US5837368A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Insulating film with improved punching characteristics and lead frame using the same
Assignee: Hitachi Cable Ltd
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Filing: 1996-12-04
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Granted: 1998-11-17
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Expires: 2016-12-04
Abstract
Abstract The occurrence of burrs and chips in punching an insulating film is suppressed by adjusting an edge tearing resistance of the insulating film. The edge tearing resistance is preferably 50 to 70 kgf/20 mm for the purpose of suppressing the burrs and the chips.
Inventors
- 👤 Toshikatsu Hiroe
- 👤 Kenichi Kaneko
- 👤 Noboru Imai
- 👤 Hiroyuki Takasaka
- 👤 Toshio Kawamura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 02:38
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W70/01; H10W70/04; H10W70/421; H10W70/435; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/036; H05K1/0393; H05K3/00; H05K3/38; H05K3/386; H10W72/00; H10W72/071; H10W72/073; H10W72/07351; H10W72/07352; H10W72/30; H10W72/321; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/851; H10W72/853; H10W72/865; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/754; H10W90/756; Y; Y10; Y10S; Y10S118/00; Y10S118/04; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/28; Y10T428/2804; Y10T428/31504; Y10T428/31721
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
48 words
An insulating film with improved punching characteristics, comprising: a polyimide insulating base film having an edge tearing resistance in a range of 56 to 70 kgf/20 mm; and one of insulating thermoplastic and insulating thermosetting adhesive layers provided on at least one surface of said insulating base film.
Claim 2
Dependent Claim
48 words
An insulating film with improved punching characteristics, comprising: a polyimide insulating base film having an edge tearing resistance in a range of 56 to 70 kgf/20 mm; and one of insulating thermoplastic and insulating thermosetting adhesive layers provided on at least one surface of said insulating base film.
Claim 3
Dependent Claim
69 words
A lead frame using an insulating film with improved punching characteristics, comprising: inner lead portions to be connected to a semiconductor chip; outer lead portions to be connected to external circuits; and polyimide insulating films punched to a predetermined configuration, said punched films being adhesively fixed to said inner lead portions; wherein said punched films have an edge tearing resistance in a range of 56 to 70 kgf/20 mm.
Claim 4
Dependent Claim
69 words
A lead frame using an insulating film with improved punching characteristics, comprising: inner lead portions to be connected to a semiconductor chip; outer lead portions to be connected to external circuits; and polyimide insulating films punched to a predetermined configuration, said punched films being adhesively fixed to said inner lead portions; wherein said punched films have an edge tearing resistance in a range of 56 to 70 kgf/20 mm.
Claim 5
Dependent Claim
39 words
A lead frame using an insulating film with improved punching characteristics, according to claim 2, wherein: each of said polyimide insulating films comprises at least one surface layer which is one of insulating thermoplastic and insulating thermosetting adhesive layers.
Claim 6
Dependent Claim
70 words
A semiconductor chip package, comprising: a semiconductor chip; a lead frame comprising inner lead portions connected to said semiconductor chip, and outer lead portions to be connected to external circuits; polyimide insulating films punched to a predetermined configuration for adhesively fixing said semiconductor chip and said inner portions of said lead frame, wherein said punched films have an edge tearing resistance in a range of 56 to 70 kgf/20 mm.
Claim 7
Dependent Claim
70 words
A semiconductor chip package, comprising: a semiconductor chip; a lead frame comprising inner lead portions connected to said semiconductor chip, and outer lead portions to be connected to external circuits; polyimide insulating films punched to a predetermined configuration for adhesively fixing said semiconductor chip and said inner portions of said lead frame, wherein said punched films have an edge tearing resistance in a range of 56 to 70 kgf/20 mm.
Claim 8
Dependent Claim
32 words
A semiconductor chip package, according to claim 4, wherein; each of said polyimide insulating films comprises at least one surface layer which is one of insulating thermoplastic and insulating thermosetting adhesive layers.
Claim 9
Dependent Claim
57 words
A semiconductor chip package, according to claim 4, wherein said inner lead portions of said lead frame are connected to electrodes provided on a surface of said semiconductor chip by bonding wires; and said inner lead portions of said lead frame, said surface of said semiconductor chip, and said bonding wires are sealed by a resin layer.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-11-16 | 2002-05-18 | 2002-11-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-11-16 | 2006-05-18 | 2006-11-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-11-16 | 2010-05-18 | 2010-11-17 | $7700.00 | Window Closed / Lapsed |