US5384691A
Expired / Lapsed
US
⏱️ 0.0 years remaining
High density interconnect multi-chip modules including embedded distributed power supply elements
Assignee: Lockheed Martin Corp
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Filing: 1993-01-08
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Granted: 1995-01-24
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Expires: 2013-01-08
Abstract
Abstract By employing High Density Interconnect (HDI) multi-chip modules (MCMs) having elements of a distributed power supply embedded in the MCM itself, the functions of an MCM and a power converter are combined. The embedded power supply elements include DC-DC or AC-DC converters to convert an input voltage and input current to a relatively lower output voltage and relatively higher output current, thereby decreasing the current requirements of external power supply lines connected to the multi-chip module. The current and voltage outputs may be connected to chip power inputs through relatively short, low-impedance power distribution conductors comprising copper strips direct bonded to a ceramic substrate; alternatively, or in combination with direct bonded copper conductors, the low-impedance power distribution conductors may be situated within an HDI overcoat structure. The power supply elements may be placed within cavities formed in the substrate, or on a thinner portion of the substrate. The power supply may also provide multiple output voltages.
Inventors
- 👤 Constantine A. Neugebauer, deceased
- 👤 Charles S. Korman
- 👤 David A. Bates
- 👤 William H. Bicknell
- 👤 Wolfgang Daum
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 12:42
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/614; H10W72/00; H10W70/099; H10W70/67; H10W70/68; H10W70/682; H10W72/851; H10W72/874; H10W90/00; H10W90/10; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
161 words
A high density interconnect multi-chip module comprising: a substrate including at least one cavity for receiving components; a plurality of integrated circuit chips disposed in a cavity within said substrate such that major surfaces of said chips are substantially coplanar with portions of said substrate surrounding said cavity, each of said chips having an input for power; a power supply disposed in a cavity within said substrate, said power supply having a power supply input and at least one power supply output, and including components for converting an input voltage and an input current to a relatively lower output voltage and a relatively higher output current; a multilayer interconnect structure including interleaved layers of dielectric material and conductive material disposed over said integrated circuit chips and establishing connections to said power supply components; means for supplying voltage and current to said power supply input from an external source; and low-impedance conductors connecting said power supply output to said chip power inputs.
Claim 2
Dependent Claim
161 words
A high density interconnect multi-chip module comprising: a substrate including at least one cavity for receiving components; a plurality of integrated circuit chips disposed in a cavity within said substrate such that major surfaces of said chips are substantially coplanar with portions of said substrate surrounding said cavity, each of said chips having an input for power; a power supply disposed in a cavity within said substrate, said power supply having a power supply input and at least one power supply output, and including components for converting an input voltage and an input current to a relatively lower output voltage and a relatively higher output current; a multilayer interconnect structure including interleaved layers of dielectric material and conductive material disposed over said integrated circuit chips and establishing connections to said power supply components; means for supplying voltage and current to said power supply input from an external source; and low-impedance conductors connecting said power supply output to said chip power inputs.
Claim 3
Dependent Claim
23 words
A high density interconnect multi-chip module in accordance with claim 1, wherein said power supply elements include a plurality of power supply outputs.
Claim 4
Dependent Claim
22 words
A high density interconnect multi-chip module in accordance with claim 1, wherein said low-impedance conductors comprise copper strips bonded to said substrate.
Claim 5
Dependent Claim
21 words
A high density interconnect multi-chip module in accordance with claim 3, wherein said copper strips are direct bonded to said substrate.
Claim 6
Dependent Claim
22 words
A high density interconnect multi-chip module in accordance with claim 1, wherein said low-impedance conductors are included within said multilayer interconnect structure.
Claim 7
Dependent Claim
22 words
A high density interconnect multi-chip module in accordance with claim 3, wherein said low-impedance conductors are included within said multilayer interconnect structure.
Claim 8
Dependent Claim
135 words
A high density interconnect multi-chip module in accordance with claim 1, wherein said multi-chip module further comprises: said power supply having a power component portion having power-handling components mounted thereon and a control element portion having control elements mounted thereon and copper strip conductors bonded at least to said substrate in a pattern for establishing electrical connections, said power-handling components being electrically connected to said copper strip conductors; and where said interleaved layers of said multilayer interconnect structure being disposed over control elements and over at least portions of said copper strip conductors for establishing electrical connections between said power handling components and said control elements in a manner to enable said power supply to convert an input voltage and an input current to a relatively lower output voltage and a relatively higher output current.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1998-01-23 | 1998-07-25 | 1999-01-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2002-01-23 | 2002-07-25 | 2003-01-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2006-01-23 | 2006-07-25 | 2007-01-24 | $7700.00 | Window Closed / Lapsed |