US6730544B1 — Stackable semiconductor package and method for ma…

Claim 1

Independent Claim 111 words

A semiconductor package for a semiconductor chip, said semiconductor package comprising: a plurality of L-shaped leads, each of said plurality of L-shaped leads having a top portion exposed on a top surface of said semiconductor package, a bottom portion exposed in and substantially flush with a bottom surface of said semiconductor package, and an inwardly extending member which is disposed between the top and bottom portions and partially defines a notch; a plurality of electrical paths electrically connecting said semiconductor chip to said L-shaped leads; and sealing material applied to said leads, said semiconductor chip, and said electrical paths, said sealing material filling said notch of each of said L-shaped leads.

Claim 2

Dependent Claim 111 words

A semiconductor package for a semiconductor chip, said semiconductor package comprising: a plurality of L-shaped leads, each of said plurality of L-shaped leads having a top portion exposed on a top surface of said semiconductor package, a bottom portion exposed in and substantially flush with a bottom surface of said semiconductor package, and an inwardly extending member which is disposed between the top and bottom portions and partially defines a notch; a plurality of electrical paths electrically connecting said semiconductor chip to said L-shaped leads; and sealing material applied to said leads, said semiconductor chip, and said electrical paths, said sealing material filling said notch of each of said L-shaped leads.

Claim 3

Dependent Claim 29 words

The semiconductor package of claim 1 , further comprising: a chip paddle having a bottom surface exposed in and substantially flush with said bottom surface of said semiconductor package.

Claim 4

Dependent Claim 22 words

The semiconductor package of claim 2 wherein said L-shaped leads are arranged in at least one single line surrounding said chip paddle.

Claim 5

Dependent Claim 22 words

The semiconductor package of claim 2 wherein said L-shaped leads are randomly dispersed in a plurality of lines surrounding said chip paddle.

Claim 6

Dependent Claim 26 words

The semiconductor package of claim 1 wherein said top portion of each of said L-shaped leads is flush with said top surface of said semiconductor package.

Claim 7

Dependent Claim 27 words

The semiconductor package of claim 1 wherein said top portion of each of said L-shaped leads extends generally perpendicularly from a bottom surface of said semiconductor chip.

Claim 8

Dependent Claim 22 words

The semiconductor package of claim 1 wherein said top portion and said bottom portion of each of said L-shaped leads is electroplated.

Claim 9

Dependent Claim 16 words

The semiconductor package of claim 1 wherein said electrical paths are a plurality of conductive wires.

Claim 10

Dependent Claim 21 words

The semiconductor package of claim 8 wherein said conductive wires are selected from the group consisting of: silver, gold, and aluminum.

Claim 11

Independent Claim 150 words

A method for stacking semiconductor packages, comprising the steps of: physically and electrically connecting a bottom side of a first semiconductor package to a printed circuit board, said first semiconductor package having a plurality of first L-shaped leads, each of said first L-shaped leads having a first section exposed on a first top surface of said first semiconductor package, a second section exposed in and substantially flush with a first bottom surface of said first semiconductor package, and an inwardly extending member disposed between said first and second sections and partially defining a notch which is filled with a sealing material applied to said first L-shaped leads and said semiconductor; and physically and electrically connecting a second semiconductor package to said first top surface of said first semiconductor package, said second semiconductor package having a plurality of second L-shaped leads in generally the same position as said first L-shaped leads.

Claim 12

Independent Claim 150 words

A method for stacking semiconductor packages, comprising the steps of: physically and electrically connecting a bottom side of a first semiconductor package to a printed circuit board, said first semiconductor package having a plurality of first L-shaped leads, each of said first L-shaped leads having a first section exposed on a first top surface of said first semiconductor package, a second section exposed in and substantially flush with a first bottom surface of said first semiconductor package, and an inwardly extending member disposed between said first and second sections and partially defining a notch which is filled with a sealing material applied to said first L-shaped leads and said semiconductor; and physically and electrically connecting a second semiconductor package to said first top surface of said first semiconductor package, said second semiconductor package having a plurality of second L-shaped leads in generally the same position as said first L-shaped leads.

Claim 13

Dependent Claim 22 words

The method for stacking semiconductor packages as in claim 10 wherein said first semiconductor package is soldered to said printed circuit board.

Claim 14

Dependent Claim 22 words

A method for stacking semiconductor packages as in claim 10 wherein said second semiconductor package is soldered to said first semiconductor package.

Claim 15

Dependent Claim 34 words

The method for stacking semiconductor packages as in claim 10 wherein said first section of each of said first L-shaped leads is substantially flush with said first top surface of said first semiconductor package.

