US5751065A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit with active devices under bond pads
Assignee: Agere Systems LLC
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Filing: 1995-10-30
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Granted: 1998-05-12
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Expires: 2015-10-30
Abstract
Abstract Active circuitry is placed under the bond pads in an integrated circuit having at least three metal levels. The metal level adjacent the bond pad level acts as a buffer and provides stress relief and prevents leakage currents between the bond pad and underlying circuitry.
Inventors
- 👤 Sailesh Chittipeddi
- 👤 William Thomas Cochran
- 👤 Yehuda Smooha
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 21:53
CPC Classifications
H; H10; H10D; H10D84/00; H10D84/01; H10P; H10P74/00; H10P74/27; H10P74/277; H10W; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/59; H10W72/90; H10W72/921; H10W72/923; H10W72/9232; H10W72/931; H10W72/932; H10W72/934; H10W72/951; H10W72/952; H10W72/981; H10W72/983
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
127 words
An integrated circuit comprising: a substrate; active devices formed on the surface of said substrate; a bond pad formed substantially over a portion of said active devices, said bond pad having a footprint; a patterned metal layer having a footprint and located between said bond pad and said substrate, said metal layer being substantially over said active devices, said footprint of said bond pad substantially overlying said footprint of said patterned metal layer; a first dielectric layer separating said patterned metal layer from said bond pad, said patterned metal layer being electrically isolated from said active devices by a second dielectric layer; and electrical connections from said bond pad to said active device and from said patterned metal layer to said bond pad or said active devices.
Claim 2
Dependent Claim
127 words
An integrated circuit comprising: a substrate; active devices formed on the surface of said substrate; a bond pad formed substantially over a portion of said active devices, said bond pad having a footprint; a patterned metal layer having a footprint and located between said bond pad and said substrate, said metal layer being substantially over said active devices, said footprint of said bond pad substantially overlying said footprint of said patterned metal layer; a first dielectric layer separating said patterned metal layer from said bond pad, said patterned metal layer being electrically isolated from said active devices by a second dielectric layer; and electrical connections from said bond pad to said active device and from said patterned metal layer to said bond pad or said active devices.
Claim 3
Dependent Claim
21 words
An integrated circuit as recited in claim 1 in which said patterned metal layer is electrically connected to said bond pad.
Claim 4
Dependent Claim
31 words
An integrated circuit as recited in claim 2 in which said patterned metal layer is electrically connected to at least one device of said active said devices under said bond pad.
Claim 5
Dependent Claim
17 words
An integrated circuit as recited in claim 1 in which said integrated circuit has three metal levels.
Claim 6
Dependent Claim
19 words
An integrated circuit as recited in claim 1 in which said integrated circuit has at least four metal levels.
Claim 7
Dependent Claim
171 words
An integrated circuit comprising: a substrate; active devices formed on the surface of said substrate; a plurality of bond pads, at least one of said bond pads being substantially over at least one of said active devices, said bond pad having a footprint; a patterned metal layer having a footprint and located between each of said plurality of bond pads and said substrate, at least a porion of said metal layers being substantially over at least one of said active devices, each of said metal layers being electrically isolated from said active devices by a first dielectric material, said footprint of said bond pad substantially overlying said footprint of said patterned metal layer; a second dielectric material separating each of said patterned metal layer from said bond pads, each of said patterned metal layers forming a barrier between said first dielectric material and said active devices that substantially prevent current leakage between said second dielectric material and said active devices; and electrical connections from said bond pads to said active devices.
Claim 8
Dependent Claim
171 words
An integrated circuit comprising: a substrate; active devices formed on the surface of said substrate; a plurality of bond pads, at least one of said bond pads being substantially over at least one of said active devices, said bond pad having a footprint; a patterned metal layer having a footprint and located between each of said plurality of bond pads and said substrate, at least a porion of said metal layers being substantially over at least one of said active devices, each of said metal layers being electrically isolated from said active devices by a first dielectric material, said footprint of said bond pad substantially overlying said footprint of said patterned metal layer; a second dielectric material separating each of said patterned metal layer from said bond pads, each of said patterned metal layers forming a barrier between said first dielectric material and said active devices that substantially prevent current leakage between said second dielectric material and said active devices; and electrical connections from said bond pads to said active devices.
Claim 9
Dependent Claim
39 words
An integrated circuit as recited in claim 6 further comprising a metal layer between said patterned metal layer and said active devices; said metal layer being separated from said active devices and said patterned metal layer by dielectric material.
Claim 10
Dependent Claim
22 words
The circuit of claims 1 or 6 in which said patterned metal layer beneath said bond pad has a plurality of openings.
Claim 11
Dependent Claim
26 words
The circuit of claims 1 or 6 in which said patterned metal layer beneath said bond pad has a plurality of areas extending from a spine.
Claim 12
Dependent Claim
23 words
The circuit of claims 1 or 6 in which said patterned metal layer beneath said bond pad has two electrically connected interdigitated combs.
Claim 13
Dependent Claim
48 words
The circuit of claim 1 or 6 in which the said patterned metal layer beneath said bond pad is electrically connected to said bond pad by window, and in which a dielectric covers a portion of said bond pad and in which said windows are beneath said dielectric.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-05-11 | 2001-11-10 | 2002-05-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-05-11 | 2005-11-10 | 2006-05-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-05-11 | 2009-11-10 | 2010-05-12 | $7700.00 | Window Closed / Lapsed |