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US6462976B1 Expired / Lapsed US ⏱️ 0.0 years remaining

Conversion of electrical energy from one form to another, and its management through multichip module structures

Assignee: University of Arkansas at Fayetteville
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Filing: 2000-03-02
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Granted: 2002-10-08
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Expires: 2020-03-02
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Abstract

Abstract The design and fabrication of a highly integrated, intelligent integral horsepower, three-phase induction motor drive is based on multichip module (MCM) technology. A conventional three-phase induction motor is transformed into a stand-alone variable-speed drive by way of MCM technology. This solid-state controller-known as a multichip power module (MCPM)-uses known good die (KGD) to obtain minimal footprint, volume, and mass, while maximizing efficiency, reliability, and manufacturability. This is done by integrating the low-power control and high-power sections onto a single substrate. In accordance with one embodiment of the present invention, an integrated circuit assembly formed on a single substrate is capable of transforming and controlling AC power input to DC power output responsive to input signals. In accordance with another embodiment, an integrated circuit assembly on a single substrate is capable of receiving direct current power and controlling it and transforming it to alternating current power in single phase or multiphase form having variable magnitude and/or variable frequency. In accordance with a further embodiment, an integrated circuit assembly on a single substrate is capable of receiving alternating current power and controlling it and transforming it to alternating current power in single phase or multiphase form having variable magnitude and/or variable frequency.

Inventors

  • 👤 Kraig J. Olejniczak
  • 👤 Keith C. Burgers
  • 👤 Simon S. Ang
  • 👤 Errol V Porter

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 21:42
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/614; H02; H02M; H02M1/00; H02M7/00; H02M7/003; H10W72/00; H10W90/00; H10W90/20; H10W90/293; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0263; H05K1/16; H05K1/165; H05K3/00; H05K3/46; H05K3/4644; H10P; H10P72/00; H10P72/70; H10P72/74; H10P72/7424

Claims Analysis

Total Claims: 9
Claim 1
Independent Claim 99 words
A single substrate solid-state multichip power module or controller for converting a conventional three-phase induction motor into a stand-alone variable-speed drive, comprising: on a single substrate a front-end rectifier; a dynamic brake; a link between the front-end rectifier and dynamic brake; an inverter bridge; a low voltage power supply; drivers; controller memory software; communications subcircuits; wherein said module integrates low-power control and high-power sections onto a single silicon substrate; and, wherein said module is an MCPM module constructed to fit into the space provided for cable entry into a motor or a modified junction box fixed in this position.
Claim 2
Dependent Claim 99 words
A single substrate solid-state multichip power module or controller for converting a conventional three-phase induction motor into a stand-alone variable-speed drive, comprising: on a single substrate a front-end rectifier; a dynamic brake; a link between the front-end rectifier and dynamic brake; an inverter bridge; a low voltage power supply; drivers; controller memory software; communications subcircuits; wherein said module integrates low-power control and high-power sections onto a single silicon substrate; and, wherein said module is an MCPM module constructed to fit into the space provided for cable entry into a motor or a modified junction box fixed in this position.
Claim 3
Dependent Claim 27 words
The power module as recited in claim 1 , wherein external components including a dc-link capacitor and low-voltage power supply are also mounted within the junction box.
Claim 4
Dependent Claim 100 words
A single substrate solid-state multichip power module or controller for converting a conventional three-phase induction motor into a stand-alone variable-speed drive, comprising: on a flexible single substrate a front-end rectifier; a dynamic brake; a link between the frontend rectifier and dynamic brake; an inverter bridge; a low voltage power supply; drivers; controller memory software; communications subcircuits; wherein said module integrates low-power control and high-power sections onto a single silicon substrate; and, wherein said module is an MCPM module constructed to fit into the space provided for cable entry into a motor or a modified junction box fixed in this position.
Claim 5
Dependent Claim 100 words
A single substrate solid-state multichip power module or controller for converting a conventional three-phase induction motor into a stand-alone variable-speed drive, comprising: on a flexible single substrate a front-end rectifier; a dynamic brake; a link between the frontend rectifier and dynamic brake; an inverter bridge; a low voltage power supply; drivers; controller memory software; communications subcircuits; wherein said module integrates low-power control and high-power sections onto a single silicon substrate; and, wherein said module is an MCPM module constructed to fit into the space provided for cable entry into a motor or a modified junction box fixed in this position.
Claim 6
Dependent Claim 27 words
The power module as recited in claim 3 , wherein external components including a dc-link capacitor and low-voltage power supply are also mounted within the junction box.
Claim 7
Dependent Claim 103 words
A single substrate solid-state multichip power module or controller for converting a conventional three-phase induction motor into a stand-alone variable-speed drive, comprising: on a single flexible substrate a front-end rectifier; a dynamic brake; a link between the front-end rectifier and dynamic brake; an inverter bridge; a low voltage power supply; drivers; an isolation transformer; controller memory software; communications subcircuits; wherein said module integrates low-power control and high-power sections onto a single silicon substrate; and, wherein said module is an MCPM module constructed to fit into the space provided for cable entry into a motor or a modified junction box fixed in this position.
Claim 8
Dependent Claim 103 words
A single substrate solid-state multichip power module or controller for converting a conventional three-phase induction motor into a stand-alone variable-speed drive, comprising: on a single flexible substrate a front-end rectifier; a dynamic brake; a link between the front-end rectifier and dynamic brake; an inverter bridge; a low voltage power supply; drivers; an isolation transformer; controller memory software; communications subcircuits; wherein said module integrates low-power control and high-power sections onto a single silicon substrate; and, wherein said module is an MCPM module constructed to fit into the space provided for cable entry into a motor or a modified junction box fixed in this position.
Claim 9
Dependent Claim 27 words
The power module as recited in claim 5 , wherein external components including a dc-link capacitor and low-voltage power supply are also mounted within the junction box.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2005-10-07 2006-04-08 2006-10-08 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2009-10-07 2010-04-08 2010-10-08 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2013-10-07 2014-04-08 2014-10-08 $7700.00 Window Closed / Lapsed

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