US5134458A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Long size lead frame for semiconductor elements
Assignee: Mitsubishi Electric Corp
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Filing: 1991-11-05
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Granted: 1992-07-28
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Expires: 2011-11-05
Abstract
Abstract An upper seal block of a cope and a lower seal block of a drag are provided with sealants for nipping a portion of a long size lead frame, so that of a cavity enclosed with the cope and drag can be completely kept airtight. The long size lead frame may have a continuing part extending from one of two side members to the other, provided between adjacent lead patterns to be pressed by the sealants, so that the cavity can be further completely kept airtight.
Inventors
- 👤 Yasutsugu Tsutsumi
- 👤 Sueyoshi Tanaka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 20:37
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; B; B29; B29C; B29C45/00; B29C45/14; B29C45/14639; B29C45/14655
Claims Analysis
Total Claims: 3
Claim 1
Independent Claim
153 words
A long size lead frame having semiconductor elements mounted thereon to be sealed with resin by using a vacuum type resin-sealing apparatus having a cope and a drag, wherein said long size lead frame is larger in length than said cope and drag, comprising: two stripe side members extending in parallel at a distance; a plurality of lead patterns arranged between said side members at regular intervals, each said lead pattern having an element mounting pad for mounting thereon each said semiconductor element and inner leads disposed around said element mounting pad; a continuing part continuously extending from one of said side members to the other, provided between adjacent said lead patterns to be pressed by sealing means provided on said cope and drag of said vacuum type resin-sealing apparatus; and a sealant provided on said continuing part continuously from one end of said continuing part to another end of said continuing part.
Claim 2
Dependent Claim
153 words
A long size lead frame having semiconductor elements mounted thereon to be sealed with resin by using a vacuum type resin-sealing apparatus having a cope and a drag, wherein said long size lead frame is larger in length than said cope and drag, comprising: two stripe side members extending in parallel at a distance; a plurality of lead patterns arranged between said side members at regular intervals, each said lead pattern having an element mounting pad for mounting thereon each said semiconductor element and inner leads disposed around said element mounting pad; a continuing part continuously extending from one of said side members to the other, provided between adjacent said lead patterns to be pressed by sealing means provided on said cope and drag of said vacuum type resin-sealing apparatus; and a sealant provided on said continuing part continuously from one end of said continuing part to another end of said continuing part.
Claim 3
Dependent Claim
20 words
A long size lead frame in accordance with claim 1, wherein said continuing part includes a pair of continuing parts.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-07-28 | 1996-01-27 | 1996-07-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-07-28 | 2000-01-27 | 2000-07-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-07-28 | 2004-01-27 | 2004-07-28 | $7700.00 | Window Closed / Lapsed |