding material which has peeling strength of at least 0.5 kgf/5×5 mm chip at a stage when a chip has been bonded on said support member.
Claim 25
Dependent Claim
17 words
The laminating method of claim 1 wherein said film-shaped organic die-bonding material consists of a bonding layer.
Claim 26
Dependent Claim
18 words
A laminating method of claim 1 wherein a pressure of said compression-bonding is from 0.03 to 2 MPa.
Claim 27
Dependent Claim
18 words
A laminating method of claim 1 wherein a load of said compression-bonding is from 50 to 3000 g.
Claim 28
Dependent Claim
61 words
A die-bonding method, which comprises laminating a film-shaped organic die-bonding material of a predetermined size on a chip-mounting support member at a predetermined position thereof by a method as described in claim 1, and heating a chip and compression-bonding said chip on said film-shaped organic die-bonding material at a predetermined position thereof, said die-bonding material being located on said support member.
Claim 29
Dependent Claim
49 words
A process for the fabrication of a semiconductor device, which comprises laminating film-shaped organic die-bonding material on a support member using a laminating method according to claim 1, die-bonding a chip on said support member via said film-shaped organic die-bonding material and the sealing said chip with a resin.
Claim 30
Dependent Claim
53 words
A fabrication process according to claim 28, wherein said film-shaped organic die-bonding material has an area not greater than that of said chip so that said film-shaped organic die-bonding material does not protrude out from a contour of said chip at a stage when said chip has been bonded on said support member.
Claim 31
Dependent Claim
126 words
A laminating apparatus comprising: a feeder for feeding a film-shaped organic die-bonding material over a predetermined constant length; a punching or cutting device for punching out or cutting out said film-shaped organic die-bonding material; a tack-bonding device for placing and tack-bonding device for placing and tack-bonding the punched-out or cut-out film-shaped organic die-bonding material on said support member; and a compression-bonding device for pressing the tack-bonded film-shaped organic die-bonding material against said support member so that said tack-bonded film-shaped organic die-bonding material is compression-bonded on said support member, wherein said compression-bonding device is a device selected from a compression-bonding element whose tip comprises an elastic body configured at a surface thereof to define a curved convex surface before compression-bonding; a roller and a planar elastic body.
Claim 32
Dependent Claim
126 words
A laminating apparatus comprising: a feeder for feeding a film-shaped organic die-bonding material over a predetermined constant length; a punching or cutting device for punching out or cutting out said film-shaped organic die-bonding material; a tack-bonding device for placing and tack-bonding device for placing and tack-bonding the punched-out or cut-out film-shaped organic die-bonding material on said support member; and a compression-bonding device for pressing the tack-bonded film-shaped organic die-bonding material against said support member so that said tack-bonded film-shaped organic die-bonding material is compression-bonded on said support member, wherein said compression-bonding device is a device selected from a compression-bonding element whose tip comprises an elastic body configured at a surface thereof to define a curved convex surface before compression-bonding; a roller and a planar elastic body.
Claim 33
Dependent Claim
42 words
A laminating method according to claim 30, wherein said compression-bonding device is the compression-bonding element, said compression-bonding element comprising a main body having a smooth free end face and a plate-shaped elastic body covering a free end portion of said main body.
Claim 34
Dependent Claim
37 words
A laminating apparatus according to claim 31, wherein said smooth free end face of said main body of said compression-bonding element has a profile irregularity not greater than 15 μm in terms of center line average height.
Claim 35
Dependent Claim
21 words
A laminating apparatus according to claim 30, wherein said elastic body has a Young's modulus of from 0.2 to 50 MPa.
Claim 36
Dependent Claim
31 words
A laminating apparatus according to claim 30, wherein said compression-bonding device has a compression-bonding face whose surface smoothness is not greater than 1 μm in terms of center line average height.
Claim 37
Dependent Claim
46 words
A die-bonding apparatus comprising a laminating apparatus as in described in claim 30, and a chip compression-bonding machine for heating a chip and compression-bonding said chip on a film-shaped organic die-bonding material at a predetermined position thereof, said die-bonding material being located on a support member.
Claim 38
Dependent Claim
135 words
A die-bonding apparatus provided with a laminating apparatus as described in claim 30, and a chip compression-bonding machine for heating a chip and compression-bonding said chip on a film-shaped organic die-bonding material at a predetermined position thereof, said die-bonding material being located on a support member, wherein said die-bonding apparatus has a heater block (38a) for preheating a leadframe as said support member, another heater block (38b) for heating said film-shaped organic die-bonding material and compression-bonding said film-shaped organic die-bonding material on said leadframe, a further heater block (38c) for heating said chip and compression-bonding said chip on said film-shaped organic die-bonding material and a still further heater block (38d) for heating said chip, which has been heated and compression-bonded, again and permanently compression-bonding said chip, and temperatures of said heater blocks are independently adjustable.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-08-08 | 2004-02-07 | 2004-08-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-08-08 | 2008-02-07 | 2008-08-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-08-08 | 2012-02-07 | 2012-08-08 | $7700.00 | Window Closed / Lapsed |