Patent US3515384A successfully refreshed from Google Patents.
Patent US6410355B1 successfully refreshed from Google Patents.
US6410355B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor package using terminals formed on a conductive layer of a circuit board
Assignee: SanDisk Technologies LLC
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Filing: 2000-01-19
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Granted: 2002-06-25
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Expires: 2020-01-19
Abstract
Abstract A small package is provided for a flash EEPROM memory. The small package uses terminals which are part of a bottom conductive layer of a circuit board. In this manner, the final package can be quite thin. The circuit board can be connected to the integrated circuits and passive devices and can be encapsulated in plastic or glued to a plastic cover. In this manner, a thin and relatively inexpensive package can be formed. Additionally, the circuit board can have testing connections which can be removed before forming the final package.
Inventors
- 👤 Robert F. Wallace
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 22:20
CPC Classifications
G; G11; G11C; G11C5/00; G11C5/06; G11C29/00; G11C29/04; G11C29/08; G11C29/12; G11C29/1201; G11C29/48; G11C5/02; G11C5/04; H; H05; H05K; H05K1/00; H05K1/02; H05K1/0266; H05K1/0268; H05K1/11; H05K1/117; H05K3/00; H05K3/22; H05K3/28; H05K3/284; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/699; H10W74/00; H10W74/01; H10W74/016; H10W74/10; H10W74/111; H10W76/00; H10W76/40; H10W76/42; H10W76/47; H10W90/00; G11C16/00; G11C16/02; G11C16/04; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09127; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K2201/20; H05K2201/2018; H05K3/0011; H05K3/0044; H05K3/0052; H10W72/00; H10W72/20; H10W72/30
Claims Analysis
Total Claims: 30
Claim 1
Independent Claim
89 words
A method of making a memory card comprising: attaching a set of circuit elements to a circuit board, the set of circuit elements including at least one integrated circuit and passive components, the circuit board having test connections and terminals on one end of the circuit board, the test connections being connected to test the set of circuit elements; testing the set of circuit elements using the test connections; thereafter, severing the end of the circuit board having the test connections and terminals; and thereafter, packaging the circuit board.
Claim 2
Independent Claim
89 words
A method of making a memory card comprising: attaching a set of circuit elements to a circuit board, the set of circuit elements including at least one integrated circuit and passive components, the circuit board having test connections and terminals on one end of the circuit board, the test connections being connected to test the set of circuit elements; testing the set of circuit elements using the test connections; thereafter, severing the end of the circuit board having the test connections and terminals; and thereafter, packaging the circuit board.
Claim 3
Dependent Claim
18 words
The method of claim 1 , wherein the terminals are positioned on a face of the circuit board.
Claim 4
Dependent Claim
23 words
The method of claim 2 , wherein the package is such that the face of the circuit board having the terminals is exposed.
Claim 5
Dependent Claim
13 words
The method of claim 1 , wherein the testing includes a burn-in testing.
Claim 6
Dependent Claim
17 words
The method of claim 1 , further comprising mapping out bad memory cells using the test connections.
Claim 7
Independent Claim
121 words
A method of making a memory card comprising: forming contacts on a first face of a circuit board wherein the contacts are the only circuit element on the first face; attaching a set of circuit elements comprising at least one integrated circuit including flash memory, circuit traces, and passive components to a second face of the circuit board; forming vias through the circuit board wherein the vias connect the set of circuit elements on the second face to the contacts on the first face; forming a one piece cover over the second face and edges of the circuit board, such that the first face of the circuit board is exposed to form substantially all of a face of the memory card.
Claim 8
Independent Claim
121 words
A method of making a memory card comprising: forming contacts on a first face of a circuit board wherein the contacts are the only circuit element on the first face; attaching a set of circuit elements comprising at least one integrated circuit including flash memory, circuit traces, and passive components to a second face of the circuit board; forming vias through the circuit board wherein the vias connect the set of circuit elements on the second face to the contacts on the first face; forming a one piece cover over the second face and edges of the circuit board, such that the first face of the circuit board is exposed to form substantially all of a face of the memory card.
Claim 9
Dependent Claim
16 words
The method of claim 6 wherein the step of forming the one piece cover comprises encapsulation.
Claim 10
Dependent Claim
19 words
The method of claim 6 wherein the step of forming the cover comprises attaching a plastic one piece cover.
Claim 11
Independent Claim
152 words
A method of making a memory card comprising: forming a first conductive layer on a first face of a circuit board; removing the first conductive layer except for a row of terminals spaced away from the edge of the circuit board; forming a second conductive layer on a second face of a circuit board; removing the second layer except for a set of circuit traces and a group of testing leads located at a first end of the circuit board; connecting the circuit traces on the second face of the circuit board by vias to the row of terminals on the first face of the circuit board; attaching a set of circuit elements to the circuit traces on the second face of the board; testing the board; and thereafter removing the first end of the board with the group of testing leads; and thereafter covering the second face of the circuit board.
