Patent US6429532B1 successfully refreshed from Google Patents.
US6429532B1
Expired / Lapsed
US
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Pad design
Assignee: United Microelectronics Corp
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Filing: 2000-05-09
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Granted: 2002-08-06
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Expires: 2020-05-09
Abstract
Abstract A pad design. The pad design provides an additional testing pad that is electrically connected to a conventional bonding pad and positioned beside the bonding pad. The conventional bonding pad is formed on a provided chip, and a bump is formed on the bonding pad. A final test is performed on the testing pad so that damage formed on the bump or on the bonding pad can be prevented.
Inventors
- 👤 Charlie Han
- 👤 Kai-Kuang Ho
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-10 02:05
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/20; H10P; H10P74/00; H10P74/27; H10P74/273; H10W72/01; H10W72/019; H10W72/221; H10W72/251; H10W72/29; H10W72/90; H10W72/941; H10W72/9415; H10W72/942
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
68 words
A pad design, comprising: a chip, having at least a bonding pad on an active surface of the chip; a protecting film over the active surface of the chip, exposing at least two different portions of the bonding pad; and a bump formed on one of the exposed portions of the bonding pad, with the other exposed portion of the bonding pad being used as a testing pad.
Claim 2
Dependent Claim
68 words
A pad design, comprising: a chip, having at least a bonding pad on an active surface of the chip; a protecting film over the active surface of the chip, exposing at least two different portions of the bonding pad; and a bump formed on one of the exposed portions of the bonding pad, with the other exposed portion of the bonding pad being used as a testing pad.
Claim 3
Dependent Claim
17 words
The pad design according to claim 1 , wherein a material of the bonding pad comprises aluminum.
Claim 4
Dependent Claim
16 words
The pad design according to claim 1 , wherein a material of the bump comprises copper.
Claim 5
Dependent Claim
54 words
The pad design according to claim 1 , wherein the chip comprises a plurality of bonding pads, and a plurality of bumps and testing pads respectively formed on the bonding pads in a manner that the bumps are centrally arranged in array and the testing pads are distributed at a periphery of the chip.
Claim 6
Dependent Claim
24 words
The pad design according to claim 4 , wherein each of the bonding pad comprises a testing pad positioned beside each of the bumps.
Claim 7
Dependent Claim
83 words
A pad design, comprising: a chip, having at least a bonding pad on an active surface of the chip; a redistributed layer formed on the active surface of the chip, wherein a portion of the redistributed layer electrically contacts the bonding pad; a protecting layer, exposing a first region and a second region of the redistributed layer; and a bump positioned on the first region of the redistributed layer, and the second region of the redistributed layer is used as a testing pad.
Claim 8
Dependent Claim
83 words
A pad design, comprising: a chip, having at least a bonding pad on an active surface of the chip; a redistributed layer formed on the active surface of the chip, wherein a portion of the redistributed layer electrically contacts the bonding pad; a protecting layer, exposing a first region and a second region of the redistributed layer; and a bump positioned on the first region of the redistributed layer, and the second region of the redistributed layer is used as a testing pad.
Claim 9
Dependent Claim
16 words
The pad design according to claim 6 , wherein a material of the bump comprises copper.
Claim 10
Dependent Claim
28 words
The pad design according to claim 6 , wherein a thickness of the redistributed layer between the first region and the second region is less than 10 μm.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-08-05 | 2006-02-04 | 2006-08-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-08-05 | 2010-02-04 | 2010-08-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-08-05 | 2014-02-04 | 2014-08-06 | $7700.00 | Window Closed / Lapsed |