US6555922B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
IC bonding pad combined with mark or monitor
Assignee: Fujitsu Ltd
•
Filing: 1999-10-27
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Granted: 2003-04-29
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Expires: 2019-10-27
Abstract
Abstract A semiconductor device includes a bonding pad formed on a substrate and a mark region formed on the substrate right underneath the bonding pad, such that the mark region is covered by the bonding pad.
Inventors
- 👤 Kenji Nakagawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 20:36
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10P; H10P74/00; H10P74/27; H10P74/273; H10W46/00; H10W46/601; H10W72/075; H10W72/20; H10W72/29; H10W72/50; H10W72/531; H10W72/536; H10W72/59; H10W72/90; H10W72/931; H10W72/932; H10W72/934; H10W72/941; H10W72/9415; H10W72/951
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
69 words
A semiconductor device, comprising: a substrate; an active device formed on said substrate, said active device forming a circuit; a bonding pad formed on said substrate; and a mark pattern formed between said substrate and said bonding pad in the form of a pattern isolated from the circuit, such that said mark pattern is covered by said bonding pad, said mark pattern being functional for measurement of positional alignment.
Claim 2
Dependent Claim
69 words
A semiconductor device, comprising: a substrate; an active device formed on said substrate, said active device forming a circuit; a bonding pad formed on said substrate; and a mark pattern formed between said substrate and said bonding pad in the form of a pattern isolated from the circuit, such that said mark pattern is covered by said bonding pad, said mark pattern being functional for measurement of positional alignment.
Claim 3
Dependent Claim
20 words
A semiconductor device as claimed in claim 1 , wherein said bonding pad is electrically insulated from said mark pattern.
Claim 4
Dependent Claim
21 words
A semiconductor device as claimed in claim 1 , wherein said mark pattern includes a pattern separated from said active device.
Claim 5
Dependent Claim
25 words
A semiconductor device as claimed in claim 1 , wherein said bonding pad has a shape corresponding to an outer shape of said mark pattern.
Claim 6
Dependent Claim
33 words
A semiconductor device as claimed in claim 1 , wherein said bonding pad and said mark pattern are formed in a device region of said substrate in which said active device is formed.
Claim 7
Dependent Claim
26 words
A semiconductor device as claimed in claim 1 , wherein said bonding pad and said mark pattern are formed on a dicing line of said substrate.
Claim 8
Dependent Claim
17 words
A semiconductor device as claimed in claim 1 , wherein said mark pattern includes an alignment mark.
Claim 9
Dependent Claim
17 words
A semiconductor device as claimed in claim 1 , wherein said mark pattern includes a positioning mark.
Claim 10
Dependent Claim
71 words
A semiconductor device, comprising: a substrate; an active device formed on said substrate, said active device forming a circuit; a bonding pad formed on said substrate; and a monitoring pattern formed on said substrate under said bonding pad in the form of a pattern isolated from the circuit, such that said monitoring pattern is covered by said bonding pad, said monitoring pattern being functional for monitoring of a semiconductor fabrication process.
Claim 11
Dependent Claim
71 words
A semiconductor device, comprising: a substrate; an active device formed on said substrate, said active device forming a circuit; a bonding pad formed on said substrate; and a monitoring pattern formed on said substrate under said bonding pad in the form of a pattern isolated from the circuit, such that said monitoring pattern is covered by said bonding pad, said monitoring pattern being functional for monitoring of a semiconductor fabrication process.
Claim 12
Dependent Claim
68 words
A semiconductor device, comprising: a substrate; an active device formed on said substrate; a bonding pad formed on said substrate; a monitoring pattern formed on said substrate under said bonding pad, such that said monitoring pattern is covered by said bonding pad; another bonding pad adjacent to said bonding pad in electrical connection with said monitoring pattern; and another monitoring pattern formed right underneath said another bonding pad.
Claim 13
Dependent Claim
68 words
A semiconductor device, comprising: a substrate; an active device formed on said substrate; a bonding pad formed on said substrate; a monitoring pattern formed on said substrate under said bonding pad, such that said monitoring pattern is covered by said bonding pad; another bonding pad adjacent to said bonding pad in electrical connection with said monitoring pattern; and another monitoring pattern formed right underneath said another bonding pad.
Claim 14
Dependent Claim
17 words
A semiconductor device as claimed in claim 1 , wherein said mark pattern comprises a control pattern.
Claim 15
Dependent Claim
18 words
A semiconductor device as claimed in claim 11 , wherein said control pattern comprises an alignment mark pattern.
Claim 16
Dependent Claim
17 words
A semiconductor device as claimed in claim 9 , wherein said monitoring pattern comprises a monitoring structure.
References Cited (Backward Citations)
US4381201A
Cited
JPS60211941A
Cited
JPS61174659A
Cited
US5220199A
Cited
US5060045A
Cited
US5414297A
Cited
US5394013A
Cited
US5365112A
Cited
US5945716A
Cited
US5404047A
Cited
US5751065A
Cited
JPH08111419A
Cited
US5742468A
Cited
US5936289A
Cited
US5847466A
Cited
JPH09321104A
Cited
US6261883B1
Cited
US6232662B1
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-04-28 | 2006-10-28 | 2007-04-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-04-28 | 2010-10-28 | 2011-04-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-04-28 | 2014-10-28 | 2015-04-29 | $7700.00 | Window Closed / Lapsed |