US6809398B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Metal-to-metal antifuse structure and fabrication method
Assignee: Microsemi SoC Corp
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Filing: 2000-12-14
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Granted: 2004-10-26
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Expires: 2020-12-14
Abstract
Abstract A metal-to-metal antifuse according to the present invention is compatible with a Cu dual damascene process and is formed over a lower Cu metal layer planarized with the top surface of a lower insulating layer. A lower barrier layer is disposed over the lower Cu metal layer. An antifuse material layer is disposed over the lower barrier layer. An upper barrier layer is disposed over the antifuse material layer. An upper insulating layer is disposed over the upper barrier layer. An upper Cu metal layer is planarized with the top surface of the upper insulating layer and extends therethrough to make electrical contact with the upper barrier layer.
Inventors
- 👤 Daniel Wang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 02:52
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10W20/49; H10W20/491; H10W20/41; H10W20/425; Y; Y10; Y10S; Y10S438/00; Y10S438/957
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
186 words
A metal-to-metal antifuse formed over a planarized surface formed from a metal layer and the top surface of a lower insulating layer, comprising: a first cap layer covering the planarized surface; a first barrier metal layer forming an antifuse electrode disposed in a via in said cap layer over and in electrical contact with said metal layer, said via being narrower than said metal layer, said first barrier metal layer having an upper surface planarized with an upper surface of said cap layer; a layer of antifuse material disposed over said first barrier metal layer and having edges extending over said cap layer; a second barrier metal layer disposed over said antifuse material layer and having edges aligned with said edges of said antifuse material layer; a second cap layer disposed over said first cap layer and surrounding said antifuse material and said second barrier metal layer; an intermetal dielectric layer formed over said second cap layer; and a metal contact formed in a via in said intermetal dielectric layer and said second cap layer, said metal contact in electrical contact with said second barrier layer.
Claim 2
Dependent Claim
186 words
A metal-to-metal antifuse formed over a planarized surface formed from a metal layer and the top surface of a lower insulating layer, comprising: a first cap layer covering the planarized surface; a first barrier metal layer forming an antifuse electrode disposed in a via in said cap layer over and in electrical contact with said metal layer, said via being narrower than said metal layer, said first barrier metal layer having an upper surface planarized with an upper surface of said cap layer; a layer of antifuse material disposed over said first barrier metal layer and having edges extending over said cap layer; a second barrier metal layer disposed over said antifuse material layer and having edges aligned with said edges of said antifuse material layer; a second cap layer disposed over said first cap layer and surrounding said antifuse material and said second barrier metal layer; an intermetal dielectric layer formed over said second cap layer; and a metal contact formed in a via in said intermetal dielectric layer and said second cap layer, said metal contact in electrical contact with said second barrier layer.
Claim 3
Dependent Claim
18 words
The metal-to-metal antifuse of claim 1 , wherein said antifuse material layer comprises a layer of amorphous silicon.
Claim 4
Dependent Claim
17 words
The metal-to-metal antifuse of claim 1 , wherein said first barrier layer comprises a layer of TaN.
Claim 5
Dependent Claim
17 words
The metal-to-metal antifuse of claim 1 , wherein said second barrier layer comprises a layer of TiN.
Claim 6
Dependent Claim
21 words
The metal-to-metal antifuse of claim 1 , wherein said first cap layer and said second cap layer are formed from SiN.
Claim 7
Dependent Claim
18 words
The metal-to-metal antifuse of claim 1 , wherein said antifuse material layer comprises a layer of amorphous silicon.
Claim 8
Dependent Claim
17 words
The metal-to-metal antifuse of claim 1 , wherein said first barrier layer comprises a layer of TaN.
Claim 9
Dependent Claim
17 words
The metal-to-metal antifuse of claim 1 , wherein said second barrier layer comprises a layer of TiN.
Claim 10
Independent Claim
204 words
A method of forming a metal-to-metal antifuse over a planarized surface formed from a metal layer and the top surface of a lower insulating layer, comprising: forming a first cap layer covering the planarized surface; forming a via in said first cap layer over said metal layer; forming a first barrier metal layer to form an antifuse electrode in said via, said via being narrower than said metal layer, said first barrier metal layer in electrical contact with said metal layer; planarizing said first barrier metal layer to have an upper surface planarized with an upper surface of said cap layer; forming a layer of antifuse material over said first barrier metal layer and having edges extending over said cap layer; forming a second barrier metal layer over said antifuse material layer and having edges aligned with said edges of said antifuse material layer; forming a second cap layer over said first cap layer and surrounding said antifuse material and said second barrier metal layer; forming an inter-metal dielectric layer over said second cap layer; and forming a metal contact in a via in said inter-metal dielectric layer and said second cap layer, said metal contact in electrical contact with said second barrier layer.
Claim 11
Independent Claim
204 words
A method of forming a metal-to-metal antifuse over a planarized surface formed from a metal layer and the top surface of a lower insulating layer, comprising: forming a first cap layer covering the planarized surface; forming a via in said first cap layer over said metal layer; forming a first barrier metal layer to form an antifuse electrode in said via, said via being narrower than said metal layer, said first barrier metal layer in electrical contact with said metal layer; planarizing said first barrier metal layer to have an upper surface planarized with an upper surface of said cap layer; forming a layer of antifuse material over said first barrier metal layer and having edges extending over said cap layer; forming a second barrier metal layer over said antifuse material layer and having edges aligned with said edges of said antifuse material layer; forming a second cap layer over said first cap layer and surrounding said antifuse material and said second barrier metal layer; forming an inter-metal dielectric layer over said second cap layer; and forming a metal contact in a via in said inter-metal dielectric layer and said second cap layer, said metal contact in electrical contact with said second barrier layer.
Claim 12
Dependent Claim
17 words
The method of claim 9 , wherein said antifuse material layer comprises a layer of amorphous silicon.
Claim 13
Dependent Claim
16 words
The method of claim 9 , wherein said first barrier layer comprises a layer of TaN.
Claim 14
Dependent Claim
16 words
The method of claim 9 , wherein said second barrier layer comprises a layer of TiN.
Claim 15
Dependent Claim
20 words
The method of claim 9 , wherein said first cap layer and said second cap layer are formed from SiN.
Claim 16
Dependent Claim
17 words
The method of claim 9 , wherein said antifuse material layer comprises a layer of amorphous silicon.
Claim 17
Dependent Claim
16 words
The method of claim 9 , wherein said first barrier layer comprises a layer of TaN.
Claim 18
Dependent Claim
16 words
The method of claim 9 , wherein said second barrier layer comprises a layer of TiN.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2007-10-26 | 2008-04-26 | 2008-10-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2011-10-26 | 2012-04-26 | 2012-10-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2015-10-26 | 2016-04-26 | 2016-10-26 | $7700.00 | Window Closed / Lapsed |