Claim 16

Independent Claim 157 words

A method for manufacturing a semiconductor package, comprising the steps of: attaching a semiconductor chip to a paddle of a lead frame, said lead frame having a plurality of L-shaped leads surrounding said paddle; electrically connecting said semiconductor chip to each of said L-shaped leads via a plurality of wires; applying a sealing material to said semiconductor chip, said lead frame, and said wires, said sealing material forming a top side and a bottom side of said semiconductor package, with a first section of each of said L-shaped leads being exposed on said top side of said semiconductor package, a second section of each of said L-shaped leads being exposed in and substantially flush with said bottom side of said semiconductor package, and a notch partially defined by an inwardly extending member of each of said L-shaped leads being filled with said sealing material; and trimming off a portion of said lead frame and said sealing material.

Claim 17

Independent Claim 157 words

A method for manufacturing a semiconductor package, comprising the steps of: attaching a semiconductor chip to a paddle of a lead frame, said lead frame having a plurality of L-shaped leads surrounding said paddle; electrically connecting said semiconductor chip to each of said L-shaped leads via a plurality of wires; applying a sealing material to said semiconductor chip, said lead frame, and said wires, said sealing material forming a top side and a bottom side of said semiconductor package, with a first section of each of said L-shaped leads being exposed on said top side of said semiconductor package, a second section of each of said L-shaped leads being exposed in and substantially flush with said bottom side of said semiconductor package, and a notch partially defined by an inwardly extending member of each of said L-shaped leads being filled with said sealing material; and trimming off a portion of said lead frame and said sealing material.

Claim 18

Dependent Claim 32 words

The method for manufacturing a semiconductor package as in claim 13 wherein said first section of each of said L-shaped leads is substantially flush with said top side of said semiconductor package.

Claim 19

Dependent Claim 125 words

A semiconductor package for a semiconductor chip, the semiconductor package comprising: a plurality of leads, each of the leads having a top surface, a bottom surface, and an inwardly extending member which is disposed between the top and bottom surfaces and partially defines a notch; a semiconductor chip electrically connected to at least one of the leads; and a sealing material applied to the leads and the semiconductor chip such that the top surface of each of the leads is exposed in and substantially flush with an exterior surface of the sealing material, the bottom surface of each of the leads is exposed in and substantially flush with the exterior surface, and the notch of each of the leads is filled with the sealing material.

Claim 20

Dependent Claim 125 words

A semiconductor package for a semiconductor chip, the semiconductor package comprising: a plurality of leads, each of the leads having a top surface, a bottom surface, and an inwardly extending member which is disposed between the top and bottom surfaces and partially defines a notch; a semiconductor chip electrically connected to at least one of the leads; and a sealing material applied to the leads and the semiconductor chip such that the top surface of each of the leads is exposed in and substantially flush with an exterior surface of the sealing material, the bottom surface of each of the leads is exposed in and substantially flush with the exterior surface, and the notch of each of the leads is filled with the sealing material.

Claim 21

Dependent Claim 27 words

The semiconductor package of claim 16 wherein the semiconductor chip at least partially overlaps and is rested upon the inwardly extending member of each of the leads.

Claim 22

Dependent Claim 29 words

The semiconductor package of claim 16 wherein the semiconductor chip is electrically connected to each of the leads through the use of wires which are covered by sealing material.

Claim 23

Dependent Claim 48 words

The semiconductor package of claim 16 wherein each of the leads has a generally L-shaped configuration including a top portion which defines the top surface and a bottom portion which defines the bottom surface, the notch being collectively defined by the inwardly extending member and the bottom portion.

Claim 24

Dependent Claim 39 words

The semiconductor package of claim 16 further comprising a chip paddle having a bottom surface which is exposed in and substantially flush with the exterior surface of the sealing material, the semiconductor chip being positioned upon the chip paddle.

Claim 25

Dependent Claim 113 words

A semiconductor package for a semiconductor chip, the semiconductor package comprising: a plurality of leads, each of the leads having a top surface and a bottom surface; a semiconductor chip electrically connected to at least one of the leads; a sealing material applied to the leads and the semiconductor chip such that the top surface of each of the leads is exposed in and substantially flush with an exterior surface of the sealing material, and the bottom surface of each of the leads is exposed in and substantially flush with the exterior surface; and means formed within each of the leads for increasing the locking strength between the leads and the sealing material.

Claim 26

Dependent Claim 113 words

A semiconductor package for a semiconductor chip, the semiconductor package comprising: a plurality of leads, each of the leads having a top surface and a bottom surface; a semiconductor chip electrically connected to at least one of the leads; a sealing material applied to the leads and the semiconductor chip such that the top surface of each of the leads is exposed in and substantially flush with an exterior surface of the sealing material, and the bottom surface of each of the leads is exposed in and substantially flush with the exterior surface; and means formed within each of the leads for increasing the locking strength between the leads and the sealing material.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	2007-05-04	2007-11-03	2008-05-04	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2011-05-04	2011-11-03	2012-05-04	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2015-05-04	2015-11-03	2016-05-04	$7700.00	Window Closed / Lapsed

Stackable semiconductor package and method for manufacturing same

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