Claim 12
Independent Claim
152 words
A method of making a memory card comprising: forming a first conductive layer on a first face of a circuit board; removing the first conductive layer except for a row of terminals spaced away from the edge of the circuit board; forming a second conductive layer on a second face of a circuit board; removing the second layer except for a set of circuit traces and a group of testing leads located at a first end of the circuit board; connecting the circuit traces on the second face of the circuit board by vias to the row of terminals on the first face of the circuit board; attaching a set of circuit elements to the circuit traces on the second face of the board; testing the board; and thereafter removing the first end of the board with the group of testing leads; and thereafter covering the second face of the circuit board.
Claim 13
Dependent Claim
19 words
The method of claim 6 further comprising encapsulating the at least one integrated circuit prior to forming the cover.
Claim 14
Dependent Claim
39 words
The method of claim 10 wherein the encapsulating of the at least one integrated circuit is performed at a lower temperature than when forming the cover, thereby protecting the at least one integrated circuit from subsequent high temperature molding.
Claim 15
Dependent Claim
17 words
The method of claim 10 wherein the passive components are not encapsulated prior to forming the cover.
Claim 16
Dependent Claim
19 words
The method of claim 10 , wherein the encapsulation includes placing plastic into a mold containing the circuit board.
Claim 17
Dependent Claim
13 words
The method of claim 10 , wherein the encapsulation includes clamping over terminals.
Claim 18
Dependent Claim
25 words
The method of claim 10 , wherein the encapsulation includes putting plastic into a mold with multiple chambers, each chamber having a different circuit board.
Claim 19
Dependent Claim
28 words
The method of claim 6 , wherein the passive components are capacitors used to covert the supplied voltage to the larger voltage required to modify the flash memory.
Claim 20
Independent Claim
182 words
A method of making a memory card comprising: forming a first conductive layer on a first face of a circuit board; removing the first conductive layer except for a plurality of terminals spaced away from the edge of the circuit board; forming a second conductive layer on a second face of a circuit board; removing the second layer except for a set of circuit traces and a group of testing leads located at a first portion of the circuit board; connecting the circuit traces on the second face of the circuit board by vias to the row of terminals on the first face of the circuit board; attaching a set of circuit elements comprising at least one integrated circuit including flash memory, circuit traces, and passive components to a second face of the circuit board; encapsulating the integrated circuit; testing the memory card by connecting with the testing leads at the first portion of the circuit board; and thereafter removing the first portion of the board with the group of testing leads; and thereafter covering the second face of the circuit board.
Claim 21
Independent Claim
182 words
A method of making a memory card comprising: forming a first conductive layer on a first face of a circuit board; removing the first conductive layer except for a plurality of terminals spaced away from the edge of the circuit board; forming a second conductive layer on a second face of a circuit board; removing the second layer except for a set of circuit traces and a group of testing leads located at a first portion of the circuit board; connecting the circuit traces on the second face of the circuit board by vias to the row of terminals on the first face of the circuit board; attaching a set of circuit elements comprising at least one integrated circuit including flash memory, circuit traces, and passive components to a second face of the circuit board; encapsulating the integrated circuit; testing the memory card by connecting with the testing leads at the first portion of the circuit board; and thereafter removing the first portion of the board with the group of testing leads; and thereafter covering the second face of the circuit board.
Claim 22
Dependent Claim
19 words
The method of claim 17 , wherein testing the board comprises mapping the memory cells of the integrated circuit.
Claim 23
Dependent Claim
17 words
The method of claim 17 , wherein testing the memory card comprises mapping out defective memory cells.
Claim 24
Dependent Claim
17 words
The method of claim 17 wherein when encapsulating the integrated circuit the passive components are not encapsulated.
Claim 25
Dependent Claim
18 words
The method of claim 17 , wherein connecting to the test leads is done via a removable connector.
Claim 26
Dependent Claim
19 words
The method of claim 17 wherein covering the second face further comprises covering the edges of the circuit board.
Claim 27
Dependent Claim
17 words
The method of claim 17 wherein covering the second face comprises attaching a plastic one piece cover.
Claim 28
Dependent Claim
19 words
The method of claim 17 wherein covering the second face comprises encapsulating the second face of the circuit board.
Claim 29
Dependent Claim
13 words
The method of claim 24 wherein the encapsulation is within a border frame.
Claim 30
Dependent Claim
22 words
The method of claim 17 wherein the act of covering the second face further comprises covering the edges of the circuit board.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2005-06-24 | 2005-12-24 | 2006-06-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2009-06-24 | 2009-12-24 | 2010-06-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2013-06-24 | 2013-12-24 | 2014-06-25 | $7700.00 | Window Closed / Lapsed |