US6515373B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Cu-pad/bonded/Cu-wire with self-passivating Cu-alloys
Assignee: Infineon Technologies AG
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Filing: 2000-12-28
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Granted: 2003-02-04
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Expires: 2020-12-28
Abstract
Abstract In an integrated circuit structure, the improvement comprising a wire bonded Cu-pad with Cu-wire component, wherein the Cu-pad Cu-wire component is characterized by self-passivation, low resistance, high bond strength, and improved resistance to oxidation and corrosion, the Cu-pad Cu-wire component comprising: a metallization-line; a liner separating the metallization line and a Cu-alloy surrounding a Cu-pad; a dielectric surrounding the liner; and a Cu-pad bonded to a Cu-alloy wire; the Cu-wire component being characterized by self-passivation areas on: a) a dopant rich interface in between the Cu-alloy and liner; b) a surface of the Cu-pad; c) a surface of the bond between the Cu-pad and the Cu-alloy wire; and d) a surface of the Cu-alloy wire.
Inventors
- 👤 Hans-Joachim Barth
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 02:00
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/075; H10D; H10D64/00; H10D64/01; H10D64/011; H10W72/50; H10W72/90; H10W72/01; H10W72/015; H10W72/01551; H10W72/01571; H10W72/07511; H10W72/076; H10W72/521; H10W72/522; H10W72/531; H10W72/536; H10W72/551; H10W72/552; H10W72/5524; H10W72/5525; H10W72/555; H10W72/59; H10W72/921; H10W72/923; H10W72/925; H10W72/931; H10W72/934; H10W72/951; H10W72/952
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
122 words
In an integrated circuit structure, the improvement comprising a bonded Cu pad-Cu wire component, wherein said Cu pad-Cu wire component is characterized by self-passivation, low resistance, high bond strength, and improved resistance to oxidation and corrosion, said Cu pad-Cu wire component comprising: I. a liner separating a Cu Pad and a dielectric, wherein said Cu pad is a bi-layer Cu pad comprising Cu alloy seed layer plus pure Cu-fill; and II. a Cu-alloy wire bonded to said Cu pad; said Cu pad-Cu wire component being characterized by self-passivation on: a) a dopant rich interface between said Cu pad and said liner; b) a surface of a bond between said Cu-pad and said Cu wire; and c) a surface of said Cu wire.
Claim 2
Dependent Claim
122 words
In an integrated circuit structure, the improvement comprising a bonded Cu pad-Cu wire component, wherein said Cu pad-Cu wire component is characterized by self-passivation, low resistance, high bond strength, and improved resistance to oxidation and corrosion, said Cu pad-Cu wire component comprising: I. a liner separating a Cu Pad and a dielectric, wherein said Cu pad is a bi-layer Cu pad comprising Cu alloy seed layer plus pure Cu-fill; and II. a Cu-alloy wire bonded to said Cu pad; said Cu pad-Cu wire component being characterized by self-passivation on: a) a dopant rich interface between said Cu pad and said liner; b) a surface of a bond between said Cu-pad and said Cu wire; and c) a surface of said Cu wire.
Claim 3
Dependent Claim
38 words
The structure of claim 1 wherein a passivation layer of an oxide, nitride or combinations of nitrides has been deposited on said dielectric followed by annealing at a atmosphere of from about 250° C. to about 450° C.
Claim 4
Dependent Claim
24 words
The structure of claim 2 wherein said dopant is present in a range of from 0.1 to about 5.0 atomic percent of said Cu-alloy.
Claim 5
Dependent Claim
19 words
The structure of claim 3 wherein said Cu-alloy is selected from the group consisting of Cu—Al, Cu—Mg and Cu—Li.
Claim 6
Dependent Claim
10 words
The structure of claim 4 wherein said Cu-alloy is Cu—Al.
Claim 7
Dependent Claim
10 words
The structure of claim 4 wherein said Cu-alloy is Cu—Mg.
Claim 8
Dependent Claim
10 words
The structure of claim 4 wherein said Cu-alloy is Cu—Li.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2006-02-03 | 2006-08-05 | 2007-02-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2010-02-03 | 2010-08-05 | 2011-02-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2014-02-03 | 2014-08-05 | 2015-02-04 | $7700.00 | Window Closed / Lapsed |