Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
107 words
A semiconductor device comprising: a semiconductor substrate; a buried oxide film arranged on said semiconductor substrate; an SOI substrate comprising an SOI layer arranged on said buried oxide film; a plurality of semiconductor elements formed on said SOI layer; and a trench isolation oxide film obtained by burying an oxide film in a trench formed in the surface of said SOI layer, for electrically isolating said plurality of semiconductor elements by said trench isolation oxide film, wherein said trench isolation oxide film has different contour shapes of its upper edge portion on the left and right edges in a brachydirectional section of said trench isolation oxide film.
Claim 2
Dependent Claim
107 words
A semiconductor device comprising: a semiconductor substrate; a buried oxide film arranged on said semiconductor substrate; an SOI substrate comprising an SOI layer arranged on said buried oxide film; a plurality of semiconductor elements formed on said SOI layer; and a trench isolation oxide film obtained by burying an oxide film in a trench formed in the surface of said SOI layer, for electrically isolating said plurality of semiconductor elements by said trench isolation oxide film, wherein said trench isolation oxide film has different contour shapes of its upper edge portion on the left and right edges in a brachydirectional section of said trench isolation oxide film.
Claim 3
Dependent Claim
39 words
The semiconductor device according to claim 1 , wherein said trench isolation oxide film has such a contour shape that said upper edge portion projects into the surface of said SOI layer in the form of a bird's beak.
Claim 4
Dependent Claim
56 words
The semiconductor device according to claim 1 , wherein said trench isolation oxide film has different shapes on the left and right sides in its brachydirectional section, and combinationally includes: a full trench structure reaching said buried oxide film through said SOI layer, and a partial trench structure having said SOI layer on its lower portion.
Claim 5
Dependent Claim
93 words
The semiconductor device according to claim 2 , wherein the height of a protrusion on a base portion of said upper edge portion projecting in the form of said bird's beak on the side of a full trench structure reaching said buried oxide film through said SOI layer is relatively small, and the height of a protrusion on a base portion of said upper edge portion projecting in the form of said bird's beak on the side of a partial trench structure having said SOI layer on its lower portion is relatively large.
Claim 6
Dependent Claim
79 words
The semiconductor device according to claim 2 , wherein the length of said upper edge portion projecting in the form of said bird's beak on the side of a full trench structure reaching said buried oxide film through said SOI layer is relatively large, and the length of said upper edge portion projecting in the form of said bird's beak on the side of a partial trench structure having said SOI layer on its lower portion is relatively small.
Claim 7
Dependent Claim
91 words
The semiconductor device according to claim 5 , wherein said trench isolation oxide film has different contour shapes of a base portion of said upper edge portion projecting in the form of said bird's beak on the side of said partial trench structure between a first inclined portion along a direction separating from said SOI layer and a second inclined portion directed toward said SOI layer, said first inclined portion has a substantially linear contour shape, and said second inclined portion has a contour shape roundedly projecting toward said SOI layer.
Claim 8
Dependent Claim
95 words
The semiconductor device according to claim 5 , wherein said trench isolation oxide film has different contour shapes of a base portion of said upper edge portion projecting in the form of said bird's beak on the side of said partial trench structure between a first inclined portion along a direction separating from said SOI layer and a second inclined portion directed toward said SOI layer, said first inclined portion has a contour shape roundedly depressed toward said SOI layer, and said second inclined portion has a contour shape roundedly projecting toward said SOI layer.
Claim 9
Dependent Claim
34 words
The semiconductor device according to claim 1 , wherein said trench isolation oxide film has such a contour shape that its lower edge portion projects between said SOI layer and said buried oxide film.