US5493151A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device, lead frame and method for manufacturing semiconductor devices
Assignee: Toshiba Corp
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Filing: 1995-06-07
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Granted: 1996-02-20
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Expires: 2015-06-07
Abstract
Abstract Outer leads are buried in a package. At least the contact portions of the outer leads which are connected to a circuit board are exposed from the package and the exposed portions make the same flat surfaces as the package surface. When forming the package, the outer leads are used as the side wall of a mold forming mold, and therefore, they are formed thicker than inner leads inside the package. Thus, the package thickness can be made equal to the thickness of the outer leads.
Inventors
- 👤 Junichi Asada
- 👤 Masahiko Hori
- 👤 Shinji Takei
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 18:27
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; H10W70/00; H10W70/01; H10W70/04; H10W70/40; H10W70/411; H10W70/421; H10W70/424; H10W70/442; H10W74/10; H10W74/111; H10W90/00; H10W90/811; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
69 words
A semiconductor device comprising: a semiconductor chip; an insulating package covering said semiconductor chip; inner leads electrically connected to said semiconductor chip, covered with said package, and having a height; and outer leads, integrally formed with said inner leads, having surfaces substantially flush with upper, bottom, and side surfaces of said insulating package and partly exposed from said insulating package, and having a height greater than said inner leads.
Claim 2
Dependent Claim
69 words
A semiconductor device comprising: a semiconductor chip; an insulating package covering said semiconductor chip; inner leads electrically connected to said semiconductor chip, covered with said package, and having a height; and outer leads, integrally formed with said inner leads, having surfaces substantially flush with upper, bottom, and side surfaces of said insulating package and partly exposed from said insulating package, and having a height greater than said inner leads.
Claim 3
Dependent Claim
21 words
A semiconductor device according to claim 1, wherein said outer leads extend in upward and downward directions from said inner leads.
Claim 4
Dependent Claim
134 words
A lead frame comprising: frame portions; tie bars separately disposed and connecting said frame portions to one another; a chip mounting portion disposed in an area defined by said frame portions and said tie bars; a chip mounting portion supporting member for connecting said chip mounting portion to said frame portions to support said chip mounting portion; outer leads extending in a direction from said tie bars towards said chip mounting portion; and inner leads connected at one end to said outer leads and disposed at the outer end near said chip mounting portion; wherein the height of said chip mounting portion and inner leads is less than that of said outer leads, tie bars, and frame portions and the height of said outer leads, tie bars, and frame portions is substantially the same.
Claim 5
Dependent Claim
134 words
A lead frame comprising: frame portions; tie bars separately disposed and connecting said frame portions to one another; a chip mounting portion disposed in an area defined by said frame portions and said tie bars; a chip mounting portion supporting member for connecting said chip mounting portion to said frame portions to support said chip mounting portion; outer leads extending in a direction from said tie bars towards said chip mounting portion; and inner leads connected at one end to said outer leads and disposed at the outer end near said chip mounting portion; wherein the height of said chip mounting portion and inner leads is less than that of said outer leads, tie bars, and frame portions and the height of said outer leads, tie bars, and frame portions is substantially the same.
Claim 6
Dependent Claim
70 words
A lead frame according to claim 3, wherein said lead frame is formed by combining upper and lower lead frames of uniform height, each including said tie bars, frame portions, part of said chip mounting portion supporting member, and outer leads with the upper and lower surfaces of a main frame of uniform height including said tie bars, frame portions, chip mounting portion supporting member, outer leads, and inner leads.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1999-02-19 | 1999-08-21 | 2000-02-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2003-02-19 | 2003-08-21 | 2004-02-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2007-02-19 | 2007-08-21 | 2008-02-20 | $7700.00 | Window Closed / Lapsed |