Lead frame for a semiconductor device and a method for manufacturing a semiconductor device using the lead frame

Claim 1

In a lead frame of a resin sealed type semiconductor device package wherein the lead frame includes a die pad disposed in a central portion thereof with an inner lead, a tie bar and an outer lead formed around the die pad with the tie bar disposed between the inner and outer lead, a chip mounted to the pad and wires connecting the chip to a metal plated surface of the inner lead, and molded resin material covering the chip and at least portions of said metal plated surface of the inner lead and the wires, the improvement comprising said molded resin material having at least a pair of border edges free of burs or bur residues and overlying a surface of the inner lead, said border edges free of burs or bur residues being formed by disposing a thin metal layer on predetermined surfaces of at least the inner lead with edges of said thin metal layer defining said border edges of resin material disposed to cover said chip and metal plated surface portions of the inner lead, with said thin metal layer having a melting temperature greater than the temperature of liquid resin material with said thin metal layer removed from the lead frame subsequent to solidification of the resin material.